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    • 10. 发明申请
    • ION MILLING DEVICE AND ION MILLING PROCESSING METHOD
    • 离子切割装置和离子切割加工方法
    • US20130240353A1
    • 2013-09-19
    • US13988506
    • 2011-11-21
    • Shunya WatanabeMami KonomiHisayuki TakasuAtsushi Kamino
    • Shunya WatanabeMami KonomiHisayuki TakasuAtsushi Kamino
    • H01J37/305
    • H01J37/3053H01J37/20H01J2237/2001H01J2237/20207H01J2237/2802H01J2237/31745
    • The sample 3 is tilted/oscillated with respect to the optical axis (Z-axis) of the ion beam 2 to repeat tilt and tilt/restoration of a processing target surface 3a of the sample 3 between a surface state in which the processing target surface 3a of the sample 3 faces a tilt axis direction (Y-axis direction) and a tilted surface state in which a portion of the processing target surface 3a on the sample stage side protrudes in the tilt axis direction (Y-axis direction) than does a portion of the processing target surface 3 on the mask side, so that the processing target surface 3a is irradiated with the ion beam 2 at a low angle, and projections/recesses 63 derived from a void 61 or a dissimilar material 62 are suppressed. Accordingly, it is possible to suppress generation of projections/recesses derived from a void or dissimilar material in fabrication of a cross section sample, and thus fabricate a sample cross section suitable for observation/analysis.
    • 样品3相对于离子束2的光轴(Z轴)倾斜/振荡,以在样品3的处理目标表面3a之间重叠倾斜和倾斜/恢复处理目标表面 样品3的3a面向倾斜轴方向(Y轴方向)和倾斜表面状态,其中样品台侧的处理对象表面3a的一部分在倾斜轴线方向(Y轴方向)上突出于倾斜轴方向 处理对象面3的掩模侧的一部分,使得处理对象面3a以低角度照射离子束2,抑制从空隙61或异种材料62得到的突起/凹部63。 因此,在横截面试样的制造中,可以抑制从空隙或异种材料得到的突起/凹部的产生,从而制造适于观察/分析的试样截面。