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1. 发明申请

WO2005072031A2 CIRCUIT MATERIALS, CIRCUITS, MULTI-LAYER CIRCUITS, AND METHODS OF MANUFACTURE THEREOF 审中-公开
标题翻译：电路材料，电路，多层电路及其制造方法
公开(公告)号：WO2005072031A2
公开(公告)日：2005-08-04
申请号：PCT/US2005/003118
申请日：2005-01-19
申请人： WORLD PROPERTIES, INC. , SETHUMADHAVAN, Murali , LANDI, Vincent, R. , BORGES, Luis, D.
发明人： SETHUMADHAVAN, Murali , LANDI, Vincent, R. , BORGES, Luis, D.
IPC分类号： H05K1/03
CPC分类号： H05K1/032 , H05K1/0366 , H05K3/4626 , H05K2201/0162 , H05K2201/0212 , Y10T428/31663
摘要： An electrical circuit material having a conductive layer disposed a substrate, wherein the substrate comprises an organic or inorganic polymer comprising a covelently bound polyhedral silsesquioxane (POSS). The substrate may further comprise an additional dispersed POSS, any other fillers including fibrous webs. Use of covelently bound POSS allow for flame retardancy in compositions having acceptable dielectric constants and dissipation factors.
摘要翻译：一种具有设置在基底上的导电层的电路材料，其中所述基底包含有机或无机聚合物，其包含共价结合的多面体倍半硅氧烷（POSS）。基材还可以包含另外的分散POSS，任何其它填料，包括纤维网。使用分子结合的POSS可以使具有可接受的介电常数和耗散因子的组合物具有阻燃性。

2. 发明申请

WO2002080295A3 APPARATUS AND METHOD FOR ELECTROCHEMICAL CELL COMPONENTS 审中-公开
公开(公告)号：WO2002080295A3
公开(公告)日：2002-10-10
申请号：PCT/US2002/019875
申请日：2002-01-18
申请人： WORLD PROPERTIES INC. , DAIS ANALYTIC CORPORATION
发明人： FITTS, Bruce, B. , LANDI, Vincent, R. , ROY, Saroj, Kumar , JOHNSON, Brian, C. , EHRENBERG, Scott, G.
IPC分类号： H01M8/02
摘要： A component for an electrochemical cell comprises a thermally and electrically conductive core with an active area substantially covered by an electrically and thermally conductive polymeric composite, wherein the conductive polymeric composite is adhered to the core by an adhesion promoter. The electrically conductive polymeric composite preferably comprises a thermosetting polybutadiene-or polyisoprene- based resin system and an electrically conductive filler. The component is resistant to chemical attack and hydrolysis, and has excellent mechanical strength and toughness. Components may be manufactured having a volume resistivity of about 0.500 ohm-cm or less and a thermal conductivity of at least about 5 watts/meter °K,. In addition, the component is economical to produce due to inexpensive starting materials as well as the use of conventional processing equipment.

3. 发明申请

WO2002083328A1 METHOD FOR IMPROVING BONDING OF RIGID, THERMOSETTING COMPOSITIONS TO METAL AND ARTICLES FORMED THEREBY 审中-公开
标题翻译：用于改进刚性，热成型组合物与金属和形成的制品的方法
公开(公告)号：WO2002083328A1
公开(公告)日：2002-10-24
申请号：PCT/US2002/011665
申请日：2002-04-11
申请人： WORLD PROPERTIES INC.
发明人： LANDI, Vincent, R. , NEILL, John, T.
IPC分类号： B05D7/16
CPC分类号： B05D7/544 , B05D2202/45 , H05K3/386 , H05K3/389 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K2201/0133 , H05K2201/0358 , H05K2203/0759
摘要： A method for enhancing the adhesion between a metal surface and the surface of a curable thermosetting composition comprises contacting the metal surface with an aqueous emulsion or dispersion comprising an elastomeric polymer, drying the aqueous emulsion or dispersion to form an adhesion promoting polymer layer, contacting the adhesion promoting polymer layer with a curable thermosetting composition, and curing the thermosetting composition. The emulsion or dispersion can further comprise ionic or non-ionic surfactants, viscosity modifiers, coupling agents, wetting agents, fillers, reactive monomers, anti-oxidants and cross-linking agents. The method produces a circuit material comprising an adhesion promoting polymer layer disposed between a metal layer and a thermosetting composition. The circuit material has superior bond strength when compared to circuit materials that do not employ an adhesion promoting layer comprising an elastomeric polymer.
摘要翻译：一种用于增强金属表面和可固化热固性组合物的表面之间的粘合力的方法包括使金属表面与包含弹性体聚合物的水性乳液或分散体接触，干燥水性乳液或分散体以形成粘合促进聚合物层，粘合促进聚合物层和可固化的热固性组合物，并固化该热固性组合物。乳液或分散体还可以包含离子或非离子表面活性剂，粘度调节剂，偶联剂，润湿剂，填料，反应性单体，抗氧化剂和交联剂。该方法产生包含设置在金属层和热固性组合物之间的增粘聚合物层的电路材料。与不使用包含弹性体聚合物的粘合促进层的电路材料相比，电路材料具有优异的接合强度。

4. 发明申请

WO2002080295A2 APPARATUS AND METHOD FOR ELECTROCHEMICAL CELL COMPONENTS 审中-公开
标题翻译：电化学电池组件的装置和方法
公开(公告)号：WO2002080295A2
公开(公告)日：2002-10-10
申请号：PCT/US2002/019875
申请日：2002-01-18
申请人： WORLD PROPERTIES INC. , DAIS ANALYTIC CORPORATION
发明人： FITTS, Bruce, B. , LANDI, Vincent, R. , ROY, Saroj, Kumar , JOHNSON, Brian, C. , EHRENBERG, Scott, G.
IPC分类号： H01M8/02
CPC分类号： H01M8/0226 , C25B9/04 , H01M8/0206 , H01M8/0213 , H01M8/0221 , H01M8/0228 , H01M8/0258 , H01M8/0267 , H01M8/0297 , H01M8/04014 , H01M8/04074 , H01M2300/0082 , Y02P70/56
摘要： A component for an electrochemical cell comprises a thermally and electrically conductive core with an active area substantially covered by an electrically and thermally conductive polymeric composite, wherein the conductive polymeric composite is adhered to the core by an adhesion promoter. The electrically conductive polymeric composite preferably comprises a thermosetting polybutadiene-or polyisoprene- based resin system and an electrically conductive filler. The component is resistant to chemical attack and hydrolysis, and has excellent mechanical strength and toughness. Components may be manufactured having a volume resistivity of about 0.500 ohm-cm or less and a thermal conductivity of at least about 5 watts/meter °K,. In addition, the component is economical to produce due to inexpensive starting materials as well as the use of conventional processing equipment.
摘要翻译：用于电化学电池的部件包括导热和导电的芯，其具有基本上被导电和导热的聚合物复合材料覆盖的有源区域，其中所述导电聚合复合材料通过粘合促进剂粘附到芯体上。导电聚合复合材料优选包含热固性聚丁二烯 - 或聚异戊二烯基树脂体系和导电填料。该组分耐化学侵蚀和水解，具有优异的机械强度和韧性。可以制造具有约0.500欧姆 - 厘米或更小的体积电阻率和至少约5瓦特/米·K的热导率的部件。此外，由于廉价的起始材料以及常规加工设备的使用，该部件生产经济。

5. 发明申请

WO2003020000A1 METHOD FOR IMPROVING BONDING OF CIRCUIT SUBSTRATES TO METAL AND ARTICLES FORMED THEREBY 审中-公开
标题翻译：改善电路基板与金属接合的方法及其形成方法
公开(公告)号：WO2003020000A1
公开(公告)日：2003-03-06
申请号：PCT/US2002/026566
申请日：2002-08-21
申请人： WORLD PROPERTIES INC.
发明人： LANDI, Vincent, R. , NEILL, John, T. , MCALISTER, Bryan, C.
IPC分类号： H05K3/38
CPC分类号： H05K3/386 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K2201/0133 , H05K2201/0355 , H05K2201/0358
摘要： A method of forming a circuit material (30) comprises disposing an adhesion promoting elastomer composition (34) between a conductive copper foil (36) and a thermosetting composition (32); and laminating the copper foil (36), adhesion promoting composition (34), and thermosetting composition (32) to form the circuit material (30). The adhesion promoting layer (34) may be uncured or partially cured before contacting with the curable thermosetting composition (32). Preferably the adhesion promoting layer (34) has electrical characteristics such as dissipation factor, dielectric breakdown strength, water absorption, and dielectric constant that are similar to and/or compatible with the electrical characteristics of the thermosetting composition (32).
摘要翻译：形成电路材料（30）的方法包括在导电铜箔（36）和热固性组合物（32）之间设置粘合促进弹性体组合物（34）。并且层压铜箔（36），增粘组合物（34）和热固性组合物（32）以形成电路材料（30）。在与可固化热固性组合物（32）接触之前，粘合促进层（34）可以是未固化的或部分固化的。优选地，粘附促进层（34）具有类似于和/或与热固性组合物（32）的电特性相容的电气特性，例如耗散因数，介电击穿强度，吸水率和介电常数。

6. 发明申请

WO2003018213A3 SILANATED COPPER FOILS, METHOD OF MAKING, AND USE THEREOF 审中-公开
公开(公告)号：WO2003018213A3
公开(公告)日：2003-03-06
申请号：PCT/US2002/026523
申请日：2002-08-21
申请人： WORLD PROPERTIES INC.
发明人： LANDI, Vincent, R. , NEILL, John, T. , KIM, Ki-Soo
IPC分类号： H05K3/38
摘要： A coated foil comprises a thick silane layer disposed on the copper foil, wherein the silane layer is present in an amount greater than or equal to about 0.1 gram per square meter. The copper foil may further comprise thermal barrier. The silanated copper foil may further comprise an elastomer layer disposed on a side of the thick silane layer opposite the copper foil. When the silanated copper foil is used in the manufacture of circuit materials the circuit materials demonstrate improved bond retention after exposure to acidic processing conditions.

7. 发明授权

EP1023820B1 POLYBUTADIENE AND POLYISOPRENE BASED THERMOSETTING COMPOSITIONS AND METHOD OF MANUFACTURE 有权
标题翻译：热固性大众基于聚丁二烯和聚异戊二烯及其制备方法
公开(公告)号：EP1023820B1
公开(公告)日：2007-10-17
申请号：EP99941133.3
申请日：1999-08-12
申请人： WORLD PROPERTIES, INC.
发明人： LANDI, Vincent, R.
IPC分类号： H05K1/03 , C08L9/00
CPC分类号： C08L9/00 , C08K3/34 , C08K3/40 , C08K7/28 , C08L9/06 , C08L23/16 , C08L53/00 , H05K1/0203 , H05K1/032 , H05K1/0373 , H05K1/162 , H05K2201/0133 , H05K2201/0158 , H05K2201/0209 , H05K2201/0212 , H05K2201/0278 , Y10T442/2934 , Y10T442/2992 , Y10T442/3423 , Y10T442/3431 , Y10T442/3455 , C08L2666/04 , C08L2666/06 , C08L2666/08 , C08L2666/24
摘要： An electrical substrate material is presented comprising a thermosetting matrix which includes a polybutadiene or polyisoprene resin, an unsaturated butadiene- or isoprene-containing polymer and an ethylene propylene rubber; a particulate filler and, a fabric. Preferred ethylene propylene rubbers are ethylene propylene copolymers and ethylene propylene diene terpolymers rubbers wherein the diene is dicyclopentadiene. The ethylene propylene rubber is present in an amount of up to about 20 wt.% with respect to the resin, preferably in an amount of about 1 to about 7 wt.%, more preferably about 5 wt.%. The presence of the ethylene propylene rubber enhances the dielectric strength of the resulting electrical substrate material, while other electrical, chemical, and mechanical properties of the material are not adversely effected.

8. 发明公开

EP1023820A1 POLYBUTADIENE AND POLYISOPRENE BASED THERMOSETTING COMPOSITIONS AND METHOD OF MANUFACTURE 有权
标题翻译：热固性大众基于聚丁二烯和聚异戊二烯及其制备方法
公开(公告)号：EP1023820A1
公开(公告)日：2000-08-02
申请号：EP99941133.3
申请日：1999-08-12
申请人： WORLD PROPERTIES, INC.
发明人： LANDI, Vincent, R.
IPC分类号： H05K1/03 , C08L9/00
CPC分类号： C08L9/00 , C08K3/34 , C08K3/40 , C08K7/28 , C08L9/06 , C08L23/16 , C08L53/00 , H05K1/0203 , H05K1/032 , H05K1/0373 , H05K1/162 , H05K2201/0133 , H05K2201/0158 , H05K2201/0209 , H05K2201/0212 , H05K2201/0278 , Y10T442/2934 , Y10T442/2992 , Y10T442/3423 , Y10T442/3431 , Y10T442/3455 , C08L2666/04 , C08L2666/06 , C08L2666/08 , C08L2666/24
摘要： An electrical substrate material is presented comprising a thermosetting matrix which includes a polybutadiene or polyisoprene resin, an unsaturated butadiene- or isoprene-containing polymer and an ethylene propylene rubber; a particulate filler and, a fabric. Preferred ethylene propylene rubbers are ethylene propylene copolymers and ethylene propylene diene terpolymers rubbers wherein the diene is dicyclopentadiene. The ethylene propylene rubber is present in an amount of up to about 20 wt.% with respect to the resin, preferably in an amount of about 1 to about 7 wt.%, more preferably about 5 wt.%. The presence of the ethylene propylene rubber enhances the dielectric strength of the resulting electrical substrate material, while other electrical, chemical, and mechanical properties of the material are not adversely effected.

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