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1. 发明授权

US07364769B2 Apparatus and method for formation of a wiring pattern on a substrate, and electronic devices and producing methods thereof 失效
标题翻译：用于在基板上形成布线图案的装置和方法，以及电子装置及其制造方法
公开(公告)号：US07364769B2
公开(公告)日：2008-04-29
申请号：US10844428
申请日：2004-05-13
申请人： Yoshihiro Yoshida , Takeshi Sano , Hideaki Ohkura , Hirofumi Kobayashi
发明人： Yoshihiro Yoshida , Takeshi Sano , Hideaki Ohkura , Hirofumi Kobayashi
IPC分类号： B41M3/12
CPC分类号： H05K3/207 , H01L21/4867 , H01L51/0022 , H01L51/0024 , H05K1/0306 , H05K3/386 , H05K2203/0143 , H05K2203/0786 , H05K2203/1105 , H05K2203/1173
摘要： A wiring pattern-forming apparatus, includes a transfer plate 15 for transferring a wiring material 11 arranged to form a wiring pattern onto a substrate 10, a wiring material feeder 2 for feeding the wiring material 11 onto the transfer plate 15, and an energy feeder 6, 7 to feed energy to the wiring material 11 fed to the transfer plate 15 by the wiring material feeder 6. By utilizing the energy fed from the energy feeder 6, 7, the viscosity of the wiring material 11 when the material 11 is fed from the material feeder 2 to the transfer plate 15 is made different from that of the wiring material 11 when the material 11 is transferred from the transfer plate 15 to the substrate 10.
摘要翻译：布线图案形成装置包括：转印板15，用于将布线图案布置以形成在基板10上;布线材料馈送器2，用于将布线材料11馈送到转印板15上;以及能量馈送器用于通过布线材料馈送器6向馈送给转印板15的布线材料11供给能量。通过利用从能量供给器6,7供给的能量，当将材料11从供料器2供给到转印板15时的布线材料11的粘度与布线材料11的粘合性不同，当材料11 从转印板15转印到基板10上。

2. 发明申请

US20050062168A1 Bonded structure using conductive adhesives, and a manufacturing method thereof 有权
标题翻译：使用导电粘合剂的结合结构及其制造方法
公开(公告)号：US20050062168A1
公开(公告)日：2005-03-24
申请号：US10936503
申请日：2004-09-09
申请人： Takeshi Sano , Yoshihiro Yoshida , Hideaki Ohkura , Hirofumi Kobayashi
发明人： Takeshi Sano , Yoshihiro Yoshida , Hideaki Ohkura , Hirofumi Kobayashi
IPC分类号： H01L21/60 , H01L23/485 , H05K1/18 , H05K3/32 , H05K3/36 , H01L23/48 , H01L29/40
CPC分类号： H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/1329 , H01L2224/13339 , H01L2224/13344 , H01L2224/13347 , H01L2224/13355 , H01L2224/13369 , H01L2224/16225 , H01L2224/16227 , H01L2224/81193 , H01L2224/81815 , H01L2224/81855 , H01L2224/81885 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0781 , H01L2924/351 , H05K3/321 , H05K2201/0248 , H05K2201/0272 , H05K2201/0379 , H05K2203/0425 , H01L2224/13099 , H01L2924/00014 , H01L2924/3512 , H01L2924/00 , H01L2224/29344 , H01L2224/29339 , H01L2224/29369 , H01L2224/29347 , H01L2224/29355 , H01L2224/2929 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A disclosed bonded structure includes a first electric structure having a first electrode, a second electric structure having a second electrode, and a middle section for electrically and mechanically bonding the first electrode and the second electrode. The middle section consists of conductive adhesives, wherein fusion bonding of metal particles is provided to at least one of the first electrode and the second electrode. The metal particles are capable of fusion bonding at a temperature lower than a thermal hardening temperature of the conductive adhesives. The conductive adhesives contain conductive filler pieces that have a particle size at which fusion bonding does not take place at a temperature lower than the thermal hardening temperature of the conductive adhesives.
摘要翻译：所公开的接合结构包括具有第一电极的第一电结构，具有第二电极的第二电结构和用于电和机械地结合第一电极和第二电极的中间部分。中间部分由导电粘合剂组成，其中金属颗粒的熔融粘合提供给第一电极和第二电极中的至少一个。金属颗粒能够在低于导电粘合剂的热硬化温度的温度下熔合。导电性粘合剂含有导电性填料片，其导电性填充片具有在比导电性粘合剂的热硬化温度低的温度下不发生熔融粘结的粒径。

3. 发明授权

US07157800B2 Bonded structure using conductive adhesives, and a manufacturing method thereof 有权
标题翻译：使用导电粘合剂的结合结构及其制造方法
公开(公告)号：US07157800B2
公开(公告)日：2007-01-02
申请号：US10936503
申请日：2004-09-09
申请人： Takeshi Sano , Yoshihiro Yoshida , Hideaki Ohkura , Hirofumi Kobayashi
发明人： Takeshi Sano , Yoshihiro Yoshida , Hideaki Ohkura , Hirofumi Kobayashi
IPC分类号： H01L23/48
CPC分类号： H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/1329 , H01L2224/13339 , H01L2224/13344 , H01L2224/13347 , H01L2224/13355 , H01L2224/13369 , H01L2224/16225 , H01L2224/16227 , H01L2224/81193 , H01L2224/81815 , H01L2224/81855 , H01L2224/81885 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0781 , H01L2924/351 , H05K3/321 , H05K2201/0248 , H05K2201/0272 , H05K2201/0379 , H05K2203/0425 , H01L2224/13099 , H01L2924/00014 , H01L2924/3512 , H01L2924/00 , H01L2224/29344 , H01L2224/29339 , H01L2224/29369 , H01L2224/29347 , H01L2224/29355 , H01L2224/2929 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A disclosed bonded structure includes a first electric structure having a first electrode, a second electric structure having a second electrode, and a middle section for electrically and mechanically bonding the first electrode and the second electrode. The middle section consists of conductive adhesives, wherein fusion bonding of metal particles is provided to at least one of the first electrode and the second electrode. The metal particles are capable of fusion bonding at a temperature lower than a thermal hardening temperature of the conductive adhesives. The conductive adhesives contain conductive filler pieces that have a particle size at which fusion bonding does not take place at a temperature lower than the thermal hardening temperature of the conductive adhesives.
摘要翻译：所公开的接合结构包括具有第一电极的第一电结构，具有第二电极的第二电结构和用于电和机械地结合第一电极和第二电极的中间部分。中间部分由导电粘合剂组成，其中金属颗粒的熔融粘合提供给第一电极和第二电极中的至少一个。金属颗粒能够在低于导电粘合剂的热硬化温度的温度下熔合。导电性粘合剂含有导电性填料片，其导电性填充片具有在比导电性粘合剂的热硬化温度低的温度下不发生熔融粘结的粒径。

4. 发明申请

US20050009327A1 Apparatus and method for formation of a wiring pattern on a substrate, and electronic devices and producing methods thereof 失效
标题翻译：用于在基板上形成布线图案的装置和方法，以及电子装置及其制造方法
公开(公告)号：US20050009327A1
公开(公告)日：2005-01-13
申请号：US10844428
申请日：2004-05-13
申请人： Yoshihiro Yoshida , Takeshi Sano , Hideaki Ohkura , Hirofumi Kobayashi
发明人： Yoshihiro Yoshida , Takeshi Sano , Hideaki Ohkura , Hirofumi Kobayashi
IPC分类号： H01L21/4763 , H01L21/48 , H01L51/00 , H01L51/40 , H05K1/03 , H05K3/20 , H05K3/38
CPC分类号： H05K3/207 , H01L21/4867 , H01L51/0022 , H01L51/0024 , H05K1/0306 , H05K3/386 , H05K2203/0143 , H05K2203/0786 , H05K2203/1105 , H05K2203/1173
摘要： A wiring pattern-forming apparatus, includes a transfer plate 15 for transferring a wiring material 11 arranged to form a wiring pattern onto a substrate 10, a wiring material feeder 2 for feeding the wiring material 11 onto the transfer plate 15, and an energy feeder 6, 7 to feed energy to the wiring material 11 fed to the transfer plate 15 by the wiring material feeder 6. By utilizing the energy fed from the energy feeder 6, 7, the viscosity of the wiring material 11 when the material 11 is fed from the material feeder 2 to the transfer plate 15 is made different from that of the wiring material 11 when the material 11 is transferred from the transfer plate 15 to the substrate 10.
摘要翻译：布线图案形成装置包括：转印板15，用于将布线图案布置以形成在基板10上;布线材料馈送器2，用于将布线材料11馈送到转印板15上;以及能量馈送器通过利用从能量馈给器6,7供给的能量，当材料11被供给时，布线材料11的粘度被提供给馈送到传送板15的布线材料11。当将材料11从转印板15转印到基板10时，从材料馈送器2到转印板15的位置与布线材料11的不同。

5. 发明申请

US20050252398A1 Pattern form object and a manufacturing method thereof 审中-公开
标题翻译：图案形式对象及其制造方法
公开(公告)号：US20050252398A1
公开(公告)日：2005-11-17
申请号：US11114029
申请日：2005-04-26
申请人： Hideaki Ohkura , Takeshi Sano , Hirofumi Kobayashi
发明人： Hideaki Ohkura , Takeshi Sano , Hirofumi Kobayashi
IPC分类号： G02B5/20 , H01L21/48 , H01L21/56 , H01L23/13 , H01L23/31 , H01L23/495 , H01L23/498 , H05K1/00 , H05K3/12 , H05K3/20 , B41M1/00
CPC分类号： H01L21/565 , H01L21/4867 , H01L23/13 , H01L23/3107 , H01L23/498 , H01L2224/16238 , H01L2224/81191 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/12044 , H05K1/0284 , H05K3/207 , H05K2201/0257 , H05K2201/09118 , H05K2203/1131 , H05K2203/1173 , H01L2924/00
摘要： A pattern form object and its manufacturing method are disclosed. The pattern form object includes a pattern constituted by an aggregate of grains, a supporting member for supporting the pattern, and a mixed layer formed at a boundary of the pattern and the supporting member. The mixed layer is constituted by a mixture of the grains and the supporting member. Dimensions of the grains in a region other than the mixed layer are greater than dimensions of the grains in the mixed layer.
摘要翻译：公开了一种图案形式对象及其制造方法。图案形成对象包括由颗粒聚集体构成的图案，用于支撑图案的支撑构件以及形成在图案的边界和支撑构件的边界处的混合层。混合层由颗粒和支撑构件的混合物构成。在混合层以外的区域中的晶粒的尺寸大于混合层中的晶粒尺寸。

6. 发明申请

US20070132098A1 ELASTIC CONDUCTIVE RESIN, AND ELECTRONIC DEVICE INCLUDING ELASTIC CONDUCTIVE BUMPS MADE OF THE ELASTIC CONDUCTIVE RESIN 有权
标题翻译：弹性导电树脂和包含弹性导电树脂的弹性导电体的电子装置
公开(公告)号：US20070132098A1
公开(公告)日：2007-06-14
申请号：US11673904
申请日：2007-02-12
申请人： Takeshi Sano , Hirofumi Kobayashi , Hideaki Ohkura
发明人： Takeshi Sano , Hirofumi Kobayashi , Hideaki Ohkura
IPC分类号： H01L23/48
CPC分类号： H05K3/325 , H01L24/11 , H01L24/13 , H01L2224/05001 , H01L2224/05023 , H01L2224/0508 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2224/1319 , H01L2224/1329 , H01L2224/13386 , H01L2224/13439 , H01L2224/13444 , H01L2224/13447 , H01L2224/13455 , H01L2924/0001 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K3/4007 , H05K2201/0248 , H05K2201/0314 , H05K2201/0367 , H01L2924/00014 , H01L2924/0542 , H01L2224/05639 , H01L2224/05644 , H01L2224/05147
摘要： An electronic device includes an electronic part including at least one first electrode, a substrate including at least one second electrode, and at least one bump formed on the at least one first electrode and formed from an elastic conductive resin including a resin having rubbery elasticity, and an acicular conductive filler including a surface layer coated with one of gold, silver, nickel, and copper. The at least one first electrode and the at least one second electrode are electrically connected to each other by mechanically contacting the at least one bump with the at least one second electrode.
摘要翻译：电子设备包括电子部件，其包括至少一个第一电极，包括至少一个第二电极的基板和形成在所述至少一个第一电极上的至少一个凸块，并由包括具有橡胶弹性的树脂的弹性导电树脂形成，以及包括涂覆有金，银，镍和铜之一的表面层的针状导电填料。所述至少一个第一电极和所述至少一个第二电极通过使所述至少一个凸块与所述至少一个第二电极机械接触而彼此电连接。

7. 发明授权

US07875807B2 Elastic conductive resin, and electronic device including elastic conductive bumps made of the elastic conductive resin 有权
标题翻译：弹性导电树脂和由弹性导电树脂制成的弹性导电凸块的电子器件
公开(公告)号：US07875807B2
公开(公告)日：2011-01-25
申请号：US11673904
申请日：2007-02-12
申请人： Takeshi Sano , Hirofumi Kobayashi , Hideaki Ohkura
发明人： Takeshi Sano , Hirofumi Kobayashi , Hideaki Ohkura
IPC分类号： H05K1/02
CPC分类号： H05K3/325 , H01L24/11 , H01L24/13 , H01L2224/05001 , H01L2224/05023 , H01L2224/0508 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2224/1319 , H01L2224/1329 , H01L2224/13386 , H01L2224/13439 , H01L2224/13444 , H01L2224/13447 , H01L2224/13455 , H01L2924/0001 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K3/4007 , H05K2201/0248 , H05K2201/0314 , H05K2201/0367 , H01L2924/00014 , H01L2924/0542 , H01L2224/05639 , H01L2224/05644 , H01L2224/05147
摘要： An electronic device includes an electronic part including at least one first electrode, a substrate including at least one second electrode, and at least one bump formed on the at least one first electrode and formed from an elastic conductive resin including a resin having rubbery elasticity, and an acicular conductive filler including a surface layer coated with one of gold, silver, nickel, and copper. The at least one first electrode and the at least one second electrode are electrically connected to each other by mechanically contacting the at least one bump with the at least one second electrode.
摘要翻译：电子设备包括电子部件，其包括至少一个第一电极，包括至少一个第二电极的基板和形成在所述至少一个第一电极上的至少一个凸块，并由包括具有橡胶弹性的树脂的弹性导电树脂形成，以及包括涂覆有金，银，镍和铜之一的表面层的针状导电填料。所述至少一个第一电极和所述至少一个第二电极通过使所述至少一个凸块与所述至少一个第二电极机械接触而彼此电连接。

8. 发明授权

US07748114B2 Method of forming conductive pattern 有权
标题翻译：形成导电图案的方法
公开(公告)号：US07748114B2
公开(公告)日：2010-07-06
申请号：US11409452
申请日：2006-04-20
申请人： Takeshi Sano , Hideaki Ohkura , Hirofumi Kobayashi , Kunio Ikeda
发明人： Takeshi Sano , Hideaki Ohkura , Hirofumi Kobayashi , Kunio Ikeda
IPC分类号： H05K3/02 , H05K3/10
CPC分类号： H05K3/28 , B41J2/14072 , H05K3/1241 , H05K3/205 , H05K2203/095 , H05K2203/1173 , Y10T29/49155
摘要： The present invention discloses a method of forming a conductive pattern including the steps of a) printing a conductive pattern onto a surface of a base material having a liquid repellent property, b) providing a lyophilic property to a predetermined area of the surface of the base material which area does not have the conductive pattern printed thereon, and c) forming an insulating layer that covers the conductive pattern.
摘要翻译：本发明公开了一种形成导电图案的方法，包括以下步骤：a）将导电图案印刷在具有疏液性的基材的表面上，b）向基材表面的预定区域提供亲液性该区域不具有印刷在其上的导电图案的材料，以及c）形成覆盖导电图案的绝缘层。

9. 发明申请

US20060250452A1 Electric component, method of forming conductive pattern, and inkjet head 有权
标题翻译：电气部件，形成导电图案的方法和喷墨头
公开(公告)号：US20060250452A1
公开(公告)日：2006-11-09
申请号：US11409452
申请日：2006-04-20
申请人： Takeshi Sano , Hideaki Ohkura , Hirofumi Kobayashi , Kunio Ikeda
发明人： Takeshi Sano , Hideaki Ohkura , Hirofumi Kobayashi , Kunio Ikeda
IPC分类号： B41J2/05
CPC分类号： H05K3/28 , B41J2/14072 , H05K3/1241 , H05K3/205 , H05K2203/095 , H05K2203/1173 , Y10T29/49155
摘要： The present invention discloses a method of forming a conductive pattern including the steps of a) printing a conductive pattern onto a surface of a base material having a liquid repellent property, b) providing a lyophilic property to a predetermined area of the surface of the base material which area does not have the conductive pattern printed thereon, and c) forming an insulating layer that covers the conductive pattern.
摘要翻译：本发明公开了一种形成导电图案的方法，包括以下步骤：a）将导电图案印刷在具有疏液性的基材的表面上，b）向基材表面的预定区域提供亲液性该区域不具有印刷在其上的导电图案的材料，以及c）形成覆盖导电图案的绝缘层。

10. 发明申请

US20050218835A1 Light-emitting element driving circuit 有权
标题翻译：发光元件驱动电路
公开(公告)号：US20050218835A1
公开(公告)日：2005-10-06
申请号：US10873302
申请日：2004-06-23
申请人： Hiroshi Suzunaga , Atsushi Namai , Hirofumi Kobayashi
发明人： Hiroshi Suzunaga , Atsushi Namai , Hirofumi Kobayashi
IPC分类号： H01L33/00 , G05F1/00 , H05B33/08 , H05B37/00
CPC分类号： H05B33/0803 , H05B33/0818 , Y02B20/347
摘要： A light-emitting element driving circuit comprises a current supplier serially connected to a light-emitting element and operative to supply a current to the light-emitting element; and a switching unit operative to control switching between the states of the current supplied to the light-emitting element from the current supplier. The switching unit includes a current path consisting of a diode and a semiconductor switching element. The diode is connected in parallel with the light-emitting element and in a forward direction directed from an anode to a cathode of the light-emitting element. The semiconductor switching element is connected serially to the diode and operative to switch between the states of conductive and non-conductive based on a control signal. A voltage drop across the current path when the semiconductor switching element is made conductive is determined lower than a forward voltage of the light-emitting element when it emits light.
摘要翻译：发光元件驱动电路包括串联连接到发光元件的电流供给器，用于向发光元件供给电流; 以及切换单元，用于控制从当前供应商提供给发光元件的电流的状态之间的切换。开关单元包括由二极管和半导体开关元件组成的电流路径。二极管与发光元件并联并且在从发光元件的阳极指向的正向方向上连接。半导体开关元件串联连接到二极管并且可操作以基于控制信号在导电状态和非导通状态之间切换。当半导体开关元件导通时，电流路径上的电压降被确定为低于发光元件发光时的正向电压。

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