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91. 发明公开

EP0309682A3 Reticulation resistant photoresist coating 失效
标题翻译：抗电光漆涂料
公开(公告)号：EP0309682A3
公开(公告)日：1990-12-27
申请号：EP88112223.8
申请日：1988-07-28
申请人： SHIPLEY COMPANY INC.
发明人： Fisher, Thomas A.
IPC分类号： G03F7/26 , G03F7/08
CPC分类号： G03F7/36 , G03F7/0226 , Y10S438/948 , Y10T428/24802
摘要： The invention provides a method for forming a photoresist mask on a substrate resistant to reticulation during plasma etching. The method comprises the steps of forming an imaged and developed photoresist coating over an integrated circuit substrate where the photoresist contains an essentially unreacted acid activated cross linking agent, and subjecting said substrate to an etching plasma in a gaseous stream that contains a Lewis acid. Contact of the surface of the photoresist film with the Lewis acid causes cross linking of the surface of the photoresist film during plasma etching with the formation of a reticulation resistant surface layer.

92. 发明公开

EP0355804A2 Electroplating composition and process 失效
标题翻译： Elektroplattierungszusammensetzung und -verfahren。
公开(公告)号：EP0355804A2
公开(公告)日：1990-02-28
申请号：EP89115521.0
申请日：1989-08-23
申请人： SHIPLEY COMPANY INC.
发明人： Bernards, Roger F. , Fischer, Gordon , Sonnenberg, Wade
IPC分类号： C25D3/38
CPC分类号： C25D3/38 , H05K3/42 , H05K3/423 , H05K2203/162
摘要： A composition for electroplating copper onto a conductive surface comprising a solution soluble copper salt and an acid electrolyte, said copper salt being present in a concentration of from about 1 to 10 grams per liter of solution and said acid being present in a concentration whereby the acid to copper ratio preferably varies between about 30 to 1 and 50 to 1. The composition is especially useful for the plating of walls of cylindrical openings having a ratio of height to diameter of at least 10 to 1 and a length of at least 0.100 inches.
摘要翻译：一种用于将铜电镀到包含溶液可溶性铜盐和酸性电解质的导电表面上的组合物，所述铜盐以约1至10克/升溶液的浓度存在，并且所述酸以浓度存在，其中酸铜比优选在约30至1和50至1之间变化。该组合物特别可用于电镀具有至少10比1的高度与直径的比率以及至少0.100英寸的长度的圆柱形开口的壁。

93. 发明公开

EP0352739A2 Photoresist pattern fabrication employing chemically amplified metalized material 失效
标题翻译：一种用于生产使用化学放大和金属化材料光致抗蚀剂结构的过程。
公开(公告)号：EP0352739A2
公开(公告)日：1990-01-31
申请号：EP89113699.6
申请日：1989-07-25
申请人： SHIPLEY COMPANY INC.
发明人： Thackeray, James W. , Fine, Stephen A.
IPC分类号： G03F7/004 , G03F7/022 , G03F7/09 , G03F7/38 , G03F7/075
CPC分类号： G03F7/022 , G03F7/0041 , G03F7/0755 , G03F7/09 , G03F7/265
摘要： The present invention is directed to a method for the formation and dry development of photoresists treated only in a thin layer ( i.e. , approx. 2000 Angstroms thick) so as to be treated with an organometallic material. Treatment of this thin layer of the resist formulation in the process of the present invention is preferably accomplished by the vapor phase exposure of the resist formulation to an organometallic material such as a silylating compound capable of reacting with the resist formulation. The resist formulation also contains a photoacid generator, capable of releasing an acid which either causes the hydrolysis of the exposed portions of the resist that were created with organometallic vapor, or prevents the reaction of the organometallic vapor with the exposed portion of the resist.
摘要翻译：本发明涉及用于干燥光致抗蚀剂只在薄层（即，约2000埃厚）治疗的形成和发展，以便与有机金属材料进行处理的方法。此薄的本发明的方法中抗蚀剂配制剂的层的处理优选通过将抗蚀剂配制剂的气相接触在有机金属材料实现：诸如能够与抗蚀剂配制剂反应的甲硅烷基化化合物。该抗蚀剂从而制剂包含光酸产生剂，能够在酸释放的其中或者引起与有机金属蒸气产生的抗蚀剂thatwere的暴露部分的水解，或防止有机金属蒸气与抗蚀剂的曝光部分的反应。

94. 发明公开

EP0202396A3 Scanning wedge method for determining characteristics of a photoresist 失效
标题翻译：用于确定光电特征的扫描网格方法
公开(公告)号：EP0202396A3
公开(公告)日：1989-03-22
申请号：EP86101866.1
申请日：1986-02-14
申请人： SHIPLEY COMPANY INC.
发明人： Hertlein, Walter G. c/o Shipley AG
IPC分类号： G03B27/72 , G03F7/20
CPC分类号： G03F7/70583 , G03F7/20
摘要： A method and a system for determining the characteristics of a photoresist are disclosed. This scanning wedge method is accomplished by linearly varying the exposure dose the photoresist receives. Thereafter, the photoresist is developed. The location of interference fringes on the developed photoresist is then determined. This provides the data necessary to determine the characteristics of the photoresist.
摘要翻译：公开了一种用于确定光致抗蚀剂的特性的方法和系统。该扫描楔形法通过线性地改变光致抗蚀剂所接收的曝光剂量来实现。此后，显影光致抗蚀剂。然后确定在显影的光致抗蚀剂上的干涉条纹的位置。这提供了确定光致抗蚀剂特性所需的数据。

95. 发明公开

EP0261424A3 Metal plating process 失效
标题翻译：金属镀层工艺
公开(公告)号：EP0261424A3
公开(公告)日：1988-09-28
申请号：EP87112337
申请日：1987-08-25
申请人： SHIPLEY COMPANY INC.
发明人： Wilkinson, Gary Morgan , Deckert, Cheryl Ann , Doubrava, Jeffrey J.
IPC分类号： C23C18/28
CPC分类号： H05K3/422 , C23C18/28 , H05K3/0055 , H05K3/383 , H05K3/42 , H05K3/427 , H05K2203/0796 , H05K2203/122
摘要： A process for the formation of a plated through-hole printed circuit board comprising treating a circuit board base material as follows:
1. condition with an oxidant solution; 2 (A). contact with a copper etchant that etches copper and neutralizes oxidant residues on the surface to be plated; and 2 (B). contact with a conditioner that conditions the board surface for enhanced catalyst adsorption; or 2 (A). contact with a neutralizer for oxidant residues that neutralizes said residues and conditions the board surface for enhance catalyst asdorption; and 2 (B). contact with a copper etchant; and 3. catalyze the board; and 4. plate electroless metal onto catalyzed surfaces from a plating solution containing a source of halide ions in a concentration of at least 0.1 moles per liter of solution. The process is characterized by the absence of a step of acceleration and contains fewer processing steps than prior art processes.

96. 发明公开

EP0255557A2 Process for forming metal images 失效
标题翻译： Verfahren zur Bildung von metallischen Bildern。
公开(公告)号：EP0255557A2
公开(公告)日：1988-02-10
申请号：EP86112660.5
申请日：1986-09-12
申请人： SHIPLEY COMPANY INC.
发明人： Rodriquez, Stephen S. , Hawkins, Robert E.
IPC分类号： H05K3/00 , G03C7/16 , G03F7/00 , C23F1/02 , C25D5/02
CPC分类号： H05K3/061 , G03F7/00 , G03F7/164 , H05K1/117 , H05K3/108 , H05K3/243 , H05K2201/0355 , H05K2203/0582 , H05K2203/0723 , H05K2203/0783 , H05K2203/135
摘要： A method for coating a conductive surface with an organic coating where one discrete area of the organic coating is coated onto the surface in an image pattern by conventional means and another discrete area of the organic coating is electrophoretically deposited onto the surface. The process is useful for diverse applications including the fabrication of printed circuit boards.
摘要翻译：用有机涂层涂覆导电表面的方法，其中通过常规方法以有机涂层的一个离散区域以图像图案涂覆在表面上，并且有机涂层的另一离散区域电泳沉积到表面上。该过程对于包括印刷电路板的制造在内的各种应用是有用的。

97. 发明授权

EP0114986B1 Electroless nickel plating 失效
标题翻译：无电镀镍
公开(公告)号：EP0114986B1
公开(公告)日：1987-11-11
申请号：EP83112410.2
申请日：1983-12-09
申请人： SHIPLEY COMPANY INC.
发明人： Valayil, Silvester P. , Aronson, Vita
IPC分类号： C23C18/34
CPC分类号： C23C18/34

98. 发明公开

EP0187962A3 Catalytic metal of reduced particle size 失效
标题翻译：减少颗粒尺寸的催化金属
公开(公告)号：EP0187962A3
公开(公告)日：1987-08-12
申请号：EP85115825
申请日：1985-12-12
申请人： SHIPLEY COMPANY INC.
发明人： Gulla, Michael, Dr. , Dutkewych, Oleh B. , Bladon, John J.
IPC分类号： C23C18/28
CPC分类号： C23C18/30 , C23C18/28
摘要： A catalytic adsorbate suspended in an aqueous solution comprising reduced catalytic metal on an organic suspending agent where the reduced catalytic metal has a maximum dimension not exceeding 500 angstroms and the organic suspending agent is one capable of complexing with ions of the catalytic metal. The catalytic adsorbate is useful for the electroless metal deposition of substrates that are non-catalytic to electroless metal deposition.

99. 发明公开

EP0137981A3 Through-hole plating 失效
标题翻译：通孔镀层
公开(公告)号：EP0137981A3
公开(公告)日：1986-08-13
申请号：EP84110077
申请日：1984-08-23
申请人： SHIPLEY COMPANY INC.
发明人： Deckert, Cheryl A. , Couble, Edward C. , Bonetti, William F.
IPC分类号： H05K03/42
CPC分类号： H05K3/381 , C23C18/22 , H05K3/0055 , H05K2203/0783 , H05K2203/0793 , H05K2203/0796
摘要： Compositions and process for the plating of through-holes in an epoxy printed circuit board base material in the manufacture of printed circuit boards. The treatment process is designed to increase adhesion between the epoxy board material and a subsequently deposited metal plate. The process is characterized, in part, by the use of an activated permanganate solution.

100. 发明公开

EP0137981A2 Through-hole plating 失效
标题翻译：通孔金属化。
公开(公告)号：EP0137981A2
公开(公告)日：1985-04-24
申请号：EP84110077.9
申请日：1984-08-23
申请人： SHIPLEY COMPANY INC.
发明人： Deckert, Cheryl A. , Couble, Edward C. , Bonetti, William F.
IPC分类号： H05K3/42 , H05K3/38 , C23C18/22
CPC分类号： H05K3/381 , C23C18/22 , H05K3/0055 , H05K2203/0783 , H05K2203/0793 , H05K2203/0796
摘要： Compositions and process for the plating of through-holes in an epoxy printed circuit board base material in the manufacture of printed circuit boards. The treatment process is designed to increase adhesion between the epoxy board material and a subsequently deposited metal plate. The process is characterized, in part, by the use of an activated permanganate solution.

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