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1. 发明申请

US20090190309A1 ELECTRONIC APPARATUS WITH AIR GUIDING ELEMENT 失效
标题翻译：具有空气导向元件的电子设备
公开(公告)号：US20090190309A1
公开(公告)日：2009-07-30
申请号：US12137781
申请日：2008-06-12
申请人： LIANG-QING SHAN , YANG LI , YU-HSU LIN , JENG-DA WU , LIANG-LIANG CAO , LEI GUO
发明人： LIANG-QING SHAN , YANG LI , YU-HSU LIN , JENG-DA WU , LIANG-LIANG CAO , LEI GUO
IPC分类号： H05K7/20
CPC分类号： H05K7/20563 , H05K7/186
摘要： An electronic apparatus includes an enclosure (30), a circuit board (40), a fan module (20), and an air guiding element (10) mounted in the enclosure. The circuit board includes at least one heat generating component (41) thereon. The fan module has a fan (22) and an output opening (213) corresponding to the fan. The air guiding element comprises a resisting panel (11) and a guiding panel (12) comprises a free end that extends toward the output opening of the fan module. The at least one heat generating component and the output opening are on the same side of the resisting panel. The guiding panel defines a free end (127) and a connecting end (125) connecting the resisting panel. A plane defined by the ends of the guiding panel is aligned at an angle larger than 90 degrees relative to the resisting panel.
摘要翻译：电子设备包括外壳（30），电路板（40），风扇模块（20）和安装在外壳中的空气引导元件（10）。电路板包括至少一个发热部件（41）。风扇模块具有与风扇对应的风扇（22）和输出开口（213）。空气引导元件包括阻挡板（11），并且引导板（12）包括朝向风扇模块的输出开口延伸的自由端。所述至少一个发热部件和所述输出开口位于所述抵抗板的同一侧。引导板限定了连接抵抗板的自由端（127）和连接端（125）。由引导板的端部限定的平面相对于电阻板以大于90度的角度排列。

2. 发明申请

US20100097754A1 COMPUTER ENCLOSURE WITH AIRFLOW GUIDE 失效
标题翻译：带气流导轨的计算机外壳
公开(公告)号：US20100097754A1
公开(公告)日：2010-04-22
申请号：US12341395
申请日：2008-12-22
申请人： YANG LI , YU-HSU LIN , JENG-DA WU , LEI GUO , LIANG-LIANG CAO , LIANG-QING SHAN
发明人： YANG LI , YU-HSU LIN , JENG-DA WU , LEI GUO , LIANG-LIANG CAO , LIANG-QING SHAN
IPC分类号： H05K7/20
CPC分类号： G06F1/20
摘要： A computer enclosure includes a chassis with a plurality of heat generating components installed therein and an airflow guide structure. The airflow guide structure includes a fan and a duct attached to the fan. A pair of airflow outlets aligned with the fan is defined in the duct. The duct includes a plurality of pivot panels pivotally attached at airflow outlets. The pivot panels are configured to guide airflow from the fan to different positions of heat generating components in the chassis.
摘要翻译：计算机外壳包括其中安装有多个发热部件的机架和气流引导结构。气流引导结构包括风扇和连接到风扇的管道。与风扇对准的一对气流出口限定在管道中。管道包括在气流出口枢转地连接的多个枢转面板。枢转面板被构造成将来自风扇的气流引导到底盘中的发热部件的不同位置。

3. 发明申请

US20100014244A1 THERMAL DEVICE FOR HEAT GENERATING SOURCE 审中-公开
标题翻译：用于产生热源的热装置
公开(公告)号：US20100014244A1
公开(公告)日：2010-01-21
申请号：US12241645
申请日：2008-09-30
申请人： LIANG-LIANG CAO , YU-HSU LIN , JENG-DA WU , CHIH-HANG CHAO , YANG LI , LEI GUO
发明人： LIANG-LIANG CAO , YU-HSU LIN , JENG-DA WU , CHIH-HANG CHAO , YANG LI , LEI GUO
IPC分类号： H05K7/20
CPC分类号： H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A heat sink for dissipating heat from a heat source, includes a base configured to connect with a heat source, and a plurality of fins positioned on the base. A cutout is defined within the plurality of parallel fins.
摘要翻译：用于从热源散热的散热器包括被配置为与热源连接的基座和位于基座上的多个翅片。切口被限定在多个平行翅片内。

4. 发明申请

US20090213549A1 HEAT SINK ASSEMBLY 审中-公开
标题翻译：散热装置
公开(公告)号：US20090213549A1
公开(公告)日：2009-08-27
申请号：US12210499
申请日：2008-09-15
申请人： LEI GUO , YU-HSU LIN , JENG-DA WU , CHIH-HANG CHAO , YANG LI , LIANG-LIANG CAO
发明人： LEI GUO , YU-HSU LIN , JENG-DA WU , CHIH-HANG CHAO , YANG LI , LIANG-LIANG CAO
IPC分类号： H05K7/20
CPC分类号： H01L23/367 , H01L23/3735 , H01L2924/0002 , H01L2924/00
摘要： A heat sink assembly includes a printed circuit board, an electronic component mounted on the printed circuit board, and a heat sink mounted on the printed circuit board for dissipating heat from the electronic component. The printed circuit board includes a heat-conduction layer. The heat sink includes a base configured to contact the heat-conduction layer, and a main body extending upward from the base configured to contact the electronic component. The cross section of the base is larger than the cross section of the main body. A plurality of fins extends from the main body.
摘要翻译：散热器组件包括印刷电路板，安装在印刷电路板上的电子部件和安装在印刷电路板上的用于从电子部件散热的散热片。印刷电路板包括导热层。散热器包括被配置为接触导热层的基座以及从构造成接触电子部件的基部向上延伸的主体。基座的横截面大于主体的横截面。多个翅片从主体延伸。

5. 发明申请

US20090168330A1 ELECTRONIC DEVICE WITH AIRFLOW GUIDING DUCT 审中-公开
标题翻译：具有气流导向导管的电子装置
公开(公告)号：US20090168330A1
公开(公告)日：2009-07-02
申请号：US12118758
申请日：2008-05-12
申请人： YANG LI , YU-HSU LIN , JENG-DA WU , LEI GUO , LIANG-LIANG CAO
发明人： YANG LI , YU-HSU LIN , JENG-DA WU , LEI GUO , LIANG-LIANG CAO
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： G06F1/20 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： An electronic device includes an enclosure (30), a circuit board (40), and an airflow guiding duct (10). The enclosure includes a bottom wall (31) and a rear wall (32) perpendicular to the bottom wall. The circuit board is mounted on the bottom wall of the enclosure. The circuit board includes a first heat generating element (41) and a second heat generating element (42) near to the first heat generating element. The airflow guiding duct includes two side panels (11) and a connecting panel (13) connecting a pair of side edges (112) of the two side panels. A first opening (17) is defined by a lower edge (131) of the connecting panel and lower edges (111) of the two side panels and corresponding to the first heat generating element. The lower edges of the two side panels and the lower of the connecting panel are in the same plane. The first opening is a predetermined distance from the circuit board and the airflow guiding duct is capable of allowing air flow from different directions.
摘要翻译：电子设备包括外壳（30），电路板（40）和气流引导导管（10）。外壳包括垂直于底壁的底壁（31）和后壁（32）。电路板安装在外壳的底壁上。电路板包括靠近第一发热元件的第一发热元件（41）和第二发热元件（42）。气流引导管道包括两个侧板（11）和连接两个侧板的一对侧边缘（112）的连接板（13）。第一开口（17）由连接板的下边缘（131）和两个侧板的下边缘（111）限定，并且对应于第一发热元件。两个侧板的下边缘和连接面板的下边缘在同一平面内。第一开口距离电路板预定的距离，气流引导管能够允许来自不同方向的空气流动。

6. 发明申请

US20090166062A1 PRINTED CIRCUIT BOARD ASSEMBLY 审中-公开
标题翻译：印刷电路板组装
公开(公告)号：US20090166062A1
公开(公告)日：2009-07-02
申请号：US12118684
申请日：2008-05-10
申请人： ZHI-PING WU , JENG-DA WU , YU-HSU LIN , CHIH-HANG CHAO , LIANG-LIANG CAO
发明人： ZHI-PING WU , JENG-DA WU , YU-HSU LIN , CHIH-HANG CHAO , LIANG-LIANG CAO
IPC分类号： H05K1/00
CPC分类号： H01L23/367 , H01L2924/0002 , H01L2924/00
摘要： A printed circuit board assembly includes a printed circuit board, a carrier, a semiconductor chip mounted on the carrier, a plurality of tin balls soldered between the printed circuit board and the carrier for transmitting signals, and a heat sink glued to the semiconductor chip to dissipate heat. A pressing portion is formed on the bottom of the heat sink and does not make contact with the semiconductor chip. The pressing portion contacts with the periphery of the carrier to reinforce the tin balls located between the printed circuit board and the carrier.
摘要翻译：印刷电路板组件包括印刷电路板，载体，安装在载体上的半导体芯片，焊接在印刷电路板和用于传输信号的载体之间的多个锡球，以及胶合到半导体芯片的散热片散热在散热器的底部形成有按压部，不与半导体芯片接触。按压部分与载体的周边接触以加强位于印刷电路板和载体之间的锡球。

7. 发明申请

US20100288476A1 HEAT DISSIPATION APPARATUS 审中-公开
标题翻译：散热装置
公开(公告)号：US20100288476A1
公开(公告)日：2010-11-18
申请号：US12508852
申请日：2009-07-24
申请人： LIANG-LIANG CAO , YU-HSU LIN
发明人： LIANG-LIANG CAO , YU-HSU LIN
IPC分类号： F28D21/00 , F28F13/00
CPC分类号： H01L23/427 , H01L23/4006 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation apparatus for dissipating heat from two heat sources includes a heat sink, and a fan mounted on the heat sink. The heat sink includes a base and a plurality of parallel fins positioned on the base, the base contacts with one of the two heat sources for thermally conducting the heat generated by the one of the two heat sources. A slantwise slot is formed in the fins, an edge of the slot bent to form a slantwise deflecting portion. The fan is configured to generate airflow through the fins in such a manner that some of the airflow is deflected by the deflecting portion towards the second of the two heat sources.
摘要翻译：用于从两个热源散热的散热装置包括散热器和安装在散热器上的风扇。散热器包括基座和位于基座上的多个平行翅片，基座与两个热源中的一个接触，用于热传导由两个热源之一产生的热量。在翼片上形成有倾斜槽，该槽的边缘弯曲以形成倾斜偏转部分。风扇被配置成以这样的方式产生通过翅片的气流，使得一些气流被偏转部分朝向两个热源中的第二个偏转。

8. 发明申请

US20100288475A1 HEAT DISSIPATION ASSEMBLY 失效
标题翻译：散热装置
公开(公告)号：US20100288475A1
公开(公告)日：2010-11-18
申请号：US12494576
申请日：2009-06-30
申请人： LIANG-LIANG CAO
发明人： LIANG-LIANG CAO
IPC分类号： F28F7/00
CPC分类号： H01L23/467 , H01L23/4006 , H01L2023/4081 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation assembly for dissipating heat from a first heat source and a second heat source includes a heat sink, a fan, a supporting member, and a deflecting panel. The heat sink includes a base and a plurality of heat dissipation fins disposed on the base. The base contacts with the first heat source for thermally conducting the heat generated by the first heat source. The fan and the supporting member are attached at opposite sides of the heat dissipation fins. The supporting member a pivotable rod. The deflecting plate is attached to the pivotable rod and pivotable relative to the heat dissipation fins. The deflecting plate is capable of deflecting airflow from the fan towards the second heat source and dissipating the heat generated by the second heat source.
摘要翻译：用于从第一热源和第二热源散热的散热组件包括散热器，风扇，支撑构件和偏转面板。散热器包括基座和设置在基座上的多个散热翅片。底座与第一热源接触，用于热传导由第一热源产生的热量。风扇和支撑构件附接在散热片的相对侧。支撑构件是可枢转杆。偏转板连接到可枢转杆上，并相对于散热片可枢转。偏转板能够使来自风扇的气流向第二热源偏转并消散由第二热源产生的热量。

9. 发明申请

US20100284142A1 HEAT DISSIPATING ASSEMBLY 失效
标题翻译：散热装置
公开(公告)号：US20100284142A1
公开(公告)日：2010-11-11
申请号：US12479967
申请日：2009-06-08
申请人： LIANG-LIANG CAO
发明人： LIANG-LIANG CAO
IPC分类号： G06F1/20 , F28F7/00
CPC分类号： H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating assembly includes a heat generating component, a heat sink, and a fan. The heat sink includes a base attached on the heat generating component and a plurality of fins attached on the base. The fan is attached to a top surface of the fins. The top surface of the fins is wider than the base. The fins incline inwardly from the top surface to the base for gathering cooling air from the fan to the base.
摘要翻译：散热组件包括发热部件，散热器和风扇。散热器包括附接在发热部件上的基座和附接在基座上的多个翅片。风扇连接到散热片的顶面。翅片的顶面比底座宽。翅片从顶表面向内倾斜到底部，用于将冷却空气从风扇收集到基座。

10. 发明申请

US20100310391A1 HEAT DISSIPATION APPARATUS 审中-公开
标题翻译：散热装置
公开(公告)号：US20100310391A1
公开(公告)日：2010-12-09
申请号：US12548074
申请日：2009-08-26
申请人： LIANG-LIANG CAO , LIANG-WEI JIANG
发明人： LIANG-LIANG CAO , LIANG-WEI JIANG
IPC分类号： F04D25/06 , F28F7/00
CPC分类号： H01L23/467 , F04D19/002 , F04D25/0606 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation fan includes a first magnetic pole, and a second magnetic pole positioned in the first magnetic pole. A plurality of coils is positioned on the first magnetic pole. A plurality of fan blades is positioned on an inner surface of the second magnetic pole. When the current is applied, the magnetic field between the first and second magnetic poles generates a force on the first magnetic pole through the plurality of coils thereon. The first magnetic pole generates a counterforce on the second magnetic pole to rotate the plurality of fan blades.
摘要翻译：散热风扇包括第一磁极和位于第一磁极中的第二磁极。多个线圈位于第一磁极上。多个风扇叶片位于第二磁极的内表面上。当施加电流时，第一和第二磁极之间的磁场通过其上的多个线圈在第一磁极上产生力。第一磁极在第二磁极上产生反作用力以旋转多个风扇叶片。

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