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    • 94. 发明公开
    • Cyanate ester films that promote plating adhesion to cyanate ester graphite composites
    • Cyanatesterfilm,der die Plattierungshaftung aufOberflächenvon Cyanatester-Graphitzusammensetzungenfördert
    • EP0759329A2
    • 1997-02-26
    • EP96111879.1
    • 1996-07-24
    • HE HOLDINGS, INC. dba HUGHES ELECTRONICS
    • Punsly, Brian M.Wong, Thomas G.
    • B05D7/02C23C18/20B05D3/10
    • H05K3/381C23C18/20C23C18/2086Y10T428/24959Y10T428/265Y10T428/31554Y10T428/31605
    • A method is provided for preparing the surface of a resin composite for metal plating. More particularly, a layer consisting essentially of resin is applied to the surface of the composite. Thereafter, the surface of the resin layer is etched, preferably by treatment with an etching solution containing either a quarternary ammonium hydroxide or a primary amine. Upon completion of the etching process, the resin layer may be successfully plated with metal. The method of the invention operates to improve adhesion between the resin composite and a subsequently-plated metal by providing the composite with a homogeneous distribution of mechanical anchoring sites for a subsequently-plated metal, such that uniformity of adhesion is achieved. A cyanate ester resin composite prepared for plating in accordance with the invention may, upon plating, replace certain metallic components in such applications as aircraft, spacecraft, and automobiles given its highly conductive metallic coating.
    • 提供了一种用于制备用于金属电镀的树脂复合材料的表面的方法。 更具体地,基本上由树脂组成的层被施加到复合材料的表面上。 此后,优选通过用含有季铵氢氧化物或伯胺的蚀刻溶液处理来蚀刻树脂层的表面。 在蚀刻工艺完成后,树脂层可以成功镀金属。 本发明的方法用于通过为复合材料提供均匀分布的用于随后镀金属的机械锚定位置来提高树脂复合材料和随后镀覆的金属之间的粘附性,从而实现粘合的均匀性。 根据本发明制备的用于电镀的氰酸酯树脂复合物可以在电镀时替代由于其高导电性金属涂层而在诸如飞机,航天器和汽车之类的应用中的某些金属成分。