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    • 92. 发明授权
    • Filling port structure for fuel tank
    • 燃油箱灌装口结构
    • US08863792B2
    • 2014-10-21
    • US13485263
    • 2012-05-31
    • Chiaki KataokaSatoshi YamamotoMasaki Akagi
    • Chiaki KataokaSatoshi YamamotoMasaki Akagi
    • B60K15/04
    • B60K15/04B60K2015/0483
    • A filling port structure for a fuel tank includes a filling port member that defines a filling port, an open/close valve that opens and closes the filling port, a rotary member that attaches the open/close valve to the filling port member in a manner such that the open/close valve is rotatable between an open position and a closed position, a locking member that is provided in the filling port member and is movable between a locking position to lock the open/close valve in the closed position and an unlocking position to unlock the open/close valve, an unlocking member that moves the locking member to the unlocking position when pressed by a fuel gun, and a retention portion that holds the locking member in the unlocking position at least when the open/close valve is in the open position.
    • 一种用于燃料箱的填充口结构包括一个限定一个填充口的填充口构件,一个打开和关闭填充口的开关阀,一个将打开/关闭阀以一种方式连接到填充口构件的旋转构件 使得所述打开/关闭阀能够在打开位置和关闭位置之间旋转;锁定构件,其设置在所述填充口构件中并且可在锁定位置之间移动,所述锁定位置将打开/关闭阀锁定在关闭位置,并且解锁 打开/关闭阀的位置,解锁构件,其在被燃料枪按压时将锁定构件移动到解锁位置;以及保持部,其至少在打开/关闭阀为止动件时将锁定构件保持在解锁位置 在开放的位置。
    • 97. 发明授权
    • Method for manufacturing solar cell module
    • 制造太阳能电池组件的方法
    • US08415195B2
    • 2013-04-09
    • US13319396
    • 2010-05-14
    • Hideaki OkumiyaSatoshi YamamotoMasao Saito
    • Hideaki OkumiyaSatoshi YamamotoMasao Saito
    • H01L21/00H01L29/80
    • H01L31/188B32B17/10018B32B17/10788B32B17/10871H01L31/02008H01L31/048H01L31/0512Y02E10/50
    • In manufacturing of a solar cell module in which a solar cell having a surface electrode to which a tab lead is connected is sealed with a resin, the step of connecting the tab lead and the step of sealing the solar cell with the resin are performed simultaneously at a relatively low temperature that is used for the resin sealing step. To perform these steps simultaneously, the solar cell having the surface electrode to which the tab lead is connected with an adhesive is resin-sealed using a vacuum laminator to manufacture the solar cell module. The vacuum laminator used includes a first chamber and a second chamber partitioned by a flexible sheet. The internal pressures of these chambers can be controlled independently, and a heating stage for heating is provided in the second chamber.
    • 在其中用树脂密封具有连接有引线的表面电极的太阳能电池的太阳能电池模块的制造中,同时执行连接片状引线的步骤和用树脂密封太阳能电池的步骤 在用于树脂密封步骤的较低温度下。 为了同时执行这些步骤,使用真空层压机对具有突片引线与粘合剂连接的表面电极的太阳能电池进行树脂密封以制造太阳能电池模块。 使用的真空层压机包括由柔性片分隔开的第一室和第二室。 可以独立地控制这些室的内部压力,并且在第二室中设置用于加热的加热阶段。
    • 99. 发明授权
    • Semiconductor device and method of manufacturing the same
    • 半导体装置及其制造方法
    • US08211751B2
    • 2012-07-03
    • US12810279
    • 2008-12-12
    • Satoshi YamamotoHirokazu Hashimoto
    • Satoshi YamamotoHirokazu Hashimoto
    • H01L21/50
    • B81C1/00317B81C2201/0104B81C2201/0108B81C2201/0125B81C2203/0118B81C2203/0145H01L27/14618H01L27/14627H01L27/14683H01L2924/0002H01L2924/00
    • A method of manufacturing a semiconductor device includes: a bonding step of bonding a first substrate with optical transparency and a second substrate having a surface on which a functional element is provided to each other such that the functional element faces the first substrate; a thinning step of thinning at least one of the first and second substrates; and a through-hole forming step of forming a cavity and a through-hole communicated with the cavity in at least part of a bonding portion between the first and second substrates. According to the present invention, it is possible to prevent irregularities or cracks caused by the presence or absence of the cavity and more regularly thin the substrate. In addition, it is possible to manufacture a semiconductor device capable of contributing to the miniaturization of devices and electronic equipment having the devices, using a more convenient process.
    • 一种制造半导体器件的方法包括:将具有光学透明性的第一衬底和第二衬底接合的接合步骤,其中功能元件彼此设置在其上,使得功能元件面向第一衬底; 减薄所述第一和第二基板中的至少一个的薄化步骤; 以及通孔形成步骤,在第一和第二基板之间的接合部分的至少一部分中形成与空腔连通的空腔和通孔。 根据本发明,可以防止由于空腔的存在或不存在引起的不规则或裂纹,并且更规则地使基板变薄。 此外,可以使用更方便的工艺来制造能够有助于具有该器件的器件和电子设备的小型化的半导体器件。