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91. 发明申请

US20120330024A1 RADIOACTIVE IODINE LABELED ORGANIC COMPOUND OR SALT THEREOF 失效
标题翻译：放射性标记有机化合物或其盐
公开(公告)号：US20120330024A1
公开(公告)日：2012-12-27
申请号：US13582047
申请日：2011-02-24
申请人： Hideo Saji , Masahiro Ono , Ikuya Seki
发明人： Hideo Saji , Masahiro Ono , Ikuya Seki
IPC分类号： C07D405/06 , C07F7/22 , C07D405/14 , C07D417/06 , C07D417/14
CPC分类号： C07D417/06 , A61K51/0453 , C07D405/06 , C07D405/14
摘要： The present invention is a compound represented by the following formula (1) or a salt thereof. Furthermore, the present invention is an imaging agent used for imaging a tau protein, the imaging agent containing a compound represented by the formula (1) below or a salt thereof. In the formula (1), R3 is a radioactive iodine.
摘要翻译：本发明是由下式（1）表示的化合物或其盐。此外，本发明是用于成像tau蛋白的成像剂，该成像剂含有下述式（1）表示的化合物或其盐。在式（1）中，R 3是放射性碘。

92. 发明申请

US20120253010A1 COMPOUND ACCUMULATING IN INFLAMMATORY SITE, DIAGNOSTIC AGENT CONTAINING THE COMPOUND IN LABELED STATE AND ITS PRECURSOR COMPOUND FOR LABELING 有权
标题翻译：包含化合物在标签状态的诊断试剂盒及其前体化合物标签中的化合物累积
公开(公告)号：US20120253010A1
公开(公告)日：2012-10-04
申请号：US13434722
申请日：2012-03-29
申请人： Hideo Saji , Hiroyuki Kimura , Masahiro Ono , Ikuya Seki
发明人： Hideo Saji , Hiroyuki Kimura , Masahiro Ono , Ikuya Seki
IPC分类号： C07K7/06
CPC分类号： A61K51/088 , G01N2800/042
摘要： Embodiments of the invention provide a compound accumulating in an inflammatory site, a diagnostic agent containing the compound in labeled state and its precursor compound for labeling. Such a compound accumulating in inflammatory site may be represented by the following formula (1): Z—Y-Leu-Phe-(X)n-DLys(-(DLys)m-HalB)-(DLys)k-NH2 (1) wherein in the formula (1), Z represents a protective group for an amino group; Y represents Met or Nle; X represents a spacer consisting of one or more of amino acid and/or synthetic organic compounds; n represents 1 or 0; m represents 1 or 0; k represents 1 or 0; and HalB represents a substituted benzoic acid having a radioactive halogen in an aromatic ring.
摘要翻译：本发明的实施方案提供了一种在炎症部位中积聚的化合物，含有标记状态的化合物的诊断剂及其用于标记的前体化合物。 Z-Y-Leu-Phe-（X）n-DLys（ - （DLys）m-HalB） - （DLys）k-NH 2（1）的化合物可以由下述式（1）表示：）其中在式（1）中，Z表示氨基的保护基; Y表示Met或Nle; X表示由一种或多种氨基酸和/或合成有机化合物组成的间隔物; n表示1或0; m表示1或0; k表示1或0; HalB表示在芳香环中具有放射性卤素的取代苯甲酸。

93. 发明授权

US07833041B2 Connector with a flexible printed circuit board 有权
标题翻译：带柔性印刷电路板的连接器
公开(公告)号：US07833041B2
公开(公告)日：2010-11-16
申请号：US12421450
申请日：2009-04-09
申请人： Masahiro Ono , Masayuki Okamoto
发明人： Masahiro Ono , Masayuki Okamoto
IPC分类号： H01R13/62
CPC分类号： H01R12/88 , H01R12/774
摘要： A connector has a base having an opening to be inserted with a tip portion of a flexible printed circuit board at a front surface, and having a plurality of insertion holes passing from the front surface to a rear surface juxtaposed at a predetermined pitch, a connection terminal arranged in a projecting manner with a substantially T-shaped operating piece having at one end a movable contacting point that comes into pressure contact with joints juxtaposed at the tip portion of the flexible printed circuit board, the connection terminal having one end that becomes a fixed contacting point inserted to the insertion hole from the rear surface side, and an operating lever in which a cam portion is fitted into a turning recessed portion arranged at an upper side of the connection terminal to act as a turning supporting point, the cam portion driving an operation receiving portion positioned at the other end of the operating piece. A position regulation contacting portion arranged at a lower surface of the operating lever locks to a slip-out preventing projection arranged in a projecting manner at an upper side of the connection terminal to prevent slip-out when the operating lever is turned and a locking operation is completed.
摘要翻译：连接器具有基部，其具有在前表面插入柔性印刷电路板的前端部的开口，并且具有从前表面延伸到以预定间距并置的后表面的多个插入孔，连接端子布置成具有基本上T形的操作件的基本上T形的操作件，其一端具有与在柔性印刷电路板的顶端部分并列的接头进行压力接触的可动接触点，连接端子的一端变为固定接触点从后表面侧插入插入孔;以及操作杆，其中凸轮部分装配到布置在连接端子的上侧的转向凹部中，以用作转动支撑点，凸轮部分驱动位于操作件的另一端的操作接收部。布置在操作杆的下表面处的位置调节接触部分锁定到突出地布置在连接端子的上侧的防滑突起，以防止当操作杆转动时滑脱，并且锁定操作完成了。

94. 发明申请

US20100278733A1 COMPOSITION FOR DIAGNOSIS OF AMYLOID-RELATED DISEASE 审中-公开
标题翻译：用于诊断与淀粉样相关疾病的组合物
公开(公告)号：US20100278733A1
公开(公告)日：2010-11-04
申请号：US12301805
申请日：2007-05-22
申请人： Morio Nakayama , Mamoru Haratake , Masahiro Ono
发明人： Morio Nakayama , Mamoru Haratake , Masahiro Ono
IPC分类号： A61K49/00 , A61K51/00 , A61P43/00 , C07D213/61 , C07D333/22 , C07C211/00 , C07D277/30 , C07D233/54
CPC分类号： C07D213/61 , A61K51/04 , A61K51/0431 , A61K51/0455 , C07D213/60 , C07D233/64 , C07D277/24 , C07D307/42 , C07D333/28 , C07D333/36 , C07D409/06
摘要： There is provided a composition comprising a compound represented by general formula (I), wherein Rl represents a 5-iodothiophen-2-yl group or the like, and R2 represents a 4-dimethylaminophenyl group or the like. This composition is useful for diagnosis of an amyloid-related disease such as Alzheimer's disease because the compound has high binding specificity to amyloid β protein, high permeability through the blood-brain barrier, and a property of being rapidly eliminated from sites other than senile plaques in the brain.
摘要翻译：提供了包含由通式（I）表示的化合物的组合物，其中R1表示5-碘代噻吩-2-基等，R2表示4-二甲基氨基苯基等。该组合物可用于淀粉样蛋白相关疾病如阿尔茨海默病的诊断，因为该化合物对淀粉样蛋白和bgr具有高结合特异性; 蛋白质，通过血脑屏障的高渗透性，以及从脑中除老年斑之外的部位迅速消除的性质。

95. 发明申请

US20100187675A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20100187675A1
公开(公告)日：2010-07-29
申请号：US12692872
申请日：2010-01-25
申请人： Kazumichi Shimizu , Yoshihiro Tomura , Masahiro Ono
发明人： Kazumichi Shimizu , Yoshihiro Tomura , Masahiro Ono
IPC分类号： H01L23/48 , H01L21/60
CPC分类号： H01L21/563 , H01L21/561 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/1815 , H01L2924/00 , H01L2224/0401
摘要： This semiconductor device is a semiconductor device in which a semiconductor element is flip-chip mounted onto a circuit substrate and the semiconductor element is covered and sealed with a sealing resin. A recess portion is formed in the sealing resin on a surface opposite to the mounting surface of the semiconductor element. Warping of the semiconductor device is reduced by the action of this recess portion.
摘要翻译：该半导体装置是将半导体元件倒装芯片安装在电路基板上的半导体装置，半导体元件被密封树脂覆盖并密封。在与半导体元件的安装表面相对的表面上的密封树脂中形成凹部。通过该凹部的作用可以减小半导体器件的翘曲。

96. 发明申请

US20090215287A1 Substrate Connecting Member and Connecting Structure 失效
标题翻译：基板连接构件和连接结构
公开(公告)号：US20090215287A1
公开(公告)日：2009-08-27
申请号：US11918121
申请日：2006-07-06
申请人： Masato Mori , Yoshihiko Yagi , Masahiro Ono , Yoshihiro Tomura , Kunio Hibino , Yasushi Nakagiri , Akihiro Miyashita , Kunio Sakurai
发明人： Masato Mori , Yoshihiko Yagi , Masahiro Ono , Yoshihiro Tomura , Kunio Hibino , Yasushi Nakagiri , Akihiro Miyashita , Kunio Sakurai
IPC分类号： H01R12/14
CPC分类号： H05K3/368 , H05K1/0271 , H05K1/144 , H05K1/145 , H05K2201/042 , H05K2201/09036 , H05K2201/09163 , H05K2201/2018
摘要： A substrate connecting member connects two circuit boards connected together while maintaining high reliability of the junctions between itself and the circuit boards even if the circuit boards are warped by temperature change of an impact load. The substrate connecting member includes a frame member made of an insulating resin; slit grooves formed in at least one of the inner and outer surfaces of frame side portions composing the frame member, the slit grooves being formed throughout the entire length of the frame side portions in the direction perpendicular to the thickness direction of the frame side portions; and connection conductor portions having connection terminals provided on the top and bottom surfaces, respectively, of the frame side portions in the thickness direction and connecting conductors each connecting connection terminals.
摘要翻译：衬底连接构件连接两个连接在一起的电路板，同时保持其自身和电路板之间的接合部的高可靠性，即使电路板由于冲击负载的温度变化而翘曲。基板连接构件包括由绝缘树脂制成的框架构件; 狭缝槽形成在构成框架构件的框架侧部的至少一个内表面和外表面中，狭缝槽沿与框架侧部的厚度方向垂直的方向在框架侧部分的整个长度上形成; 以及连接导体部分，其具有分别设置在厚度方向上的框架侧部分的顶表面和底表面上的连接端子和连接连接端子的连接导体。

97. 发明申请

US20090060668A1 Drill guide jig 失效
标题翻译：钻导向夹具
公开(公告)号：US20090060668A1
公开(公告)日：2009-03-05
申请号：US12222512
申请日：2008-08-11
申请人： Masahiro Ono , Takahiro Kunichi , Hiroki Sato , Tsuyoshi Yadori , Akihiko Koshido , Tomoya Ohtani
发明人： Masahiro Ono , Takahiro Kunichi , Hiroki Sato , Tsuyoshi Yadori , Akihiko Koshido , Tomoya Ohtani
IPC分类号： B23B47/28
CPC分类号： B23B49/02 , B23B2215/04 , B23B2226/33 , B23B2260/026 , Y10T408/567 , Y10T408/568
摘要： A drill guide jig for guiding a drill orthogonally to a curved surface of a workpiece is disclosed. The jig is provided with a guide member having a guide hole for passing a drill and a holding member for holding the guide member. The holding member has a contact part for making contact with a curved surface of the workpiece on the lower side. The contact part has two contact points for making contact with the curved surface. The two contact points are symmetrical in relation to a center axis orthogonal to a midpoint of a line segment that connects the contact points. The drill is perpendicular in relation to the curved surface of the workpiece because the guide hole is disposed along the center axis.
摘要翻译：公开了一种用于将钻头正交地引导到工件的曲面的钻子引导夹具。夹具具有引导构件，该引导构件具有用于使钻头通过的引导孔和用于保持引导构件的保持构件。保持构件具有与下侧的工件的曲面接触的接触部。接触部分具有两个与弯曲表面接触的接触点。两个接触点相对于与连接接触点的线段的中点正交的中心轴对称。钻头相对于工件的曲面垂直，因为导向孔沿着中心轴线设置。

98. 发明申请

US20080139013A1 Interconnecting Board and Three-Dimensional Wiring Structure Using it 有权
标题翻译：互连板和三维接线结构
公开(公告)号：US20080139013A1
公开(公告)日：2008-06-12
申请号：US11995339
申请日：2006-04-17
申请人： Yoshihiro Tomura , Yasushi Nakagiri , Kunio Hibino , Yoshihiko Yagi , Akihiro Miyashita , Masahiro Ono , Masato Mori
发明人： Yoshihiro Tomura , Yasushi Nakagiri , Kunio Hibino , Yoshihiko Yagi , Akihiro Miyashita , Masahiro Ono , Masato Mori
IPC分类号： H01R12/00 , H01R43/00
CPC分类号： H01R12/00 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , H01L2924/1627 , H01L2924/19105 , H01L2924/19106 , H05K1/0284 , H05K1/144 , H05K1/145 , H05K3/28 , H05K3/284 , H05K3/368 , H05K3/403 , H05K2201/09018 , H05K2201/09845 , H05K2201/09909 , H05K2201/10378 , H05K2201/2018 , Y10T29/49117 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A first circuit board (1) mounted with an electronic component (16) and a second circuit board (2) are vertically connected three-dimensionally through an interconnecting board (3) wherein the terminal portion (6) of the land electrode (5) on the interconnecting board (3) is buried in the termination material (9) of the interconnecting board (3). Consequently, the chance of peeling or cracking due to peeling stress or shearing stress acting between the upper/lower circuit boards and the land electrode by high density mounting, thermal shock or falling impact can be suppressed or buffered resulting in high reliability.
摘要翻译：安装有电子部件（16）和第二电路板（2）的第一电路板（1）通过互连板（3）垂直连接，其中焊盘电极（5）的端子部分（6）在互连板（3）上的埋设在互连板（3）的端接材料（9）中。因此，可以抑制或缓冲由于高密度安装，热冲击或落下冲击而在上下电路板和焊盘电极之间作用的剥离应力或剪切应力的剥离或破裂的机会，从而导致高可靠性。

99. 发明授权

US06950472B2 Coded data transfer control method and storage and reproduction system 失效
标题翻译：编码数据传输控制方法和存储和再现系统
公开(公告)号：US06950472B2
公开(公告)日：2005-09-27
申请号：US09966108
申请日：2001-10-01
申请人： Masahiro Ono , Atsushi Inazumi , Kazutoshi Adachi , Daisuke Tanaka , Hiroshi Saito , Kumiko Atsuta
发明人： Masahiro Ono , Atsushi Inazumi , Kazutoshi Adachi , Daisuke Tanaka , Hiroshi Saito , Kumiko Atsuta
IPC分类号： H04N5/92 , H04J3/00 , H04N5/00 , H04N5/44 , H04N5/76 , H04N5/783 , H04N5/91 , H04N9/804 , H04N9/82 , H04N19/00 , H04N19/423 , H04N19/70 , H04N7/12
CPC分类号： H04N21/4325 , H04N5/4401 , H04N5/76 , H04N5/783 , H04N9/8042 , H04N9/8205 , H04N21/434 , H04N21/4345 , H04N21/440281 , H04N21/472
摘要： In special reproduction, pictures whose display timings are set in advance are sequentially transferred to a decoder side. When a decode start instruction is outputted during the first transfer of a picture, the second transfer of the picture is started at the transfer completion timing of the first transfer if a transfer completion timing of the second transfer comes before a transfer start timing corresponding to the display timing of a subsequent picture.
摘要翻译：在特殊再现中，预先设置显示定时的图像被顺序地传送到解码器侧。当在图像的第一次传送期间输出解码开始指令时，如果第二次传送的传送完成定时在对应于第二次传送的传送开始定时之前，则在第一次传送的传送完成定时开始图像的第二传送显示后续图像的定时。

100. 发明申请

US20050168961A1 Stereoscopic electronic circuit device, and relay board and relay frame used therein 失效
标题翻译：立体电子电路装置，其中使用的继电器板和继电器框架
公开(公告)号：US20050168961A1
公开(公告)日：2005-08-04
申请号：US10985325
申请日：2004-11-10
申请人： Masahiro Ono , Shigeru Kondo , Kazuhiro Nishikawa , Yoshihiko Yagi , Kazuto Nishida
发明人： Masahiro Ono , Shigeru Kondo , Kazuhiro Nishikawa , Yoshihiko Yagi , Kazuto Nishida
IPC分类号： H01L23/538 , H01L25/065 , H05K1/00 , H05K1/14 , H05K1/18 , H05K3/34 , H05K3/36 , H05K3/40 , H05K1/11
CPC分类号： H05K1/183 , H01L23/5385 , H01L25/0652 , H01L2223/6677 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/06572 , H01L2924/09701 , H01L2924/15156 , H01L2924/15192 , H01L2924/1627 , H01L2924/181 , H01L2924/3025 , H05K1/0284 , H05K1/141 , H05K1/144 , H05K1/145 , H05K3/3442 , H05K3/368 , H05K3/403 , H05K2201/09036 , H05K2201/10446 , H05K2201/10636 , H05K2201/10674 , H05K2203/1572 , Y02P70/611 , H01L2924/00012
摘要： A stereoscopically connected structure is made up of a first circuit board and a second circuit board which are mounted with other electronic components, and a relay board having a recess which is mounted with an electronic component and is provided with a lead-out wiring extending from the electronic component, and also having a land part to be connected with the lead-out wiring on one of the surfaces of the relay board that face the first circuit board and second circuit board. Thus the relay board can mount the electronic component thereon as well as connect the first circuit board and the second circuit board, thereby achieving high density mounting.
摘要翻译：立体连接的结构由安装有其他电子部件的第一电路板和第二电路板构成，以及具有安装有电子部件的凹部的中继板，并且设置有从电子部件，并且还具有与继电器板的面对第一电路板和第二电路板的一个表面上的引出布线连接的焊盘部分。因此，继电器板可以在其上安装电子部件，并且连接第一电路板和第二电路板，从而实现高密度安装。

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