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1. 发明公开

EP2248855A4 PROCESS FOR PRODUCING RESIN COMPOSITION WITH PARTIAL-DISCHARGE RESISTANCE, RESIN COMPOSITION WITH PARTIAL-DISCHARGE RESISTANCE, AND INSULATING MATERIAL WITH PARTIAL-DISCHARGE RESISTANCE 审中-公开
标题翻译： VERFAHREN ZUR HERSTELLUNG EINER HARZZUSAMMENSETZUNG MIT TEILENTLADUNGSRESISTENZ，HARZZUSAMMENSETZUNG MIT TEILENTLADUNGSRESISTENZ UND ISOLIERMATERIAL MIT TEILENTLADUNGSRESISTENZ
公开(公告)号：EP2248855A4
公开(公告)日：2017-05-17
申请号：EP08872604
申请日：2008-08-04
申请人： TOSHIBA KK , A SCHOOL CORP KANSAI UNIV
发明人： OZAKI TAMON , IMAI TAKAHIRO , SAWA FUMIO , MURAYAMA KIYOKO , KOMIYA GEN , SHIMIZU TOSHIO , TODO YOKO , HOMMA MITSUTAKA , SAKAGUCHI OSAMU , OCHI MITSUKAZU , KURAYA MIYUKI
IPC分类号： C08G59/42 , C08K3/34 , H01B3/40 , H05K1/02 , H05K1/03
CPC分类号： H05K1/0373 , C08G59/42 , C08K3/346 , H01B3/40 , H05K1/0256 , H05K1/0257 , H05K2201/0209
摘要： Fabricating a partial discharge resistant resin composite with an excellent partial discharge resistance with a small density, in a simplified manner. Using an ion exchange treatment for intercalating an organic compound between layers of a layer clay mineral thereby providing the layer clay mineral with a swellability to at least one of a polar solvent and a non-polar solvent, having the layer clay mineral as provided with a swellability swollen in a swelling solvent comprising the polar solvent or the non-polar solvent, followed by mixing an epoxy resin and kneading, making a removal of the swelling solvent from an obtained mixture including the swelling solvent, the layer clay mineral, and the epoxy resin, adding a hardener for epoxy resin to the mixture including the layer clay mineral and the epoxy resin, and mixing the mixture. In a partial discharge resistant insulation material comprising a hardened material of a partial discharge resistant resin composite thus fabricated, there is a network of molecular chains (1) of the epoxy resin constituting a cross-linked structure, with a system of inorganic nanoparticles (2) comprising the layer clay mineral and precisely and evenly dispersed therein.
摘要翻译：以简单的方式制造具有优异的局部放电抗性且具有小密度的耐局部放电性树脂组合物。使用离子交换处理在层状粘土矿物的层之间插入有机化合物，由此使层状粘土矿物具有对至少一种极性溶剂和非极性溶剂的溶胀性，具有层状粘土矿物，在包含极性溶剂或非极性溶剂的溶胀溶剂中膨胀，然后混合环氧树脂并捏合，从得到的包含溶胀溶剂，层状粘土矿物和环氧树脂的混合物中除去溶胀溶剂向包括层状粘土矿物和环氧树脂的混合物中加入用于环氧树脂的固化剂，并混合该混合物。在包含如此制造的局部放电抗性树脂复合材料的硬化材料的耐局部放电绝缘材料中，存在构成交联结构的环氧树脂的分子链（1）网络与无机纳米粒子体系（2 ）包含层状粘土矿物并精确且均匀地分散于其中。

2. 发明公开

EP1107409A8 Switchgear and method of manufacturing thereof 有权
标题翻译：开关及其制造方法
公开(公告)号：EP1107409A8
公开(公告)日：2001-11-14
申请号：EP00126303
申请日：2000-12-01
申请人： TOSHIBA KK
发明人： ITO YOSHIHIRO , KINOSHITA SUSUMU , MAKISHIMA SATOSHI , SEKIYA HIROKI , MIYAGAWA MASARU , SHIMIZU TOSHIO
IPC分类号： H02B13/02 , H01H11/00 , H01H31/00 , H01H33/02 , H01H33/66 , H02B1/56 , H02B13/01 , H02B13/035
CPC分类号： H02B1/56 , H01H11/0031 , H01H31/003 , H01H33/027 , H01H33/66 , H01H2009/523 , H01H2033/566 , H01H2033/6613 , H01H2033/6623 , H02B13/01 , H02B13/0354
摘要： By molding a plurality of vacuum valves (7),(13) having differing functions together with an input member (3) and an output member (21) en bloc in a resin layer (23) to form a switchgear (1), the present invention seeks to achieve dielectric strength without resorting to the use of SF6 gas, while rendering the whole device more compact and reducing both the number of parts and the man hours required for molding.

3. 发明公开

EP2058366A4 CASTING RESIN COMPOSITION, INSULATING MATERIAL USING THE SAME, AND INSULATING STRUCTURE 审中-公开
标题翻译：铸造树脂，绝缘在使用和绝缘结构
公开(公告)号：EP2058366A4
公开(公告)日：2015-02-18
申请号：EP07792782
申请日：2007-08-21
申请人： TOSHIBA KK
发明人： IMAI TAKAHIRO , OZAKI TAMON , SAWA FUMIO , KINOSHITA SUSUMU , KOMIYA GEN , MURAYAMA KIYOKO , SHIMIZU TOSHIO , SAKAGUCHI OSAMU , HOMMA MITSUTAKA , TANAKA TOSHIKATSU
IPC分类号： C08L63/00
CPC分类号： H01B3/40 , B82Y30/00 , C08G59/42 , C08L51/04 , C08L63/00 , H01B3/28 , H01B3/44 , H01H2033/6623 , C08L2666/02 , C08L2666/14

4. 发明专利

CA2255441A1 PACKAGE FOR SEMICONDUCTOR POWER DEVICE AND METHOD FOR ASSEMBLING THE SAME 未知
公开(公告)号：CA2255441A1
公开(公告)日：1999-06-08
申请号：CA2255441
申请日：1998-12-07
申请人： TOSHIBA KK
发明人： SHIMIZU TOSHIO , HIRAMOTO HIROYUKI , SEKIYA HIROKI , KIJIMA KENJI
IPC分类号： H01L23/24 , H01L23/31 , H01L23/433 , H01L23/34
摘要： A package for a semiconductor power device which comprises: a conductive bottom plate as a heat sink; an insulating substrate mounted on the bottom plate; a copper film formed on the insulating substrate to expose a peripheral region of the insulating substrate; semiconductor chips disposed on the copper film; a container arranged on the bottom plate, surrounding the insulating substrate; an external terminal supported through the container and connected electrically with the semiconductor chips; and a silicone gel filled within the container, wherein a solidified insulating material is disposed on an outer edge region of the copper film and the peripheral region of the insulating substrate. Thus, reducing an electric field across the interface and making it difficult to cause a creeping discharge. A notch is formed in the bottom plate, and the notch is filled with a high heat conductive resin. The notch is located outwardly apart from a region where the semiconductor chips are mounted. Thus, a creeping breakdown is prevented without sacrificing a heat radiation effect of the bottom plate. Using a waterproof and flexible film to seal an inlet for filling the silicone gel into the case, a heat stress caused by an expansion and a shrinkage of the silicone gel in response to a variation of temperatures is reduced, and it prevents the silicone gel from being wet. A thermoplastic insulating resin is employed instead of the silicone gel.

5. 发明专利

DE602005002724D1 未知
公开(公告)号：DE602005002724D1
公开(公告)日：2007-11-15
申请号：DE602005002724
申请日：2005-12-22
申请人： TOSHIBA KK
发明人： YOKOKURA KUNIO , SHIOIRI TETSU , SAKAGUCHI OSAMU , SHIMIZU TOSHIO , MIYAGAWA MASARU , KINOSHITA SUSUMU , MAKISHIMA SATOSHI , SATO JUNICHI
IPC分类号： H01H33/24
摘要： A switchgear has an insulating container (2) filled with an insulating gas, a fixed current-carrying shaft (5) fixed airtightly to one opening of the insulating container, a fixed contact (4) provided on an end of the fixed current-carrying shaft in the insulating container, a movable contact (6) configured to separably contact the fixed contact, a movable current-carrying shaft (7) having the movable contact provided on an end and airtightly movably penetrating the other opening of the insulating container, and an operation mechanism (17) coupled with the movable current-carrying shaft at an outside of the insulating container. The insulating container is constituted by a plurality of insulating layers, and the insulating layers are higher in dielectric constant as closer to an inside of the insulating container.

6. 发明专利

CA2255441C PACKAGE FOR SEMICONDUCTOR POWER DEVICE AND METHOD FOR ASSEMBLING THE SAME 未知
公开(公告)号：CA2255441C
公开(公告)日：2003-08-05
申请号：CA2255441
申请日：1998-12-07
申请人： TOSHIBA KK
发明人： SHIMIZU TOSHIO , HIRAMOTO HIROYUKI , SEKIYA HIROKI , KIJIMA KENJI
IPC分类号： H01L23/24 , H01L23/31 , H01L23/433 , H01L23/34
摘要： A package for a semiconductor power device which comprises: a conductive bottom plate as a heat sink; an insulating substrate mounted on the bottom plate; a copper film formed on the insulating substrate to expose a peripheral region of the insulating substrate; semiconductor chips disposed on the copper film; a container arranged on the bottom plate, surrounding the insulating substrate; an external terminal supported through the container and connected electrically with the semiconductor chips; and a silicone gel filled within the container, wherein a solidified insulating material is disposed on an outer edge region of the copper film and the peripheral region of the insulating substrate. Thus, reducing an electric field across the interface and making it difficult to cause a creep ing discharge. A notch is formed in the bottom plate, and the notch is filled with a high heat conductive resin. The notch is located outwardly apart from a region where the semiconductor chips are mounted. Thus, a creeping breakdown is prevented without sacrificing a heat radiation effect of the bottom plate. Using a waterproof and flexible film to seal an inlet for filling the silicone gel into the case, a heat stress caused by an expan sionand a shrinkage of the silicone gel in response to a variation of temperaturesis reduced, and it prevents the silicone gel from being wet. A thermoplastic insulating resin is employed instead of the silicone gel.

7. 发明专利

DE60044634D1 Schalter und dessen Herstellungsverfahren 未知
公开(公告)号：DE60044634D1
公开(公告)日：2010-08-19
申请号：DE60044634
申请日：2000-12-01
申请人： TOSHIBA KK
发明人： ITO YOSHIHIRO , KINOSHITA SUSUMU , MAKISHIMA SATOSHI , SEKIYA HIROKI , MIYAGAWA MASARU , SHIMIZU TOSHIO
IPC分类号： H02B13/02 , H02B13/035 , H01H11/00 , H01H31/00 , H01H33/02 , H01H33/66 , H02B1/56 , H02B13/01

8. 发明专利

DE602005002724T2 未知
公开(公告)号：DE602005002724T2
公开(公告)日：2008-07-24
申请号：DE602005002724
申请日：2005-12-22
申请人： TOSHIBA KK
发明人： YOKOKURA KUNIO , SHIOIRI TETSU , SAKAGUCHI OSAMU , SHIMIZU TOSHIO , MIYAGAWA MASARU , KINOSHITA SUSUMU , MAKISHIMA SATOSHI , SATO JUNICHI
IPC分类号： H01H33/24
摘要： A switchgear has an insulating container (2) filled with an insulating gas, a fixed current-carrying shaft (5) fixed airtightly to one opening of the insulating container, a fixed contact (4) provided on an end of the fixed current-carrying shaft in the insulating container, a movable contact (6) configured to separably contact the fixed contact, a movable current-carrying shaft (7) having the movable contact provided on an end and airtightly movably penetrating the other opening of the insulating container, and an operation mechanism (17) coupled with the movable current-carrying shaft at an outside of the insulating container. The insulating container is constituted by a plurality of insulating layers, and the insulating layers are higher in dielectric constant as closer to an inside of the insulating container.

9. 发明专利

JP2723328B2 失效
公开(公告)号：JP2723328B2
公开(公告)日：1998-03-09
申请号：JP4812490
申请日：1990-02-28
申请人： TOSHIBA KK
发明人： YANO TOSHUKI , MIKATA YASUHIRO , SHIMIZU TOSHIO , YANAGI NAOHIKO
IPC分类号： B66B11/02

10. 发明专利

JPS6248592B2 失效
公开(公告)号：JPS6248592B2
公开(公告)日：1987-10-14
申请号：JP1734982
申请日：1982-02-05
申请人： NIPPON DENSHIN DENWA KK , TOSHIBA KK
发明人： SHIMIZU TOSHIO , FUJII YASUO
IPC分类号： B41J2/32 , B41J25/312 , H04N1/024

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