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    • 91. 发明授权
    • Flash EEPROM system cell array with defect management including an error
correction scheme
    • 具有缺陷管理的闪存EEPROM系统单元阵列包括纠错方案
    • US5544118A
    • 1996-08-06
    • US400034
    • 1995-03-07
    • Eliyahou Harari
    • Eliyahou Harari
    • G11C11/56G11C16/04G11C16/34G11C29/00H01L21/28H01L21/8247H01L27/115H01L29/788G11C7/00
    • H01L27/11519G11C11/5621G11C11/5628G11C11/5635G11C11/5642G11C16/0425G11C16/349G11C16/3495G11C29/765G11C29/82H01L21/28273H01L27/115H01L27/11517H01L29/7881H01L29/7885G11C2211/5613G11C2211/5631G11C2211/5634G11C2211/5644G11C29/00
    • A memory system made up of electrically programmable read only memory (EPROM) or flash electrically erasable and programmable read only memory (EEPROM) cells. An intelligent programming technique allows each memory cell to store more than the usual one bit of information. More than one bit is stored in a cell by establishing more than two distinct threshold states into which the cell is programmed. A series of pulses of increasing voltage is applied to each addressed memory cell during its programming, the state of the cell being read in between pulses. The pulses are terminated upon the addressed cell reaching its desired state or a preset maximum number of pulses has been reached. An intelligent erase algorithm prolongs the useful life of the memory cells. A series of pulses is also applied to a block of cells being erased, the state of at least a sample number of cells being read in between pulses. The erasing process is stopped when the cells being read are determined to have reached a fully erased state or one of a number of other conditions has occured. Individual records of the number of erase cycles experienced by blocks of flash EEPROM cells are kept, preferably as part of the blocks themselves, in order to maintain an endurance history of cells within the block. Use of these various features provides a memory having a very high storage density and a long life, making it particularly useful as a solid state memory in place of magnetic disk storage devices in computer systems.
    • 由电可编程只读存储器(EPROM)或闪存电可擦除和可编程只读存储器(EEPROM)单元组成的存储器系统。 智能编程技术允许每个存储器单元存储比通常的一位信息。 通过建立单元被编程的两个以上不同的阈值状态,多个位被存储在单元中。 在其编程期间,一系列增加电压的脉冲被施加到每个寻址的存储器单元,在脉冲之间读取单元的状态。 脉冲在所寻址的单元达到其期望状态时终止,或达到预设的最大脉冲数。 智能擦除算法可延长存储单元的使用寿命。 一系列脉冲也被施加到被擦除的单元块,在脉冲之间读取至少一个单元的样本数的状态。 当读取的单元被确定为已经达到完全擦除状态或者已经发生了许多其他条件中的一种时,停止擦除过程。 保存快闪EEPROM单元块所经历的擦除周期数的单独记录,优选地作为块本身的一部分,以便保持块内的单元的耐久性历史。 使用这些各种特征提供了具有非常高的存储密度和长寿命的存储器,使得其作为固态存储器代替计算机系统中的磁盘存储装置是特别有用的。
    • 94. 发明授权
    • Highly scaleable dynamic ram cell with self-signal amplification
    • US4417325A
    • 1983-11-22
    • US282882
    • 1981-07-13
    • Eliyahou Harari
    • Eliyahou Harari
    • G11C11/405G11C11/56H01L23/556H01L27/085H01L27/108H01L27/115G11C11/40B05D5/12H01L29/78H01L29/80
    • H01L27/115G11C11/405G11C11/4125G11C11/565H01L23/556H01L27/085H01L27/108H01L2924/0002H01L2924/3011
    • A memory cell comprises a substrate of a first conductivity type (preferably N type) in which is formed a first region of opposite conductivity type. Second, third and fourth regions of first conductivity type are then formed in the first region, said second and third regions being separated by a first portion of the first region and said third and fourth regions being separated by a second portion of the first region. A fifth region of first conductivity type is then formed in the second portion of the first region and a first electrode is attached to the fifth region. This electrode is electrically isolated from the second, third and fourth regions and extends on insulation over the first portion of said first region to said second region and also extends over said third region and a part of the second portion of said first region. This electrode is covered by insulation. A word line is then formed over the insulation on the first electrode so as to overlie the first electrode and together with the first electrode forms a dual electrode. The dual electrode structure forms a read transistor with channel length measured by the extent of the first portion between said second region and said third region and a write transistor with channel length measured by the separation between said third region and said fifth region, and a storage junction formed between said fifth region and said first region. By varying the voltage on the third region during the driving of the word line to either a positive or negative voltage, the charge on the first electrode is varied thereby varying the threshold voltage of the read transistor as seen by the word line. A plurality of memory cells such as described can be used to form an array and by varying either the capacitive coupling between the word line or third region and the first electrode in a selected memory cell or, alternatively, by varying the voltage applied to the third region during the writing on said first electrode of stored charge, this particular cell can be used as a reference cell during the read operation.
    • 95. 发明授权
    • Method of forming non-volatile EPROM and EEPROM with increased efficiency
    • US4409723A
    • 1983-10-18
    • US184739
    • 1980-09-08
    • Eliyahou Harari
    • Eliyahou Harari
    • H01L27/112G11C16/04H01L21/8246H01L21/8247H01L27/10H01L29/06H01L29/788H01L29/792H01L21/283H01L21/31
    • G11C16/0425H01L29/0638H01L29/7885
    • The floating gate in an N channel EPROM cell extends over the drain diffusion and over a portion of the channel thereby to form a "drain" capacitance between the drain and the floating gate and a "channel" capacitance between the channel and the floating gate. A control gate overlaps the floating gate and extends over the remainder of the channel near the source diffusion thereby to form a "control" capacitance between the channel and the control gate. These three capacitances form the coupling for driving each cell. The inversion region in the channel directly under the control gate is established directly by a "write or read access" voltage applied to the control gate. The inversion region in the channel directly under the floating gate is established indirectly through the drain and control capacitances and the channel capacitance by the control gate voltage and by another write access voltage applied to the drain. In effect, the drain voltage is coupled to the portion of the channel adjacent to the drain through the series driving circuit formed by the drain capacitance and the channel capacitance. During write, hot electrons from the write channel current are directed toward and injected into the floating gate by the transverse electric field between the floating gate and the underlying channel. Stored injection charge on the floating gate raises the conduction threshold of the programmed cell, causing the cell to remain nonconductive during read when standard ("low") access voltages are applied to the control gate. An unprogrammed cell conducts in response to the low read voltages applied to its control gate and drain drive circuit. A cell is erased either by ultraviolet illumination or by electrons from the floating gate tunneling through a region of thinned oxide. The non-symmetrical arrangement of the control gate and floating gate with respect to source and drain allows a very dense array implementation.
    • 96. 发明授权
    • Gate protection device for MOS circuits
    • MOS电路的栅极保护装置
    • US4072976A
    • 1978-02-07
    • US754932
    • 1976-12-28
    • Eliyahou Harari
    • Eliyahou Harari
    • H01L27/02H01L29/423H01L29/78H01L29/94
    • H01L29/4232H01L27/0251H01L29/78H01L29/94Y10S148/055
    • The specification describes an integrated device for the input protection of MOS circuits. It consists of an MOS capacitor formed by the thinning of a section of the input gate dielectric, SiO.sub.2, and the thinning of an adjoining section of the gate metal, Al. An incoming pulse of static charge with high amplitude and short duration will break down the thinned dielectric of the capacitor before breaking down the relatively thick portion of the gate dielectric. Since the metal over the thin dielectric is also relatively thin, it evaporates from the vicinity of the fault by the generated Joule heat immediately following the breakdown. Thus, the breakdown is self healed and can be repeated many times without damaging the circuit.
    • 该规范描述了用于MOS电路的输入保护的集成器件。 它由通过输入栅极电介质的一部分薄化而形成的MOS电容器,以及栅极金属Al的邻接部分的薄化。 具有高幅度和短持续时间的静电荷的输入脉冲将在分解栅极电介质的较厚部分之前分解电容器的变薄的电介质。 由于薄电介质上的金属也相对较薄,所以在故障附近之后立即从故障附近由产生的焦耳热蒸发掉。 因此,故障是自我愈合的,并且可以重复多次而不损坏电路。
    • 97. 发明申请
    • NAND Flash Memory Controller Exporting a NAND Interface
    • NAND闪存控制器导出NAND接口
    • US20130111113A1
    • 2013-05-02
    • US13596926
    • 2012-08-28
    • Eliyahou HarariRichard R. HeyeRobert D. SelingerMenahem Lasser
    • Eliyahou HarariRichard R. HeyeRobert D. SelingerMenahem Lasser
    • G06F12/02
    • G06F12/0246G06F11/1068G06F11/1072G06F2212/7201G11C16/04G11C16/0483
    • A NAND controller for interfacing between a host device and a flash memory device (e.g., a NAND flash memory device) fabricated on a flash die is disclosed. In some embodiments, the presently disclosed NAND controller includes electronic circuitry fabricated on a controller die, the controller die being distinct from the flash die, a first interface (e.g. a host-type interface, for example, a NAND interface) for interfacing between the electronic circuitry and the flash memory device, and a second interface (e.g. a flash-type interface) for interfacing between the controller and the host device, wherein the second interface is a NAND interface. According to some embodiments, the first interface is an inter-die interface. According to some embodiments, the first interface is a NAND interface. Systems including the presently disclosed NAND controller are also disclosed. Methods for assembling the aforementioned systems, and for reading and writing data using NAND controllers are also disclosed.
    • 公开了一种用于在主机设备和在闪存芯片上制造的闪存设备(例如,NAND闪存设备)之间进行接口的NAND控制器。 在一些实施例中,本公开的NAND控制器包括制造在控制器管芯上的电子电路,控制器管芯与闪存管芯不同,第一接口(例如,主机型接口,例如,NAND接口),用于在 电子电路和闪存设备,以及用于在控制器和主机设备之间进行接口的第二接口(例如,闪存型接口),其中第二接口是NAND接口。 根据一些实施例,第一接口是管芯间接口。 根据一些实施例,第一接口是NAND接口。 还公开了包括当前公开的NAND控制器的系统。 还公开了用于组装上述系统以及用于使用NAND控制器读取和写入数据的方法。
    • 98. 发明授权
    • NAND flash memory controller exporting a NAND interface
    • NAND闪存控制器导出NAND接口
    • US08291295B2
    • 2012-10-16
    • US12539417
    • 2009-08-11
    • Eliyahou HarariRichard R. HeyeRobert D. SelingerMenahem Lasser
    • Eliyahou HarariRichard R. HeyeRobert D. SelingerMenahem Lasser
    • G11C29/00
    • G06F12/0246G06F11/1068G06F11/1072G06F2212/7201G11C16/04G11C16/0483
    • A NAND controller for interfacing between a host device and a flash memory device (e.g., a NAND flash memory device) fabricated on a flash die is disclosed. In some embodiments, the presently disclosed NAND controller includes electronic circuitry fabricated on a controller die, the controller die being distinct from the flash die, a first interface (e.g. a host-type interface, for example, a NAND interface) for interfacing between the electronic circuitry and the flash memory device, and a second interface (e.g. a flash-type interface) for interfacing between the controller and the host device, wherein the second interface is a NAND interface. According to some embodiments, the first interface is an inter-die interface. According to some embodiments, the first interface is a NAND interface. Systems including the presently disclosed NAND controller are also disclosed. Methods for assembling the aforementioned systems, and for reading and writing data using NAND controllers are also disclosed.
    • 公开了一种用于在主机设备和在闪存芯片上制造的闪存设备(例如,NAND闪存设备)之间进行接口的NAND控制器。 在一些实施例中,本公开的NAND控制器包括制造在控制器管芯上的电子电路,控制器管芯与闪存管芯不同,第一接口(例如,主机型接口,例如,NAND接口),用于在 电子电路和闪存设备,以及用于在控制器和主机设备之间进行接口的第二接口(例如,闪存型接口),其中第二接口是NAND接口。 根据一些实施例,第一接口是管芯间接口。 根据一些实施例,第一接口是NAND接口。 还公开了包括当前公开的NAND控制器的系统。 还公开了用于组装上述系统以及用于使用NAND控制器读取和写入数据的方法。