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91. 发明授权

US07283358B2 Apparatus and method for facilitating cooling of an electronics rack by mixing cooler air flow with re-circulating air flow in a re-circulation region 有权
标题翻译：通过将冷却器空气流与再循环气流中的再循环空气流混合来促进电子机架的冷却的装置和方法
公开(公告)号：US07283358B2
公开(公告)日：2007-10-16
申请号：US11184524
申请日：2005-07-19
申请人： Levi A. Campbell , Ricahrd C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Ricahrd C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/20745 , F24F13/04 , H05K7/20736
摘要： Apparatus and method are provided for facilitating cooling of an electronics rack employing an air delivery structure coupled to the electronics rack. The air delivery structure delivers air flow at a location external to the electronics rack and in a direction to facilitate mixing thereof with re-circulating exhausted inlet-to-outlet air flow from the air outlet side of the electronics rack to the air inlet side thereof. The delivered air flow is cooler than the re-circulating exhausted inlet-to-outlet air flow and when mixed with the re-circulating air flow facilitates lowering air inlet temperature at a portion of the air inlet side of the electronics rack, thereby enhancing cooling of the electronics rack.
摘要翻译：提供了一种装置和方法，用于促进使用联接到电子机架的空气输送结构的电子机架的冷却。空气输送结构在电子机架外部的位置处和在促进其混合的方向上传送空气流，并且从电子机架的空气出口侧到其进气侧再循环排出的入口到出口空气流。输送的空气流比再循环排出的入口到出口空气流更冷，并且当与再循环空气流混合时，有助于降低电子机架的空气入口侧的一部分处的进气温度，从而增强冷却的电子机架。

92. 发明授权

US07233494B2 Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated manifold and a plurality of thermally conductive fins 有权
标题翻译：冷却装置，冷却电子模块及其采用集成歧管和多个导热翅片的制造方法
公开(公告)号：US07233494B2
公开(公告)日：2007-06-19
申请号：US11124064
申请日：2005-05-06
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The cooling apparatus includes a plurality of thermally conductive fins coupled to and projecting away from a surface to be cooled. The fins facilitate transfer of heat from the surface to be cooled. The apparatus further includes an integrated manifold having a plurality of inlet orifices for injecting coolant onto the surface to be cooled, and a plurality of outlet openings for exhausting coolant after impinging on the surface to be cooled. The inlet orifices and the outlet openings are interspersed in a common surface of the integrated manifold. Further, the integrated manifold and the surface to be cooled are disposed with the common surface of the manifold and the surface to be cooled in spaced, opposing relation, and with the plurality of thermally conductive fins disposed therebetween.
摘要翻译：提供冷却装置和制造方法以便于从发热电子装置中除去热量。冷却装置包括耦合到待冷却表面并远离待冷却表面的多个导热翅片。散热片有助于从要冷却的表面传递热量。该装置还包括具有多个用于将冷却剂喷射到待冷却表面上的入口孔的集成歧管，以及用于在撞击待冷却表面之后排出冷却剂的多个出口开口。入口孔和出口开口散布在集成歧管的共同表面中。此外，集成歧管和要冷却的表面与歧管的共同表面和待冷却的表面以间隔相对的关系设置，并且多个导热翅片设置在它们之间。

93. 发明授权

US07206203B2 Electronic device cooling assembly and method employing elastic support material holding a plurality of thermally conductive pins 失效
标题翻译：电子设备冷却组件和使用保持多个导热销的弹性支撑材料的方法
公开(公告)号：US07206203B2
公开(公告)日：2007-04-17
申请号：US10873432
申请日：2004-06-22
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons , Roger R. Schmidt
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons , Roger R. Schmidt
IPC分类号： H05K7/20 , H01L23/34 , H02G3/03 , F28F7/00
CPC分类号： H01L23/4336 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： An electronic device cooling assembly and fabrication method are provided which include a manifold with an orifice for injecting a cooling liquid onto a surface to be cooled, and an elastic pin support material with an opening aligned to the orifice of the manifold. Multiple thermally conductive pins are mounted within the support material, extending therefrom, and are sized to physically contact the surface to be cooled. The support material has a thickness and compliance which facilitates thermal interfacing of the pins to the surface by allowing second ends thereof to move vertically and tilt. The second end of each pin has a planar surface which is normal to an axis of the pin, and the support material facilitates the planar surfaces of the second pin ends establishing planar contact with the surface to be cooled, notwithstanding that the surface may be other than planar.
摘要翻译：提供了一种电子设备冷却组件和制造方法，其包括具有用于将冷却液体喷射到待冷却表面上的孔口的歧管以及具有与歧管孔口对准的开口的弹性销支撑材料。多个导热销安装在支撑材料内，从其延伸，并且其尺寸设计成物理接触要冷却的表面。支撑材料具有厚度和顺从性，其通过允许其第二端垂直移动和倾斜来促进销与表面的热接合。每个销的第二端具有垂直于销的轴线的平坦表面，并且支撑材料有助于第二销端的平面表面与待冷却的表面建立平面接触，尽管表面可以是其他比平面。

94. 发明授权

US07000467B2 Method, system and program product for monitoring rate of volume change of coolant within a cooling system 失效
标题翻译：用于监测冷却系统内冷却液体积变化率的方法，系统和程序产品
公开(公告)号：US07000467B2
公开(公告)日：2006-02-21
申请号：US10736947
申请日：2003-12-16
申请人： Richard C. Chu , Michael J. Ellsworth, Jr. , Roger R. Schmidt , Robert E. Simons , Randy J. Zoodsma
发明人： Richard C. Chu , Michael J. Ellsworth, Jr. , Roger R. Schmidt , Robert E. Simons , Randy J. Zoodsma
IPC分类号： G01F23/00
CPC分类号： H05K7/2079 , G01F1/007 , G01F23/18 , G01F23/74 , G06F1/20 , G06F1/206 , G06F2200/201
摘要： Method, system and program product are provided for monitoring coolant within a cooling system designed to provide system coolant to one or more electronics subsystems. The monitoring technique includes employing at least one pressure transducer to obtain multiple pressure measurements related to an amount of coolant within an expansion tank of the cooling system, and determining a rate of volume change of coolant within the expansion tank employing the multiple pressure measurements. Successive pressure measurements can be taken at a known time interval to determine the rate of volume change of coolant within the expansion tank. An automatic determination can also be made on the immediacy of action to be taken for service of the cooling system based on the rate of volume change of coolant within the expansion tank.
摘要翻译：提供了方法，系统和程序产品，用于在冷却系统内监测冷却系统，该冷却系统被设计成向一个或多个电子子系统提供系统冷却剂。监测技术包括采用至少一个压力传感器以获得与冷却系统的膨胀箱内的冷却剂量相关的多个压力测量，以及使用多个压力测量来确定膨胀罐内的冷却剂的体积变化率。可以在已知的时间间隔进行连续压力测量，以确定膨胀罐内冷却剂的体积变化率。还可以基于膨胀箱内的冷却剂的体积变化率，对冷却系统的服务的即时性进行自动确定。

95. 发明授权

US06819563B1 Method and system for cooling electronics racks using pre-cooled air 有权
标题翻译：使用预冷空气冷却电子机柜的方法和系统
公开(公告)号：US06819563B1
公开(公告)日：2004-11-16
申请号：US10612355
申请日：2003-07-02
申请人： Richard C. Chu , Michael J. Ellsworth, Jr. , Roger R. Schmidt , Robert E. Simons
发明人： Richard C. Chu , Michael J. Ellsworth, Jr. , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K720
CPC分类号： H05K7/20736 , G11B33/1406 , H05K7/20727 , H05K7/20772
摘要： Augmenting air cooling of electronics systems using a cooling fluid to cool air entering the electronics system, and to remove a portion of the heat dissipated by the electronics. A cooled electronics system includes a frame, electronics drawers, fans or air moving devices, and an inlet heat exchanger. A cooling fluid such as chilled water is supplied to the inlet heat exchanger, to cool incoming air below ambient temperature. Fans cause ambient air to enter the system, flow through the inlet heat exchanger, through electronic devices, and exit the system. An optional exhaust heat exchanger further transfers heat dissipated by electronic devices to the cooling fluid. Heat exchangers are pivotally mounted, providing drawer access. Segmented heat exchangers provide access to individual drawers. Heat exchangers are integrated into cover assemblies. Airflow guides such as louvers are provided at inlets and outlets. Cover assemblies provide a degree of acoustic and electromagnetic shielding.
摘要翻译：使用冷却流体增强电子系统的空气冷却，以冷却进入电子系统的空气，以及去除由电子设备消散的部分热量。冷却的电子系统包括框架，电子抽屉，风扇或空气移动装置以及入口热交换器。冷却流体如冷冻水被供应到入口热交换器，以将进入的空气冷却到低于环境温度。风扇会导致环境空气进入系统，流经入口热交换器，通过电子设备，并退出系统。可选的排气热交换器进一步将由电子设备耗散的热量传递给冷却流体。热交换器枢转安装，提供抽屉通道。分段热交换器提供对各个抽屉的访问。热交换器集成到盖组件中。入口和出口设有气流导板，如百叶窗。盖组件提供一定程度的声和电磁屏蔽。

96. 发明授权

US06639803B1 Compliant heat sink device/mounting system interconnect and a method of implementing same 有权
标题翻译：兼容的散热设备/安装系统互连及其实现方法
公开(公告)号：US06639803B1
公开(公告)日：2003-10-28
申请号：US10193534
申请日：2002-07-11
申请人： Joseph P. Corrado , Budy D. Notohardjono , Roger R. Schmidt
发明人： Joseph P. Corrado , Budy D. Notohardjono , Roger R. Schmidt
IPC分类号： H05K720
CPC分类号： H01L23/4006 , H01L23/3672 , H01L2023/4062 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： A heat sink device interconnect including a mounting device, having a mounting device top, a board stiffener, wherein the board stiffener is disposed so as to be communicated with the mounting device and a heat sink device compressingly disposed between the mounting device top and the board stiffener, wherein the heat sink device includes a top plate, a bottom plate and a heat sink fin compressingly disposed between the top plate and the bottom plate. A method for implementing a heat sink device interconnect including obtaining an electronic module, a printed circuit board and a heat sink device interconnect having a heat sink device, an interconnect device, a mounting device and a board stiffener, arranging the electronic module, the printed circuit board and the heat sink device interconnect such that the electronic module and the printed circuit board is disposed between the board stiffener and the heat sink device and adjusting the mounting device so as to cause the electronic module to become compressingly associated with the printed circuit board.
摘要翻译：一种散热装置互连件，包括具有安装装置顶部的安装装置，板加强件，其中所述板加强件设置成与所述安装装置连通，以及压缩地设置在所述安装装置顶部和所述板之间的散热装置加强件，其中所述散热装置包括压板地设置在所述顶板和所述底板之间的顶板，底板和散热片。一种用于实现散热装置互连的方法，包括获得电子模块，印刷电路板和具有散热装置的互连装置，互连装置，安装装置和板加强件，布置电子模块，印刷电路板和散热装置互连，使得电子模块和印刷电路板设置在板加强件和散热装置之间并调节安装装置，以使电子模块与印刷电路板压缩相关联。

97. 发明授权

US06262582B1 Mechanical fixture for holding electronic devices under test showing adjustments in multiple degrees of freedom 失效
标题翻译：用于保持被测电子设备的机械夹具显示多个自由度的调整
公开(公告)号：US06262582B1
公开(公告)日：2001-07-17
申请号：US09418655
申请日：1999-10-15
申请人： Dennis R. Barringer , Mark R. LaForce , Mark A. Marnell , Donald W. Porter , Roger R. Schmidt , Wade H. White
发明人： Dennis R. Barringer , Mark R. LaForce , Mark A. Marnell , Donald W. Porter , Roger R. Schmidt , Wade H. White
IPC分类号： G01R3102
CPC分类号： G01R31/2887 , Y10S269/90 , Y10S269/903
摘要： A fixture to hold an electronic substrate having probe areas on a top surface. The top surface of the electronic substrate is left open to provide a maximum area to couple interconnect wires for a device under test. In addition, a bottom surface of the substrate is left open to provide a maximum area to couple with a probe card in one embodiment, or a test head in another embodiment. This open bottom and open top minimize the mechanical interference with electrical connections. The substrate is planarized to a frame by one or more clamps that are attached to the frame. The clamps provide adjustment of the pressure down on the substrate in a Z-axis direction which is normal to the top surface of the substrate for providing a good connection with a planar card. In addition, the clamps provide adjustment in the an X-Y plane parallel to the frame and rotational correction about the Z-axis.
摘要翻译：一种固定装置，用于固定在顶表面上具有探针区域的电子基片。电子基板的顶表面保持打开以提供最大面积以耦合待测器件的互连线。此外，在一个实施例中，衬底的底表面保持开放以提供与探针卡耦合的最大面积，或者在另一个实施例中提供测试头。这个开放的底部和开口顶部最小化了电气连接的机械干扰。衬底通过一个或多个附接到框架的夹具平坦化到框架。夹具提供了在基板的向下的基板上的调整，Z轴方向垂直于基板的顶表面，以提供与平面卡的良好连接。另外，夹具在平行于框架的X-Y平面和Z轴的旋转校正中提供调整。

98. 发明授权

US06233959B1 Dehumidified cooling assembly for IC chip modules 失效
标题翻译： IC芯片模块的除湿冷却组件
公开(公告)号：US06233959B1
公开(公告)日：2001-05-22
申请号：US09415732
申请日：1999-10-12
申请人： Sukhvinder Kang , Howard Victor Mahaney, Jr. , Roger R. Schmidt , Prabjit Singh
发明人： Sukhvinder Kang , Howard Victor Mahaney, Jr. , Roger R. Schmidt , Prabjit Singh
IPC分类号： F25D2312
CPC分类号： H01L23/445 , F25D19/00 , H01L2224/16
摘要： A cooling assembly for an integrated circuit chip module wherein an evaporator-cooled IC module is enclosed within an insulated housing which is surrounded by an atmosphere of dehumidified air.
摘要翻译：一种用于集成电路芯片模块的冷却组件，其中蒸发器冷却的IC模块封装在由除湿空气的气氛包围的绝缘壳体内。

99. 发明授权

US6058010A Enhanced test head liquid cooled cold plate 失效
标题翻译：增强型测试头液冷冷板
公开(公告)号：US6058010A
公开(公告)日：2000-05-02
申请号：US188055
申请日：1998-11-06
申请人： Roger R. Schmidt , William P. Maclachlan , Drew R. Horvath , Dennis R. Barringer
发明人： Roger R. Schmidt , William P. Maclachlan , Drew R. Horvath , Dennis R. Barringer
IPC分类号： F28F3/02 , F28F3/04 , F28F3/12 , H05K7/14 , H05K7/20
CPC分类号： F28F3/048 , F28F3/022 , F28F3/12 , H05K7/1422
摘要： A cold plate, planar in shape, is machined to provide an interior cavity having a plurality of thermally conductive members which transfer any thermal energy absorbed by the cold plate to a chilled water stream flowing through the interior cavity. Electronic cards are mechanically and thermally married to copper conduction plates which mount on a surface of the cold plate. The cold plate can hold up to nineteen pairs of conduction plate/electronic card assemblies. Thermal energy generated by the electronic circuit cards flows into the conduction plate and then into the chilled water stream flowing in cold plate. The chilled water is provided by a cooling system as known in the art. The cold plate also provides a large central through-hole through which the electronic cards are electrically connected to a computer system. The cold plate through-hole allows the cold plate to enjoy close proximity to the thermal source providing a path of high conductance for the thermal energy to be dissipated.
摘要翻译：加工成平面形状的冷板，以提供具有多个导热构件的内部空腔，所述多个导热构件将由冷板吸收的任何热能传递到流过内部空腔的冷却水流。电子卡与安装在冷板表面上的铜导电板机械结合。冷板可容纳十九对导电板/电子卡组件。由电子电路卡产生的热能流入导电板，然后流入冷板中流动的冷冻水流。冷却水由本领域已知的冷却系统提供。冷板还提供了一个大的中心通孔，电子卡通过该中心通孔电连接到计算机系统。冷板通孔允许冷板靠近热源，为散热的热能提供高电导路径。

100. 发明授权

US6035655A Modular refrigeration system 失效
标题翻译：模块化制冷系统
公开(公告)号：US6035655A
公开(公告)日：2000-03-14
申请号：US130358
申请日：1998-08-07
申请人： Jeffrey J. Hare , Willard S. Harris , Jody A. Hickey , Roger R. Schmidt , Edward J. Seminaro , Gregory M. Chrysler , Richard C. Chu , Gary F. Goth , Robert E. Simons
发明人： Jeffrey J. Hare , Willard S. Harris , Jody A. Hickey , Roger R. Schmidt , Edward J. Seminaro , Gregory M. Chrysler , Richard C. Chu , Gary F. Goth , Robert E. Simons
IPC分类号： F25B7/00 , F25B41/04 , F25B47/02 , F28F3/12 , H05K7/20 , F25B23/12
CPC分类号： H05K7/20354 , F25B7/00 , F28F3/12 , F25B2400/06 , F25B2400/075 , F25B2600/0253 , F25B41/04 , F25B47/022 , Y02B30/741
摘要： A d.c. motor together with a hot gas bypass valve is incorporated into a cooling system specifically designed for removing heat from computer systems. Unlike typical refrigeration systems, the cooling system herein runs continuously and responds to changes in thermal load. This allows the unit to operate within a wide range of ambient conditions and at various thermal load levels unlike other systems which were capable of operation only at a single, predesigned load level. The cooling system is modular and is easily added to or removed from a redundant system which includes a single evaporator with multiple refrigerant loops which provides yet another aspect of continuous operation due to the inherent redundancy thus provided.
摘要翻译：一个d.c. 电动机与热气旁通阀结合在专门设计用于从计算机系统中除去热量的冷却系统中。与典型的制冷系统不同，这里的冷却系统连续运行并响应热负荷的变化。这使得该单元能够在宽范围的环境条件和各种热负载水平下运行，而不同于仅能在单个预先设计的负载水平下运行的其他系统。冷却系统是模块化的，并且容易地添加到冗余系统中或从冗余系统中移除，该冗余系统包括具有多个制冷剂回路的单个蒸发器，由于提供的固有冗余，这提供了连续操作的另一方面。

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