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1. 发明申请

US20120328361A1 MN DOPED SN-BASE SOLDER ALLOY AND SOLDER JOINTS THEREOF WITH SUPERIOR DROP SHOCK RELIABILITY 有权
标题翻译： MN DOPED SN-BASE焊接合金及其焊接接头，具有超级倾斜冲击可靠性
公开(公告)号：US20120328361A1
公开(公告)日：2012-12-27
申请号：US13542586
申请日：2012-07-05
申请人： WEIPING LIU , Ning-Cheng Lee
发明人： WEIPING LIU , Ning-Cheng Lee
IPC分类号： C22C13/00 , B23K35/24
CPC分类号： C22C13/00 , B23K35/0244 , B23K35/262 , C22C13/02 , Y10T403/479
摘要： A Sn—Ag—Cu-based lead-free solder alloy and solder joints thereof with superior drop shock reliability are disclosed. The solder comprises between greater than 0 wt. % and less than or equal to about 1.5 wt. % Ag; between greater than or equal to about 0.7 wt. % and less than or equal to about 2.0 wt. % Cu; between greater than or equal to about 0.001 and less than or equal to about 0.2 wt. % Mn; and a remainder of Sn.
摘要翻译：公开了一种Sn-Ag-Cu基无铅焊料合金及其焊接接头，具有出色的跌落冲击可靠性。焊料包含大于0wt。％且小于或等于约1.5wt。％Ag; 大于或等于约0.7wt。％且小于或等于约2.0wt。％Cu; 在大于或等于约0.001和小于或等于约0.2重量％之间。％Mn; 和Sn的剩余部分。

2. 发明申请

US20110220704A1 COMPOSITE SOLDER ALLOY PREFORM 有权
标题翻译：复合焊接合金预选
公开(公告)号：US20110220704A1
公开(公告)日：2011-09-15
申请号：US12720532
申请日：2010-03-09
申请人： Weiping Liu , Ning-Cheng Lee
发明人： Weiping Liu , Ning-Cheng Lee
IPC分类号： B23K1/20 , B32B15/01
CPC分类号： B23K35/0238 , B23K35/26 , B23K35/262 , H01L24/29 , H01L24/83 , H01L2224/29083 , H01L2224/83101 , H01L2224/83801 , H01L2224/8381 , H01L2224/83825 , H01L2924/01322 , H01L2924/15747 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722 , H01L2924/00
摘要： Various embodiments of the invention provide laminate composite preform foils for high-temperature Pb-free soldering applications. The laminate composite preform foil is composed of a high-melting, ductile metal or alloy core layer and a low-melting solder coating layer at either side of the core layer. During soldering, the core metal, liquid solder layer, and substrate metals react and consume the low-melting solder phase to form high-melting intermetallic compound phases (IMCs). The resultant solder joint is composed of a ductile core layer sandwiched by the IMCs layers at substrate sides. The joint has a much higher remelt temperature than the original melting temperature of the initial solder alloy coating, allowing subsequent mounting of packaged devices.
摘要翻译：本发明的各种实施例提供了用于高温无铅焊接应用的叠层复合预制箔。层叠复合预成型体箔由芯层的任一侧的高熔点，延性金属或合金芯层和低熔点焊料涂层构成。在焊接期间，芯金属，液体焊料层和基底金属反应并消耗低熔点焊料相以形成高熔点金属间化合物相（IMC）。所得到的焊点由在基板侧被IMC层夹持的延性芯层构成。接头具有比初始焊料合金涂层的原始熔化温度高得多的熔融温度，允许随后安装封装的装置。

3. 发明申请

US20070134125A1 Lead-Free Solder Alloys And Solder Joints Thereof With Improved Drop Impact Resistance 有权
标题翻译：无铅焊料合金及其焊点具有改善的耐滴落冲击性能
公开(公告)号：US20070134125A1
公开(公告)日：2007-06-14
申请号：US11567525
申请日：2006-12-06
申请人： Weiping Liu , Ning-Cheng Lee
发明人： Weiping Liu , Ning-Cheng Lee
IPC分类号： C22C13/00
CPC分类号： C22C13/00 , C22C13/02
摘要： Lead-free solder alloys and solder joints thereof with improved drop impact resistance are disclosed. In one particular exemplary embodiment, the lead-free solder alloys preferably comprise 0.0-4.0 wt. % of Ag, 0.01-1.5 wt. % of Cu, at least one of the following additives: Mn in an amount of 0.001-1.0 wt. %, Ce in an amount of 0.001-0.8 wt. %, Y in an amount of 0.001-1.0 wt. %, Ti in an amount of 0.001-0.8 wt. %, and Bi in an amount of 0.01-1.0 wt. %, and the remainder of Sn.
摘要翻译：公开了具有改进的耐滴落冲击性的无铅焊料合金及其焊点。在一个具体的示例性实施方案中，无铅焊料合金优选包含0.0-4.0wt。％的Ag，0.01-1.5wt。％的Cu，以下添加剂中的至少一种：Mn为0.001〜1.0重量％％，Ce为0.001-0.8wt。％，Y为0.001〜1.0重量％。％，Ti为0.001-0.8重量％％，Bi为0.01〜1.0重量％。％，剩余的Sn。

4. 发明授权

US09260768B2 Lead-free solder alloys and solder joints thereof with improved drop impact resistance 有权
标题翻译：无铅焊料合金及其焊点具有改善的耐滴落冲击性能
公开(公告)号：US09260768B2
公开(公告)日：2016-02-16
申请号：US11567525
申请日：2006-12-06
申请人： Weiping Liu , Ning-Cheng Lee
发明人： Weiping Liu , Ning-Cheng Lee
IPC分类号： C22C13/00 , C22C13/02
CPC分类号： C22C13/00 , C22C13/02
摘要： Lead-free solder alloys and solder joints thereof with improved drop impact resistance are disclosed. In one particular exemplary embodiment, the lead-free solder alloys preferably contain 0.0-4.0 wt. % of Ag, 0.01-1.5 wt. % of Cu, at least one of the following additives: Mn in an amount of 0.001-1.0 wt. %, Ce in an amount of 0.001-0.8 wt. %, Y in an amount of 0.001-1.0 wt. %, Ti in an amount of 0.001-0.8 wt. %, and Bi in an amount of 0.01-1.0 wt. %, and the remainder of Sn.
摘要翻译：公开了具有改进的耐滴落冲击性的无铅焊料合金及其焊点。在一个特定的示例性实施方案中，无铅焊料合金优选含有0.0-4.0wt。％的Ag，0.01-1.5wt。％的Cu，以下添加剂中的至少一种：Mn为0.001〜1.0重量％％，Ce为0.001-0.8wt。％，Y为0.001〜1.0重量％。％，Ti为0.001-0.8重量％％，Bi为0.01〜1.0重量％。％，剩余的Sn。

5. 发明授权

US08348139B2 Composite solder alloy preform 有权
标题翻译：复合焊料合金预制件
公开(公告)号：US08348139B2
公开(公告)日：2013-01-08
申请号：US12720532
申请日：2010-03-09
申请人： Weiping Liu , Ning-Cheng Lee
发明人： Weiping Liu , Ning-Cheng Lee
IPC分类号： B23K31/02
CPC分类号： B23K35/0238 , B23K35/26 , B23K35/262 , H01L24/29 , H01L24/83 , H01L2224/29083 , H01L2224/83101 , H01L2224/83801 , H01L2224/8381 , H01L2224/83825 , H01L2924/01322 , H01L2924/15747 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722 , H01L2924/00
摘要： Various embodiments of the invention provide laminate composite preform foils for high-temperature Pb-free soldering applications. The laminate composite preform foil is composed of a high-melting, ductile metal or alloy core layer and a low-melting solder coating layer at either side of the core layer. During soldering, the core metal, liquid solder layer, and substrate metals react and consume the low-melting solder phase to form high-melting intermetallic compound phases (IMCs). The resultant solder joint is composed of a ductile core layer sandwiched by the IMCs layers at substrate sides. The joint has a much higher remelt temperature than the original melting temperature of the initial solder alloy coating, allowing subsequent mounting of packaged devices.
摘要翻译：本发明的各种实施例提供了用于高温无铅焊接应用的叠层复合预制箔。层叠复合预成型体箔由芯层的任一侧的高熔点，延性金属或合金芯层和低熔点焊料涂层构成。在焊接期间，芯金属，液体焊料层和基底金属反应并消耗低熔点焊料相以形成高熔点金属间化合物相（IMC）。所得到的焊点由在基板侧被IMC层夹持的延性芯层构成。接头具有比初始焊料合金涂层的原始熔化温度高得多的熔融温度，允许随后安装封装的装置。

6. 发明授权

US09175368B2 MN doped SN-base solder alloy and solder joints thereof with superior drop shock reliability 有权
标题翻译： MN掺杂SN基焊料合金及其焊接接头具有出色的跌落冲击可靠性
公开(公告)号：US09175368B2
公开(公告)日：2015-11-03
申请号：US13542586
申请日：2012-07-05
申请人： Weiping Liu , Ning-Cheng Lee
发明人： Weiping Liu , Ning-Cheng Lee
IPC分类号： B23K35/26 , C22C13/00 , C22C13/02 , B23K35/02
CPC分类号： C22C13/00 , B23K35/0244 , B23K35/262 , C22C13/02 , Y10T403/479
摘要： A Sn—Ag—Cu-based lead-free solder alloy and solder joints thereof with superior drop shock reliability are disclosed. The solder contains between greater than 0 wt. % and less than or equal to about 1.5 wt. % Ag; between greater than or equal to about 0.7 wt. % and less than or equal to about 2.0 wt. % Cu; between greater than or equal to about 0.001 and less than or equal to about 0,2 wt. % Mn; and a remainder of Sn.
摘要翻译：公开了一种Sn-Ag-Cu基无铅焊料合金及其焊接接头，具有出色的跌落冲击可靠性。焊料含有大于0wt。％且小于或等于约1.5wt。％Ag; 大于或等于约0.7wt。％且小于或等于约2.0wt。％Cu; 大于或等于约0.001至小于或等于约0.2wt。％Mn; 和Sn的剩余部分。

7. 发明授权

US10010981B2 Materials having increased mobility after heating 有权
公开(公告)号：US10010981B2
公开(公告)日：2018-07-03
申请号：US12240396
申请日：2008-09-29
申请人： Ning-Cheng Lee , Runsheng Mao
发明人： Ning-Cheng Lee , Runsheng Mao
IPC分类号： B23K35/22 , B23K35/24
CPC分类号： B23K35/22 , B23K35/24
摘要： Materials having increased mobility after heating are disclosed. In one particular exemplary embodiment, the materials may be realized as a material which has reduced apparent molecular weight and/or viscosity and thus increased mobility after a heating process, and which consequently allows material residue to be more easily removed during subsequent cleaning processes. Such a material may be useful in any industrial process which requires heating the material followed by removing material residue.

8. 发明申请

US20110315429A1 METAL COATING FOR INDIUM BUMP BONDING 有权
标题翻译：金属涂层用于冲压粘结
公开(公告)号：US20110315429A1
公开(公告)日：2011-12-29
申请号：US13168505
申请日：2011-06-24
申请人： Sihai Chen , Ning-Cheng Lee
发明人： Sihai Chen , Ning-Cheng Lee
IPC分类号： H01B5/00 , B23K1/20 , B23K31/02
CPC分类号： H01L24/16 , H01L24/11 , H01L24/13 , H01L24/81 , H01L27/14618 , H01L27/14634 , H01L27/14636 , H01L2224/13109 , H01L2224/1357 , H01L2224/1358 , H01L2224/13582 , H01L2224/13583 , H01L2224/13599 , H01L2224/136 , H01L2224/13605 , H01L2224/13609 , H01L2224/13611 , H01L2224/13613 , H01L2224/13616 , H01L2224/13618 , H01L2224/81193 , H01L2224/81201 , H01L2224/81801 , H01L2924/00013 , H01L2924/01006 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15788 , H01L2924/00014 , H01L2924/01083 , H01L2924/0102 , H01L2224/13099 , H01L2924/00
摘要： A process of making efficient metal bump bonding with relative low temperature, preferably lower than the melting point of Indium, is described. To obtaining a lower processing temperature (preferred embodiments have a melting point of
摘要翻译：描述了以相对低的温度，优选低于铟的熔点进行有效的金属凸点接合的方法。为了获得较低的加工温度（优选实施方案具有<100℃的熔点），在铟凸块表面上沉积金属或合金层。优选地，选择材料使得金属或合金形成比下面的铟材料更耐氧化的钝化层。还优选选择钝化材料以在铟凸块表面上形成具有铟的低熔点合金。这通常通过将钝化材料扩散到铟中以形成扩散层合金来实现。可用于与铟形成二元至四元低熔点合金的各种金属，包括Ga，Bi，Sn，Pb和Cd。另外，Sn，Sn-Zn等金属向Ga-In合金中扩散; Sn，Cd，Pb-Sn合金成Bi-In合金; Cd，Zn，Pb，Pb-Cd成Sn-In合金可以帮助调整合金的熔点。

9. 发明申请

US20110273847A1 ALLOY COMPOSITIONS AND TECHNIQUES FOR REDUCING INTERMETALLIC COMPOUND THICKNESSES AND OXIDATION OF METALS AND ALLOYS 审中-公开
标题翻译：合金组合物和减少金属间化合物厚度和金属和合金氧化的技术
公开(公告)号：US20110273847A1
公开(公告)日：2011-11-10
申请号：US13099135
申请日：2011-05-02
申请人： Hong-Sik Hwang , Ning-Cheng Lee
发明人： Hong-Sik Hwang , Ning-Cheng Lee
IPC分类号： H05K7/20 , H05K7/00
CPC分类号： C22C28/00 , B23K35/24 , H01L23/3733 , H01L23/3736 , H01L23/42 , H01L23/4275 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2224/13105 , H01L2224/13109 , H01L2224/16221 , H01L2224/16225 , H01L2224/29101 , H01L2224/29105 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/2929 , H01L2224/29301 , H01L2224/29305 , H01L2224/29309 , H01L2224/29313 , H01L2224/32012 , H01L2224/32014 , H01L2224/81192 , H01L2224/83191 , H01L2224/83192 , H01L2924/00014 , H01L2924/01006 , H01L2924/01025 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/3651 , H01L2924/01048 , H01L2924/0108 , H01L2924/01083 , H01L2924/01015 , H01L2924/01022 , H01L2924/00 , H01L2924/01031 , H01L2224/29311 , H01L2924/00012 , H01L2224/05599
摘要： Alloy compositions and techniques for reducing IMC thickness and oxidation of metals and alloys are disclosed. In one particular exemplary embodiment, the alloy compositions may be realized as a composition of alloy or mixture consisting essentially of from about 90% to about 99.999% by weight indium and from about 0.001% to about 10% by weight germanium and unavoidable impurities. In another particular exemplary embodiment, the alloy compositions may be realized as a composition of alloy consisting essentially of from about 90% to about 99.999% by weight gallium and from about 0.001% to about 10% by weight germanium and unavoidable impurities.
摘要翻译：公开了用于降低金属和合金的IMC厚度和氧化的合金组成和技术。在一个具体的示例性实施方案中，合金组合物可以实现为基本上由约90重量％至约99.999重量％的铟和约0.001重量％至约10重量％的锗和不可避免的杂质组成的合金或混合物。在另一个具体的示例性实施方案中，合金组合物可以实现为基本上由约90重量％至约99.999重量％的镓和约0.001重量％至约10重量％的锗和不可避免的杂质组成的合金。

10. 发明申请

US20070092396A1 Technique For Increasing The Compliance Of Lead-Free Solders Containing Silver 有权
标题翻译：增加含银无铅焊料的合规性的技术
公开(公告)号：US20070092396A1
公开(公告)日：2007-04-26
申请号：US11550640
申请日：2006-10-18
申请人： Benlih Huang , Hong-Sik Hwang , Ning-Cheng Lee
发明人： Benlih Huang , Hong-Sik Hwang , Ning-Cheng Lee
IPC分类号： C22C13/00
CPC分类号： C22C13/00 , B23K35/262 , B23K35/3006
摘要： A technique for technique for increasing the compliance of lead-free solders containing silver is disclosed. In one particular exemplary embodiment, the technique may be realized as a Sn—Ag—Al alloy composition comprising (0.01-20)% Ag, (0.01-2)% Al, balanced with Sn. In another particular exemplary embodiment, the technique may be realized as a Sn—Ag—Cu—Al alloy composition comprising (0.01-20)% Ag, (0.01-1)% Cu, (0.01-2)% Al, balanced with Sn. In still another particular exemplary embodiment, the technique may be realized as a Sn—Ag—Al—Ni composition comprising (0.01-20)% Ag, (0.01-2)% Al, (0.01-4)% Ni, balanced with Sn. In yet another particular exemplary embodiment, the technique may be realized as a Sn—Ag—Cu—Al—Ni alloy composition comprising (0.01-20)% Ag, (0.01-1)% Cu, (0.01-2)% Al, (0.01-4)% Ni, balanced with Sn.
摘要翻译：公开了一种提高含银无铅焊料柔顺性的技术。在一个具体的示例性实施方案中，该技术可以实现为包含与Sn平衡的（0.01-20）％Ag，（0.01-2）％Al，Sn-Ag-Al合金组合物。在另一特定示例性实施方案中，该技术可以实现为包含（0.01-20）％Ag，（0.01-1）％Cu，（0.01-2）％Al，Sn与Sn平衡的Sn-Ag-Cu-Al合金组合物。在另一个具体的示例性实施方案中，该技术可以实现为包含（0.01-20）％Ag，（0.01-2）％Al，（0.01-4）％Ni，与Sn平衡的Sn-Ag-Al-Ni组合物。在另一个具体的示例性实施方案中，该技术可以实现为包含（0.01-20）％Ag，（0.01-1）％Cu，（0.01-2）％Al，Sn-Ag-Cu-Al- （0.01-4）％Ni，与Sn平衡。

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