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1. 发明申请

WO9901771A8 SENSOR WITH DIAPHRAGM SENSOR CHIP 审中-公开
标题翻译：带传感器传感器的传感器
公开(公告)号：WO9901771A8
公开(公告)日：1999-03-25
申请号：PCT/JP9802992
申请日：1998-07-02
申请人： TOKAI RIKA CO LTD , IWATA HITOSHI , KANBE MASAKATA
发明人： IWATA HITOSHI , KANBE MASAKATA
IPC分类号： G01P21/00 , G01P1/00 , G01P1/02 , G01P15/12 , H01L23/29 , H01L23/31 , G01L9/06 , H01L29/84
CPC分类号： G01P15/122 , G01P1/006 , G01P1/02 , G01P1/023 , H01L2224/05554 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： An acceleration sensor with a diaphragm sensor chip (6) which includes a plurality of lead frames (3). One of the lead frames (3) has a die pad (4). The sensor chip (6) is elastically bonded with an adhesive (10) onto the die pad (4). The sensor chip (6) has a diaphragm (6b) and outputs a signal representing the flexure of the diaphragm (6b). The lead frames (3) are encapsulated with the molding material (2), with a space around the sensor chip (6). The molding material has a linear expansion coefficient of 1.4x10 / DEG C to 1.8x10 / DEG C and an elastic modulus of 100x10 kg/cm to 130x10 kg/cm . The use of such a molding material (2) decreases the rate of change of the temperature sensitivity of the acceleration sensor, thus providing an acceleration sensor with excellent temperature characteristics.
摘要翻译：一种具有膜片传感器芯片（6）的加速度传感器，其包括多个引线框架（3）。引线框架（3）中的一个具有管芯焊盘（4）。传感器芯片（6）用粘合剂（10）弹性粘合到芯片焊盘（4）上。传感器芯片（6）具有隔膜（6b）并输出表示隔膜（6b）的挠曲的信号。引线框架（3）用模制材料（2）封装，在传感器芯片（6）周围具有空间。模塑材料的线性膨胀系数为1.4×10 -5至1.8×10 -5 /℃，弹性模量为100×10 3 kg / cm 2至130×10 3 kg / 厘米<2>。使用这种成型材料（2）降低加速度传感器的温度敏感度的变化率，从而提供具有优异的温度特性的加速度传感器。

2. 发明专利

DE69908705T2 未知
公开(公告)号：DE69908705T2
公开(公告)日：2004-04-29
申请号：DE69908705
申请日：1999-04-30
申请人： TOKAI RIKA CO LTD
发明人： KANBE MASAKATA , IWATA HITOSHI , MINAMI KATSUHIRO , KOGISO KATSUYA , SUZUKI TAKASHI , TANIGUCHI MASAHIRO
IPC分类号： G01B7/30 , G01B7/00 , G01D5/14 , G01D5/16 , G01D5/245 , G01P3/488 , H01L43/08 , H02K29/08 , H02K11/00

3. 发明专利

DE60133957D1 未知
公开(公告)号：DE60133957D1
公开(公告)日：2008-06-26
申请号：DE60133957
申请日：2001-02-19
申请人： TOKAI RIKA CO LTD
发明人： KANBE MASAKATA , TANIGUCHI MASAHIRO , KOGISO KATSUYA , TAJIMA MASAYA
IPC分类号： A44B11/25 , B60R22/48 , B60R22/12
摘要： A buckle device (10) in which it can be detected whether or not a tongue plate (36) inserted into a case is locked, and in which reliability of such detection is high. In the buckle device (10), a magnetic plate is provided at a leg portion (68) which moves together with the tongue plate which is inserted into an interior of the case. Changes in orientation of a magnetic field of a magnet (116) of a sensing section (112), which orientation varies due to the magnetic plate approaching and moving away from the magnet, are detected at an MRE sensor (118).

4. 发明专利

DE69908705D1 未知
公开(公告)号：DE69908705D1
公开(公告)日：2003-07-17
申请号：DE69908705
申请日：1999-04-30
申请人： TOKAI RIKA CO LTD
发明人： KANBE MASAKATA , IWATA HITOSHI , MINAMI KATSUHIRO , KOGISO KATSUYA , SUZUKI TAKASHI , TANIGUCHI MASAHIRO
IPC分类号： G01B7/30 , G01B7/00 , G01D5/14 , G01D5/16 , G01D5/245 , G01P3/488 , H01L43/08 , H02K29/08 , H02K11/00

5. 发明专利

JP2006047228A Rotation angle detecting device 审中-公开
标题翻译：旋转角度检测装置
公开(公告)号：JP2006047228A
公开(公告)日：2006-02-16
申请号：JP2004231644
申请日：2004-08-06
申请人： Tokai Rika Co Ltd , 株式会社東海理化電機製作所
发明人： KANBE MASAKATA , EGUCHI TOMOYA , ITOIGAWA KOICHI
IPC分类号： G01D5/245
摘要： PROBLEM TO BE SOLVED: To provide an angle-of-rotation sensitive device for securing precision of an angle-of-rotation calculation, even if sensitive sensitivity of a sensitive element is lowered and simplifying the angle-of-rotation calculations.
SOLUTION: When a vehicle is started with engine, the angle-of-rotation sensing device 1 is started, and a calculation circuit 12 inputs a sine value Y1 and a cosine value Y2 through an A/D converter 10 from magnetic sensors 6 and 7. The calculation circuit 12 calculates arctangent function, to calculate the arctangent value Vh and calculates the angle of rotation θ of a magnet 3 from the arctangent value Vh. In addition, the magnetic sensors 6 and 7 are used under the same bias conditions, namely, with the same impression voltage. Thus, since the amplitude A1 of a sine signal Sa output from the magnetic sensor 6 and an amplitude A2 of a cosine signal Sb output from the magnetic sensor 7 are the same value, the amplitude A1 of the sine value Y1 and the amplitude A2 of the cosine value Y2 are canceled, when the arctangent value Vh is calculated.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：即使敏感元件的灵敏度降低并且简化旋转角度计算，也可提供用于确保旋转角度计算精度的旋转角度敏感装置。解决方案：当车辆起动发动机时，转角检测装置1启动，计算电路12通过A / D转换器10从磁传感器输入正弦值Y1和余弦值Y2 计算电路12计算反正切函数，计算反正切值Vh，并根据反正切值Vh计算磁体3的旋转角θ。此外，磁传感器6和7在相同的偏压条件下使用，即具有相同的印刷电压。因此，由于从磁传感器6输出的正弦信号Sa的振幅A1和从磁传感器7输出的余弦信号Sb的振幅A2相同，因此正弦值Y1的振幅A1和振幅A2 当计算反正切值Vh时，余弦值Y2被取消。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2001239873A CHILD SEAT DETECTING DEVICE 失效
公开(公告)号：JP2001239873A
公开(公告)日：2001-09-04
申请号：JP2000051701
申请日：2000-02-28
申请人： TOKAI RIKA CO LTD
发明人： SAITO HIROSHI , OTAKI KIYOKAZU , KANBE MASAKATA
IPC分类号： G01B21/00 , B60N2/28 , B60N2/90 , B60R21/01 , B60R21/015 , B60R21/16 , B60N2/44 , B60R21/32
摘要： PROBLEM TO BE SOLVED: To provide a child seat detecting device capable of surely detecting whether the child seat is mounted or not. SOLUTION: A photosensor 78 is housed in a case 72, the light as a measurement signal emitted from a luminescent element 80 of the photosensor 78 is ordinarily reflected by a bar body 20, and received by a light receiving element 82, and the time from the emission of the light from the luminescent element 80 to the reception by the light receiving element 82 is measured by a computer 84 to calculate a distance from the case 72 to the bar body 20. In a mounting state of the child seat where a lock piece 40 of a striker 38 is located between the bar body 20 and the case 72, the light is reflected by the lock piece 40, and the distance calculated by the computer 84 becomes short. When the child seat is not mounted, the distance to the lock piece 40 can not be calculated, so that whether the child seat is mounted or not can be surely detected.

7. 发明专利

JP2001239867A CHILD SEAT DETECTING DEVICE 失效
公开(公告)号：JP2001239867A
公开(公告)日：2001-09-04
申请号：JP2000051703
申请日：2000-02-28
申请人： TOKAI RIKA CO LTD
发明人： SAITO HIROSHI , OTAKI KIYOKAZU , KANBE MASAKATA
IPC分类号： B60N2/28 , B60N2/90 , B60N2/44
摘要： PROBLEM TO BE SOLVED: To provide a child seat detecting device capable of detecting a child seat in either connector-type or hook-type connecting structure. SOLUTION: A supporting member 72 is mounted on a lower part of a lock bar 14, and an oscillating blade 82 made of a magnetic body is pivoted on the supporting member 72 revolvably in its lateral direction as an axial direction. The oscillating blade 82 is pressed to a frame 34 and revolved when the frame 34 is engaged with the lock bar 14 in a state that a bar body 20 enteres a bar insertion port 36 of the frame 34. A magnetic sensor unit 92 detects the revolving of the oscillating blade 82. Here, since the lateral direction of the oscillating blade 82 is the axial direction, its axial length can be determined to be comparatively long. Thereby, the strength of the oscillating blade 82 can be ensured.

8. 发明专利

JP2001233093A CHILD SEAT DETECTING DEVICE 失效
公开(公告)号：JP2001233093A
公开(公告)日：2001-08-28
申请号：JP2000043417
申请日：2000-02-21
申请人： TOKAI RIKA CO LTD , TOYOTA MOTOR CORP
发明人： SAITO HIROSHI , OTAKI KIYOKAZU , KANBE MASAKATA , KAWAI YOSHITAKA
IPC分类号： B60N2/28
摘要： PROBLEM TO BE SOLVED: To provide a child seat detecting device capable of securely detecting whether a child seat is installed or not. SOLUTION: A plunger 82 to be slid in relation to a plunger 76 in a direction for coming close and separating to/from a bar body 20 is provided inside of the plunger 76 to be slid in a direction for coming close and separating to/from the bar body 20. When a frame 34 pushes the plunger 76 to the predetermined position, connection of the plungers 76, 82 by a solenoid 98 is released, and the plunger 82 is inserted into a bar insertion port 36. In this condition, when a lock piece 40 is lowered, the plunger 82 abuts on the lock piece 40 and while a sliding contact 86 of the plunger 82 and a fixed contact 88 of the plunger 76 are brought in contact with each other for electrical continuity, and when the lock piece 40 is not lowered, the plunger 82 is slid till it abuts on the bar body 20, and the sliding contact 86 and the fixed contact 88 are not brought in contact with each other.

9. 发明专利

JPH11340480A PLASTIC PACKAGE 失效
公开(公告)号：JPH11340480A
公开(公告)日：1999-12-10
申请号：JP13995098
申请日：1998-05-21
申请人： TOKAI RIKA CO LTD
发明人： KANBE MASAKATA , IWATA HITOSHI
IPC分类号： H01L23/29 , H01L23/02 , H01L23/31 , H01L31/02
摘要： PROBLEM TO BE SOLVED: To provide a package structure having excellent temperature impact resistance with reduced effect of a thermal stress to be applied to a photo device chip. SOLUTION: A body 4 for constituting this package 1 is formed of an insulating molding resin material 2. A chip containing cylinder 8 of a part of the body 4 is formed at a position for enclosing a die pad 5 having a die area in a lead frame 3. A photo device chip 6 is mounted on the die area. The chip 6 is encapsulated by an insulating and translucent encapsulant 9 fully filled in the cylinder 8. The encapsulant 9 has an at least smaller elastic coefficient than that of the material 2.

10. 发明专利

JPH11340404A LEAD FRAME AND MANUFACTURE OF PLASTIC PACKAGE USING THE SAME 失效
公开(公告)号：JPH11340404A
公开(公告)日：1999-12-10
申请号：JP14124698
申请日：1998-05-22
申请人： TOKAI RIKA CO LTD
发明人： KANBE MASAKATA , TANIGUCHI MASAHIRO
IPC分类号： H01L23/50
摘要： PROBLEM TO BE SOLVED: To provide a method by which a plastic package can be manufactured with high workability and inexpensively. SOLUTION: A lead frame 2 is used at the time of performing such an insert molding that the molded surface in a parts housing space formed of a molding resin 5 and the external surface of an inner lead section 3 are flush with each other. At a prescribed position in the inner lead section 3, a ruggedness structure 11 is formed for preventing the formation of molding burrs. After the insert molding is performed with the use of the lead frame 2, a conductor 9 is bonded to a region where the recessing and projecting structure 11 is formed by using the region as a conductor bonding area B1.

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