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91. 发明专利

JPS6456643A ADDITION REACTION TYPE COMPOUND, PRODUCTION AND RELATED SUBSTANCE THEREOF 失效
公开(公告)号：JPS6456643A
公开(公告)日：1989-03-03
申请号：JP21269187
申请日：1987-08-28
申请人： HITACHI LTD
发明人： NISHIKAWA AKIO , KOYAMA TORU , ASANO HIDEKI , NARAHARA TOSHIKAZU
IPC分类号： C07C255/56 , C07C45/00 , C07C45/68 , C07C49/796 , C07C49/835 , C07C67/00 , C07C213/00 , C07C225/22 , C07C239/00 , C07C253/30 , C07C261/02 , C07C261/04 , C07D207/448 , C07D207/452 , C07D209/76 , C08F2/48 , C08F16/36 , C08F16/38 , C08F20/52 , C08F22/40 , C08F246/00 , G03F7/027 , G03F7/038
摘要： NEW MATERIAL:A bis-(benzoylethenyl)-benzene compound shown by formula I [X1 and X2 are -NH2, -NH-CidenticalN, OH, -C-CidenticalN, -CidenticalN, -CidenticalCH or group shown by formula II (D is group containing ethylenic unsaturated double bond); with the proviso that X1=X2not equal to -NH2]. EXAMPLE:A compound shown by formula III. USE:A compound for a resin composition. An intermediate useful for a photosensitive material and/or heat-resistant material, suitable as laminating material, molding material, coating compound and adhesive, readily crosslinked and cured by heat energy and/or light energy to give a cured polymer having excellent heat resistance and adhesiveness. PREPARATION:An acetophenone compound shown by formula V and/or formula VI is reacted with a phthalaldehyde compound such as terephthalaldehyde shown by formula IV in acetic acid solvent in the presence of a dehydrating catalyst of orthophosphoric acid to give a compound shown by formula I.

92. 发明专利

JPS63168908A PREPREG FOR COIL INSULATION 失效
公开(公告)号：JPS63168908A
公开(公告)日：1988-07-12
申请号：JP31016486
申请日：1986-12-29
申请人： HITACHI LTD
发明人： TOYODA SHINICHI , NISHIKAWA AKIO , KOYAMA TORU
IPC分类号： H01B3/40 , H01B17/60 , H01F41/12

93. 发明专利

JPS6357632A EPOXY RESIN COMPOSITION, SEMICONDUCTOR DEVICE SEALING AGENT AND MATERIAL FOR LAMINATE 失效
公开(公告)号：JPS6357632A
公开(公告)日：1988-03-12
申请号：JP20129386
申请日：1986-08-29
申请人： HITACHI LTD
发明人： NISHIKAWA AKIO , KOYAMA TORU
IPC分类号： B32B27/18 , B32B27/38 , C08G59/00 , C08G59/62 , C08L25/00 , C08L25/18 , C08L63/00
摘要： PURPOSE:To form an epoxy resin composition excellent in heat resistance, water absorptivity and moisture permeability, by mixing a polyepoxy compound with a specified fluorinated phenolic resin or a fluorinated hydroxy-styrene polymer. CONSTITUTION:This epoxy resin composition is prepared by mixing a polyepoxy resin [A] with a fluorinated phenol resin [B] composed of structural units of formula I or II and structural units of formula III or IV and a fluorinated hydroxystyrene polymer [C] comprising structural units of formulas V and VI. In the formulas I-VI, R', R'' and R''', which may be the same or different, are each a member selected from among F, CF3, C2F5 and C3F7, X1 and X3 are each H, -CH3, -C(CH3) or the like and X2 and X4 are each a group formula VII or the like.

94. 发明专利

JPS6333412A EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS6333412A
公开(公告)日：1988-02-13
申请号：JP17563186
申请日：1986-07-28
申请人： HITACHI LTD
发明人： NISHIKAWA AKIO , KOYAMA TORU
IPC分类号： C08G59/50 , C08G59/00 , C08G59/18 , C08G59/40 , C08K5/34 , C08L63/00 , H01L23/29 , H01L23/31
摘要： PURPOSE:To provide the titled resin composition containing a polyfunctional epoxy compound and a specific phthalocyanine tetramine compound, giving a cured material having excellent heat-resistance, moisture-resistance and corrosion resistance and suitable for semiconductor device. CONSTITUTION:The objective composition contains (A) a polyfunctional epoxy compound (e.g. bisphenol A diglycidyl ether) and (B) a 4,4',4'',4'''-phthalocyanine tetramine compound of formula (M is none, Cu, Pb, Fe, Ni or Co) (e.g. 4,4',4'',4'''-phthalocyanine tetramine copper). A semiconductor device is produced by sealing or covering at least a part of a semiconductor element with the composition.

95. 发明专利

JPS6317910A HEAT-RESISTANT RESIN COMPOSITION 失效
公开(公告)号：JPS6317910A
公开(公告)日：1988-01-25
申请号：JP16185786
申请日：1986-07-11
申请人： HITACHI LTD
发明人： NISHIKAWA AKIO , KOYAMA TORU , SUGANO SHU , TOYODA SHINICHI , SHIBATA NOBUO
IPC分类号： C08F22/40 , C08F20/52 , C08G73/12
摘要： PURPOSE:To provide the titled composition composed mainly of a tris(N- substituted maleimidophenyl)methane or its derivative, having excellent adhesivity as well as heat-resistance and suitable as a laminating material, molding material, adhesive, etc. CONSTITUTION:The objective composition can be produced by using a tris(N- substituted maleimidophenyl)methane of formula and/or its derivative as a main component and preferably adding a polymerization initiator such as benzoyl peroxide to the component. The composition may be further incorporated with a polymerization accelerator such as mercaptan, a polymerization inhibitor such as hydroquinone, inorganic filler, etc., according to the use. The compound of formula can be produced by the dehydrative cyclization reaction of tris(4-aminophenyl)methane and maleic anhydride.

96. 发明专利

JPS62297313A THERMOSETTING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE OBTAINED BY USING SAID COMPOSITION 失效
公开(公告)号：JPS62297313A
公开(公告)日：1987-12-24
申请号：JP14008986
申请日：1986-06-18
申请人： HITACHI LTD
发明人： NISHIKAWA AKIO , KOYAMA TORU
IPC分类号： C08K5/13 , C08G59/00 , C08G59/18 , C08L63/00
摘要： PURPOSE:The titled composition, containing pyrogallol, a polyfunctional epoxy resin and curing agent, useful as a corrosion-resistant coating material for metal and capable of providing a resin-sealed semiconductor device operable with high reliability even if the device is left to stand at high temperatures and humidities for a long period. CONSTITUTION:A fire-retardant composition having large corrosion-inhibiting effect to metals and containing (A) pyrogallol and/or pyrogallol derivatives (e.g. pyrogallol-acetone resin) in an amount of preferably 0.1-30wt% based on total resin composition, (B) a polyfunctional epoxy compound and (C) a curing agent (e.g. phenol-formalin condensate). A resin-sealed semiconductor device is obtained by sealing and/or coating a semiconductor device with the resin composition.

97. 发明专利

JPS6192141A Preparation of prepreg electric machine winding and electric machine winding utilizing the same 失效
标题翻译： PREPREG电机绕组的制备和使用电机的电机绕组
公开(公告)号：JPS6192141A
公开(公告)日：1986-05-10
申请号：JP21267884
申请日：1984-10-12
申请人： Hitachi Ltd
发明人： KOYAMA TORU , SUGANO SHU , KATAGIRI JUNICHI , WAJIMA MOTOYO , KANO YASUSHI
IPC分类号： H01F5/06 , H01B3/30 , H02K15/12
CPC分类号： H02K15/12
摘要： PURPOSE:To improve the workability and to obtain an electric machine winding having high heat resistance by impregnating thermally curable resin composition indispensably containing special 3 components in an insulating substrate to form a prepreg. CONSTITUTION:A thermally curable resin composition which contains at least three of (1) multifunctional maleimide, (2) one of alkenyl phenol and alkenyl phenol ether and (3) multivalency aryl carboxylate ester is produced, impregnated with an insulating substrate in a semicured state to form an electric winding prepreg. Such a thermal curable resin composition has a low viscosity to be readily worked before curing, and has high heat resistance after curing. Thus, an electric machine winding such as rotary electric machine having excellent characteristics can be obtained.
摘要翻译：目的：为了提高加工性，通过在绝缘基板中浸渍含有特殊的3成分的不可缺少的热固性树脂组合物来形成预浸料，从而获得具有高耐热性的电机绕组。构成：制备含有（1）多官能马来酰亚胺，（2）链烯基酚和烯基苯酚醚中的至少三种和（3）多价芳基羧酸酯酯的（3）多价芳基羧酸酯酯中的至少三种的热固化树脂组合物，其浸渍有半固化状态的绝缘基材以形成电绕组预浸料。这种热固性树脂组合物在固化前具有低粘度，容易加工，并且在固化后具有高的耐热性。因此，可以获得具有优异特性的诸如旋转电机的电机绕组。

98. 发明专利

JP2002105216A SOLID POLYMER ELECTROLYTE, ITS MEMBRANE, ITS SOLUTION FOR CATALYTIC COATING ELECTRODE, MEMBRANE/ELECTRODE BONDED MATERIAL USING IT AND FUEL CELL 失效
公开(公告)号：JP2002105216A
公开(公告)日：2002-04-10
申请号：JP2000301102
申请日：2000-09-29
申请人： HITACHI LTD
发明人： KOYAMA TORU , KOBAYASHI TOSHIYUKI , YAMAGA MASASHI , KAMO YUICHI , HIGASHIYAMA KAZUHISA
IPC分类号： C08J5/18 , H01M4/86 , H01M8/02 , H01M8/10
摘要： PROBLEM TO BE SOLVED: To provide a solid polymer electrolyte of high durability, and to provide having practically sufficient resistance to deterioration that is equal to or higher than a perfluorosulfonic acid membrane and easily manufactured its membrane, solution for catalytic coating electrode membrane/electrode bonded material using it and a fuel cell. SOLUTION: The solid polymer electrolyte, its membrane, a solution for catalytic coating electrode, a membrane/electrode bonded material using it and a fuel cell which have fluoro-polymer compounds containing a trifluoroethylene structure unit by changing a chlor group to a sulfonic acid group are provided.

99. 发明专利

JP2000026578A EPOXY RESIN COMPOSITION 失效
公开(公告)号：JP2000026578A
公开(公告)日：2000-01-25
申请号：JP19838098
申请日：1998-07-14
申请人： HITACHI LTD
发明人： SUGAWARA TOSHIO , AMAGI SHIGEO , KOYAMA TORU , KANO YASUSHI , MARUYAMA SHOICHI , HARAGUCHI YOSHIHIRO
IPC分类号： C08G59/42 , C08G59/70
摘要： PROBLEM TO BE SOLVED: To provide an acid anhydride-curing type epoxy resin composition using a stable epoxy resin free from separation or precipitation of latent accelerating agent, Co(III)AA from an impregnating resin, not impairing the curing properties and enabling easy maintenance of the resin and the storage tank or the like. SOLUTION: In this acid anhydride-curing type epoxy resin composition which uses a metal acetylacetonate as a accelerating agent, an acid anhydride curing agent is compounded to an epoxy resin to form the one component resin composition after the accelerating agent is previously heated and dissolved in the epoxy resin. In this case, the metal acetylacetonate is cobalt (III) acetylacetonate and heated and dissolved at 80 to 120 deg.C to the epoxy resin, and the acid anhydride type curing agent is methylhexahydrophthalic acid anhydride.

100. 发明专利

JPH11349664A EPOXY RESIN COMPOSITION 失效
公开(公告)号：JPH11349664A
公开(公告)日：1999-12-21
申请号：JP16469198
申请日：1998-06-12
申请人： HITACHI LTD
发明人： SUGAWARA TOSHIO , KOYAMA TORU , AMAGI SHIGEO , KANO YASUSHI , MARUYAMA SHOICHI , HARAGUCHI YOSHIHIRO , AKATSUKA MASAKI
IPC分类号： C08G59/40 , C08G59/72
摘要： PROBLEM TO BE SOLVED: To obtain a composition having a low viscosity, a short curing time and a long pot life which are essential characteristics of a resin for impregnating an electric insulating coil or the like by specifying an initial viscosity and an increase in viscosity during storage of a one pack-type epoxy resin composition containing a latent curing agent. SOLUTION: This epoxy resin composition has an initial viscosity of not higher than 1 Pa.s at 25 deg.C and the viscosity reaches two times as high as the initial viscosity not earlier than 120 days when stored at 25 deg.C. Preferably, a liquid epoxy resin employed comprises a resorcinol type epoxy resin as an essential component and cures within 10 min at 150 deg.C. As a latent curing agent can be employed an aromatic sulfonium compound salt or a boron trichloride amine salt. The boron trichloride amine salt gives out an extremely irritating odor necessitating the use of a draft chamber when added to the resin and its dissolution in cresyl glycidyl ether in advance is preferable to destroy the irritating odor practically.

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