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91. 发明授权

US08393933B2 Polishing pad and system with window support 有权
标题翻译：抛光垫和带窗户支撑的系统
公开(公告)号：US08393933B2
公开(公告)日：2013-03-12
申请号：US12644972
申请日：2009-12-22
申请人： Jun Qian , Dominic J. Benvegnu , Ningzhuo Cui , Boguslaw A. Swedek , Thomas H. Osterheld
发明人： Jun Qian , Dominic J. Benvegnu , Ningzhuo Cui , Boguslaw A. Swedek , Thomas H. Osterheld
IPC分类号： B24B49/00
CPC分类号： B24B37/013 , B24B37/205 , B24B49/12
摘要： A polishing system includes a polishing pad having a solid light-transmissive window, an optical fiber having an end, and a spacer having a vertical aperture therethrough. A bottom surface of the spacer contacts the end of the optical fiber, a top surface of the spacer contacts the underside of the window, and the vertical aperture is aligned with the optical fiber.
摘要翻译：抛光系统包括具有固体透光窗的抛光垫，具有一端的光纤和具有穿过其的垂直孔的间隔件。间隔件的底表面接触光纤的端部，间隔件的顶表面接触窗的下侧，并且垂直孔与光纤对准。

92. 发明申请

US20120276817A1 EDDY CURRENT MONITORING OF METAL RESIDUE OR METAL PILLARS 审中-公开
标题翻译： EDDY电流监测金属残留或金属支柱
公开(公告)号：US20120276817A1
公开(公告)日：2012-11-01
申请号：US13095822
申请日：2011-04-27
申请人： Hassan G. Iravani , Kun Xu , Boguslaw A. Swedek , Ingemar Carlsson , Shih-Haur Shen , Wen-Chiang Tu , David Maxwell Gage , James C. Wang
发明人： Hassan G. Iravani , Kun Xu , Boguslaw A. Swedek , Ingemar Carlsson , Shih-Haur Shen , Wen-Chiang Tu , David Maxwell Gage , James C. Wang
IPC分类号： B24B1/00
CPC分类号： B24B37/00 , B24B49/105
摘要： A method of chemical mechanical polishing a substrate includes polishing a metal layer on the substrate at a polishing station, monitoring thickness of the metal layer during polishing at the polishing station with an eddy current monitoring system, and halting polishing when the eddy current monitoring system indicates that residue of the metal layer is removed from an underlying layer and a top surface of the underlying layer is exposed.
摘要翻译：对基板进行化学机械抛光的方法包括：在抛光台处对基板上的金属层进行抛光，用涡流监视系统在抛光台上研磨抛光期间监测金属层的厚度，并且当涡流监视系统指示时停止抛光金属层的残留物从下层移除，底层的顶表面被暴露。

93. 发明申请

US20120276661A1 HIGH SENSITIVITY EDDY CURRENT MONITORING SYSTEM 有权
标题翻译：高灵敏度EDDY电流监测系统
公开(公告)号：US20120276661A1
公开(公告)日：2012-11-01
申请号：US13095818
申请日：2011-04-27
申请人： Hassan G. Iravani , Kun Xu , Boguslaw A. Swedek , Ingemar Carlsson , Shih-Haur Shen , Wen-Chiang Tu
发明人： Hassan G. Iravani , Kun Xu , Boguslaw A. Swedek , Ingemar Carlsson , Shih-Haur Shen , Wen-Chiang Tu
IPC分类号： H01L21/66 , B24B51/00
CPC分类号： H01L22/14 , B24B49/105 , H01L22/26 , H01L2924/0002 , H01L2924/00
摘要： A method of chemical mechanical polishing a substrate includes polishing a metal layer on the substrate at a polishing station, monitoring thickness of the metal layer during polishing at the polishing station with an eddy current monitoring system, and controlling pressures applied by a carrier head to the substrate during polishing of the metal layer at the polishing station based on thickness measurements of the metal layer from the eddy current monitoring system to reduce differences between an expected thickness profile of the metal layer and a target profile, wherein the metal layer has a resistivity greater than 700 ohm Angstroms.
摘要翻译：一种基板的化学机械抛光方法包括：在抛光台处抛光基板上的金属层，在抛光台处用涡流监视系统监测在抛光过程中金属层的厚度，以及控制承载头施加到基于来自涡流监测系统的金属层的厚度测量在抛光站处抛光金属层的衬底，以减少金属层的预期厚度分布与目标轮廓之间的差异，其中金属层具有更大的电阻率超过700欧姆埃。

94. 发明授权

US08292693B2 Using optical metrology for wafer to wafer feed back process control 有权
标题翻译：使用光学测量技术进行晶圆反馈过程控制
公开(公告)号：US08292693B2
公开(公告)日：2012-10-23
申请号：US12625480
申请日：2009-11-24
申请人： Jeffrey Drue David , Harry Q. Lee , Boguslaw A. Swedek , Dominic J. Benvegnu , Zhize Zhu , Wen-Chiang Tu
发明人： Jeffrey Drue David , Harry Q. Lee , Boguslaw A. Swedek , Dominic J. Benvegnu , Zhize Zhu , Wen-Chiang Tu
IPC分类号： B24B49/00 , B24B51/00 , B24B1/00 , C23F1/00 , H01L21/306 , H01L21/302 , H01L21/461 , G01N21/55 , G01B11/06 , G06F19/00
CPC分类号： B24B37/013 , B24B49/12 , H01L22/12 , H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： A method of controlling the polishing of a substrate includes polishing a substrate on a first platen using a first set of parameters, obtaining first and second sequences of measured spectra from first and second regions of the substrate with an in-situ optical monitoring system, generating first and second sequences of values from the first and second sequences of measured spectra, fitting first and second linear functions to the first and second sequences of values, determining a difference between the first linear function and the second linear function, adjusting at least one parameter of the first set of parameters based on the difference, and polishing the second substrate on the first platen using the adjusted parameter.
摘要翻译：控制衬底抛光的方法包括使用第一组参数在第一压板上抛光衬底，用原位光学监测系统从衬底的第一和第二区域获得测量光谱的第一和第二序列，产生来自第一和第二测量光谱序列的第一和第二序列值，将第一和第二线性函数拟合到第一和第二序列序列，确定第一线性函数和第二线性函数之间的差异，调整至少一个参数基于所述差异的所述第一组参数，并且使用所述调整参数来研磨所述第一台板上的所述第二基板。

95. 发明申请

US20120196511A1 Gathering Spectra From Multiple Optical Heads 有权
标题翻译：从多个光头收集光谱
公开(公告)号：US20120196511A1
公开(公告)日：2012-08-02
申请号：US13016504
申请日：2011-01-28
申请人： Jeffrey Drue David , Boguslaw A. Swedek , Dominic J. Benvegnu , Sivakumar Dhandapani
发明人： Jeffrey Drue David , Boguslaw A. Swedek , Dominic J. Benvegnu , Sivakumar Dhandapani
IPC分类号： B24B49/00
CPC分类号： B24B49/12 , B24B37/013 , B24B37/105
摘要： A polishing apparatus includes a platen to hold a polishing pad having a plurality of optical apertures, a carrier head to hold a substrate against the polishing pad, a motor to generate relative motion between the carrier head and the platen, and an optical monitoring system. The optical monitoring system includes at least one light source, a common detector, and an optical assembly configured to direct light from the at least one light source to each of a plurality of separated positions in the platen, to direct light from each position of the plurality of separated positions to the substrate as the substrate passes over said each position, to receive reflected light from the substrate as the substrate passes over said each position, and to direct the reflected light from each of the plurality of separated positions to the common detector.
摘要翻译：抛光装置包括用于保持具有多个光学孔的抛光垫的压板，用于将衬底保持在抛光垫上的载体头，用于在承载头和压板之间产生相对运动的电动机以及光学监控系统。所述光学监视系统包括至少一个光源，公共检测器和配置成将来自所述至少一个光源的光引导到所述压板中的多个分离位置中的每一个的光学组件，以引导来自所述至少一个光源的每个位置的光当衬底越过所述每个位置时，多个分离的位置到衬底，以在衬底经过所述每个位置时接收来自衬底的反射光，并将来自多个分离位置中的每一个的反射光引导到公共检测器。

96. 发明申请

US20120028813A1 Selecting Reference Libraries For Monitoring Of Multiple Zones On A Substrate 有权
标题翻译：选择用于监视基板上多个区域的参考库
公开(公告)号：US20120028813A1
公开(公告)日：2012-02-02
申请号：US12847721
申请日：2010-07-30
申请人： Jun Qian , Boguslaw A. Swedek , Harry Q. Lee , Jeffrey Drue David , Sivakumar Dhandapani , Thomas H. Osterheld
发明人： Jun Qian , Boguslaw A. Swedek , Harry Q. Lee , Jeffrey Drue David , Sivakumar Dhandapani , Thomas H. Osterheld
IPC分类号： C40B20/00
CPC分类号： G05B23/0208 , G05B2219/31459 , G05B2219/45232
摘要： A method of configuring a polishing monitoring system includes receiving user input selecting a plurality of libraries, each library of the plurality of libraries comprising a plurality of reference spectra for use in matching to measured spectra during polishing, each reference spectrum of the plurality of reference spectra having an associated index value, for a first zone of a substrate, receiving user input selecting a first subset of the plurality of libraries, and for a second zone of the substrate, receiving user input selecting a second subset of the plurality of libraries.
摘要翻译：配置抛光监视系统的方法包括接收选择多个库的用户输入，多个库的每个库包括多个参考光谱，用于与抛光期间的测量光谱匹配，多个参考光谱的每个参考光谱具有相关联的索引值，对于衬底的第一区域，接收选择所述多个库的第一子集的用户输入以及所述衬底的第二区域，接收选择所述多个库的第二子集的用户输入。

97. 发明申请

US20110300775A1 Control of Overpolishing of Multiple Substrates on the Same Platen in Chemical Mechanical Polishing 失效
标题翻译：控制化学机械抛光同一台上多台基板的抛光
公开(公告)号：US20110300775A1
公开(公告)日：2011-12-08
申请号：US12792651
申请日：2010-06-02
申请人： Jimin Zhang , Ingemar Carlsson , Stephen Jew , Boguslaw A. Swedek
发明人： Jimin Zhang , Ingemar Carlsson , Stephen Jew , Boguslaw A. Swedek
IPC分类号： B24B49/02 , B24B49/10 , B24B1/00 , B24B49/12
CPC分类号： B24B37/013 , B24B49/12
摘要： A polishing method includes simultaneously polishing two substrates, a first substrate and a second substrate, on the same polishing pad. A default overpolishing time is stored and an in-situ monitoring system monitors the two substrates. The in-situ monitoring system further determines a first polishing endpoint time and a second polishing endpoint time of the first and second substrates, respectively. The polishing method further includes calculating an overpolishing stop time where the overpolishing stop time is between the first polishing endpoint time plus the default overpolishing time and the second polishing endpoint time plus the default overpolishing time. Polishing of the first substrate is continued past the first polishing endpoint time and polishing of the second substrate is continued past the second polishing endpoint time. Polishing of both the first substrate and the second substrate is halted simultaneously at the overpolishing stop time.
摘要翻译：抛光方法包括在同一抛光垫上同时抛光两个基板，第一基板和第二基板。存储默认的过度抛光时间，并且现场监控系统监控两个基板。原位监测系统还分别确定第一和第二基底的第一抛光终点时间和第二抛光终点时间。抛光方法还包括计算过度抛光停止时间，其中抛光停止时间在第一抛光终点时间加上默认过度抛光时间与第二抛光终点时间加上默认过度抛光时间之间。第一衬底的抛光继续经过第一抛光终点时间，并且第二衬底的抛光继续经过第二抛光终点时间。在抛光停止时间同时停止第一基板和第二基板的抛光。

98. 发明申请

US20110282477A1 ENDPOINT CONTROL OF MULTIPLE SUBSTRATES WITH MULTIPLE ZONES ON THE SAME PLATEN IN CHEMICAL MECHANICAL POLISHING 审中-公开
标题翻译：在化学机械抛光中在同一板上具有多个区域的多个基板的端点控制
公开(公告)号：US20110282477A1
公开(公告)日：2011-11-17
申请号：US12781654
申请日：2010-05-17
申请人： Harry Q. Lee , Jimin Zhang , Jeffrey Drue David , Boguslaw A. Swedek
发明人： Harry Q. Lee , Jimin Zhang , Jeffrey Drue David , Boguslaw A. Swedek
IPC分类号： G06F19/00
CPC分类号： B24B37/013 , B24B37/042
摘要： A plurality of substrates are polished simultaneously on the same polishing pad. A sequence of spectra is measured from each zone of each substrate, and for each measured spectrum in the sequence of spectra for each zone of each substrate, a best matching reference spectrum is determined from a library of reference spectra. For each zone of each substrate, a linear function is fit to a sequence of index values associated with the best matching reference spectra. For at least one zone, a projected time at which the zone will reach a target index value is determined based on the linear function, and the polishing parameter for at least one zone on at least one substrate is adjusted such that the at least one zone of the at least one substrate has closer to the target index at the projected time than without such adjustment.
摘要翻译：多个基板在同一抛光垫上同时被抛光。从每个底物的每个区域测量光谱序列，并且对于每个底物的每个区域的光谱序列中的每个测量的光谱，从参考光谱库确定最佳匹配的参考光谱。对于每个衬底的每个区域，线性函数适合于与最佳匹配参考光谱相关联的索引值序列。对于至少一个区域，基于线性函数确定区域将达到目标指标值的预计时间，并且调整至少一个基底上的至少一个区域的抛光参数，使得至少一个区域的至少一个基板在投影时间比没有这种调整更接近于目标指标。

99. 发明授权

US08039397B2 Using optical metrology for within wafer feed forward process control 有权
标题翻译：使用光学测量在晶片前馈过程控制中
公开(公告)号：US08039397B2
公开(公告)日：2011-10-18
申请号：US12625489
申请日：2009-11-24
申请人： Jeffrey Drue David , Harry Q. Lee , Boguslaw A. Swedek , Dominic J. Benvegnu , Zhize Zhu , Wen-Chiang Tu
发明人： Jeffrey Drue David , Harry Q. Lee , Boguslaw A. Swedek , Dominic J. Benvegnu , Zhize Zhu , Wen-Chiang Tu
IPC分类号： H01L21/302
CPC分类号： B24B37/013 , B24B49/12 , H01L22/12 , H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： A method of controlling the polishing of a substrate includes polishing a substrate on a first platen using a first set of parameters, obtaining first and second sequences of measured spectra from first and second regions of the substrate with an in-situ optical monitoring system, generating first and second sequences of values from the first and second sequences of measured spectra, fitting first and second linear functions to the first and second sequences of values, determining a difference between the first linear function and the second linear function, adjusting at least one parameter of a second set of parameters based on the difference, and polishing the substrate on a second platen using the adjusted parameter.
摘要翻译：控制衬底抛光的方法包括使用第一组参数在第一压板上抛光衬底，用原位光学监测系统从衬底的第一和第二区域获得测量光谱的第一和第二序列，产生来自第一和第二测量光谱序列的第一和第二序列值，将第一和第二线性函数拟合到第一和第二序列序列，确定第一线性函数和第二线性函数之间的差异，调整至少一个参数基于所述差异的第二组参数，以及使用所述调整参数在所述第二压板上抛光所述衬底。

100. 发明授权

US07840375B2 Methods and apparatus for generating a library of spectra 有权
标题翻译：用于生成光谱库的方法和装置
公开(公告)号：US07840375B2
公开(公告)日：2010-11-23
申请号：US12059435
申请日：2008-03-31
申请人： Abraham Ravid , Boguslaw A. Swedek , Dominic J. Benvegnu , Jeffrey Drue David , Jun Qian , Sidney P. Huey , Ingemar Carlsson , Lakshmanan Karuppiah , Harry Q. Lee
发明人： Abraham Ravid , Boguslaw A. Swedek , Dominic J. Benvegnu , Jeffrey Drue David , Jun Qian , Sidney P. Huey , Ingemar Carlsson , Lakshmanan Karuppiah , Harry Q. Lee
IPC分类号： G01B5/00 , G06F19/00
CPC分类号： G01N21/31 , G01N21/253 , H01L21/67161 , H01L21/67207 , H01L21/67253 , H01L21/67766
摘要： A method of generating a library from a reference substrate for use in processing product wafers is described. The method includes measuring substrate characteristics at a plurality of well-defined points of a reference substrate, measuring spectra at plurality of measurement points of the reference substrate, there being more measurement points than well-defined points, and associating measured spectra with measured substrate characteristics.
摘要翻译：描述了从用于处理产品晶片的参考基板产生库的方法。该方法包括在参考基板的多个明确定义的点处测量衬底特性，测量参考衬底的多个测量点处的光谱，存在比明确定义的点多的测量点，以及将测量的光谱与测量的衬底特性相关联。

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