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    • 1. 发明专利
    • Film for forming electric circuit, and electric circuit and its manufacturing method
    • 用于形成电路的电路和电路及其制造方法
    • JP2004214502A
    • 2004-07-29
    • JP2003001291
    • 2003-01-07
    • Tsuchiya Co Ltd株式会社槌屋
    • TERATAKE MICHIYOYAMADA RYUICHIMARUI YOSHIO
    • H05K3/20
    • PROBLEM TO BE SOLVED: To provide a manufacturing method of an electric circuit capable of reducing or canceling various kinds of restriction caused by the quality of material of a substrate, where the electric circuit is to be formed, or a surface form.
      SOLUTION: A film 2 for forming the electric circuit is formed. The film 2 comprises a base film 4, a conductive material layer 8 having a plane form corresponding to an electric circuit pattern to be given onto the base film 4 while the electric circuit pattern can peel off, and a bonding layer 10 laminated to the conductive material layer. The film 2 allows the substrate to avoid the restriction caused by the quality of material of the substrate and the surface shape for easily forming the electric circuit by giving the bonding layer 10 with the conductive material layer 8.
      COPYRIGHT: (C)2004,JPO&NCIPI
    • 要解决的问题:提供一种能够减少或消除由要形成电路的基板的材料的质量或表面形式引起的各种限制的电路的制造方法。 解决方案:形成用于形成电路的膜2。 膜2包括基膜4,导电材料层8,其具有对应于在电路图案可剥离的基膜4上施加的电路图案的平面形状,以及层压到导电性的粘合层10 材料层。 膜2允许基板通过给导电材料层8赋予粘合层10而避免由基板的材料质量和容易形成电路的表面形状引起的限制。(C) 2004年,JPO&NCIPI