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    • 94. 发明授权
    • Synchronous type semiconductor memory device having internal operation
timings determined by count values of an internal counter
    • 具有由内部计数器的计数值确定的内部操作定时的同步型半导体存储器件
    • US5751655A
    • 1998-05-12
    • US788803
    • 1997-01-23
    • Akira YamazakiKatsumi Dosaka
    • Akira YamazakiKatsumi Dosaka
    • G11C11/407G06F13/16G11C7/22G11C8/00
    • G11C7/22G06F13/1689
    • A memory includes a counter by an operation mode designating command for counting a clock signal, and a circuit for generating an internal operation timing control signal according to the count value of the counter. Activation/inactivation of an internal operation control signal is done in synchronization with a clock signal. It is not necessary to take into consideration the margin with respect to an internal operation control signal. High speed operation can be carried out stably. By providing a signal indicating an internal operation state according to the count value of the counter, the load of an external memory controller for monitoring a command issue timing can be reduced. A high speed operating memory is provided that can reduce the load of a memory controller and that can set the internal operation timing accurately.
    • 存储器包括通过用于计数时钟信号的操作模式指定命令的计数器,以及根据计数器的计数值产生内部操作定时控制信号的电路。 内部操作控制信号的激活/失活与时钟信号同步完成。 不必考虑内部操作控制信号的余量。 高速运转可以稳定进行。 通过根据计数器的计数值提供指示内部操作状态的信号,可以减少用于监视命令发布定时的外部存储器控制器的负载。 提供了可以降低存储器控制器的负载并且可以精确地设置内部操作时序的高速操作存储器。
    • 95. 发明授权
    • Semiconductor memory device including a data transfer circuit for
transferring data between a DRAM and an SRAM
    • 半导体存储器件包括用于在DRAM和SRAM之间传送数据的数据传输电路
    • US5603009A
    • 1997-02-11
    • US356046
    • 1994-12-14
    • Yasuhiro KonishiKatsumi DosakaKouji HayanoMasaki KumanoyaAkira YamazakiHisashi Iwamoto
    • Yasuhiro KonishiKatsumi DosakaKouji HayanoMasaki KumanoyaAkira YamazakiHisashi Iwamoto
    • G06F12/08G11C7/10G11C11/00G06F13/00G11C11/34
    • G11C7/1006G06F12/0893G11C11/005G11C7/103G11C7/1045G11C2207/2254
    • A semiconductor memory device containing a cache includes a static random access memory (SRAM) as a cache memory, and a dynamic random access memory (DRAM) as a main memory. Collective transfer of data blocks is possible between the DRAM and the SRAM through a bi-directional data transfer gate circuit and through an internal data line. A DRAM row decoder and a DRAM column decoder are provided in the DRAM. A SRAM row decoder and an SRAM column decoder are provided in the SRAM. Addresses of the SRAM and DRAM can be independently applied. The data transfer gate includes a latch circuit for latching data from the SRAM, which serves as a high speed memory, an amplifier circuit and a gate circuit for amplifying data from the DRAM, which serves as a large capacity memory, and for transmitting the amplified data to the SRAM, and a gate circuit, responsive to a DRAM write enable signal for transmitting write data to corresponding memory cells of the DRAM. After the data of the SRAM has been latched by a latch circuit, write data is transmitted from the gate circuit to the DRAM, and the write data is transmitted to the SRAM through the amplifier circuit and the gate circuit.
    • 包含高速缓存的半导体存储器件包括作为高速缓冲存储器的静态随机存取存储器(SRAM)和作为主存储器的动态随机存取存储器(DRAM)。 通过双向数据传输门电路和内部数据线,可以在DRAM和SRAM之间进行数据块的集中传输。 在DRAM中提供DRAM行解码器和DRAM列解码器。 在SRAM中提供SRAM行解码器和SRAM列解码器。 SRAM和DRAM的地址可以独立应用。 数据传输门包括一个锁存电路,用于锁存来自用作高速存储器的SRAM的数据,放大器电路和用于放大来自DRAM的数据的门电路,其用作大容量存储器,并用于发送放大 数据到SRAM,以及门电路,响应于用于将写入数据发送到DRAM的相应存储器单元的DRAM写使能信号。 在SRAM的数据被锁存电路锁存之后,写入数据从门电路传输到DRAM,写数据通过放大电路和门电路传输到SRAM。
    • 96. 发明授权
    • Circuit having charge compensation and an operation method of the same
    • 具有电荷补偿的电路及其操作方法
    • US5151614A
    • 1992-09-29
    • US725037
    • 1991-07-03
    • Akira YamazakiMasaki KumanoyaYasuhiro KonishiKatsumi Dosaka
    • Akira YamazakiMasaki KumanoyaYasuhiro KonishiKatsumi Dosaka
    • H01L27/04H01L21/822H03K3/356H03K17/22
    • H03K3/356008H03K17/223H01L2924/0002
    • A residual charge removing circuit connected to a node in a power-on reset pulse generating circuit for removing positive charges which remain in this node when a power supply is turned off is disclosed. This residual charge removing circuit is formed of two N-channel MOS transistors connected in series between the node and the ground, and one capacitor. Out of the two N-channel MOS transistors, the transistor near the node has a grounded gate. The capacitor is connected between a gate of the transistor, out of the two N-channel MOS transistors, which is distant from the node, and a power supply. The gate of the transistor distant from the node is connected to a connection point between the two N-channel MOS transistors. Therefore, when a supply potential lowers below a threshold voltage Vth of the MOS transistors due to the power-off, the transistor distant from the node is turned off, so that a potential of the connection point becomes -Vth owing to a discharge of negative charges from the capacitor. This turns on the transistor near the node, so that the residual charges in the node are offset by the negative charges in the connection point.
    • 公开了一种连接到上电复位脉冲发生电路中的节点的剩余电荷去除电路,用于去除当电源关闭时保留在该节点中的正电荷。 该剩余电荷去除电路由串联在节点和地之间的两个N沟道MOS晶体管和一个电容器组成。 在两个N沟道MOS晶体管中,节点附近的晶体管具有接地栅极。 电容器连接在离节点的两个N沟道MOS晶体管中的晶体管的栅极和电源之间。 远离节点的晶体管的栅极连接到两个N沟道MOS晶体管之间的连接点。 因此,当电源电压由于断电而降低到MOS晶体管的阈值电压Vth以下时,远离节点的晶体管截止,使得由于放电为负的连接点的电位变为-Vth 从电容器充电。 这使得节点附近的晶体管导通,使得节点中的剩余电荷被连接点中的负电荷抵消。
    • 100. 发明授权
    • Semiconductor memory
    • 半导体存储器
    • US4692901A
    • 1987-09-08
    • US762632
    • 1985-08-05
    • Masaki KumanoyaKazuyasu FujishimaHideshi MiyatakeHideto HidakaKatsumi DosakaYasumasa Nishimura
    • Masaki KumanoyaKazuyasu FujishimaHideshi MiyatakeHideto HidakaKatsumi DosakaYasumasa Nishimura
    • G11C29/34G11C7/00
    • G11C29/34
    • A semiconductor memory comprises memory cells (15-18, 27-30), a data writing terminal (1), a data readout terminal (48), transistors (3-10, 35-42), address signal input terminals (23-26), subdecode signal input terminals (43-46), driving signal generating circuits (49-52), parallel readout circuits (79-82) and test mode switching signal input terminal (53, 88). In writing of function test data for the memory cells, the driving signal generating circuits turn all of the transistors (3-10) on in response to a test mode switching signal with no regard to address signals, thereby to simultaneously write data in the memory cells (15-18). Further, in readout of the function test data for the memory cells, the parallel readout circuits read the storage contents of the memory cells (27-30) storing the test data in response to a test mode switching signal with no regard to subdecode signals. Logic circuit means (90, 91, 94) may be provided to output logical value corresponding to the test data stored in the memory cells when all of the logical values of the test data are at the same level.
    • 半导体存储器包括存储单元(15-18,27-30),数据写入端(1),数据读出端(48),晶体管(3-10,35-42),地址信号输入端(23- 26),子代码信号输入端子(43-46),驱动信号发生电路(49-52),并行读出电路(79-82)和测试模式切换信号输入端子(53,88)。 在写入存储单元的功能测试数据时,驱动信号发生电路响应于测试模式切换信号而使所有晶体管(3-10)响应于地址信号,从而同时将数据写入存储器 细胞(15-18)。 此外,在读出存储单元的功能测试数据时,并行读出电路响应于不考虑子代码信号的测试模式切换信号读取存储测试数据的存储单元(27-30)的存储内容。 可以提供逻辑电路装置(90,91,94)以当测试数据的所有逻辑值处于相同电平时输出与存储在存储单元中的测试数据相对应的逻辑值。