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1. 发明授权

US3608711A Package for electronic devices and the like 失效
标题翻译：电子设备和类似的包装
公开(公告)号：US3608711A
公开(公告)日：1971-09-28
申请号：US3608711D
申请日：1969-10-06
申请人： TELEDYNE INC
发明人： WIESLER MORDECHAI , MACLNTYRE JOHN S
IPC分类号： B65D73/02 , B65D85/30
CPC分类号： B65D73/02 , Y10S414/135
摘要： Small, fragile products such as transistors, diodes and integrated-circuit dice are packaged on a tape which may be indexed through various production stages. The tape is formed with spaced apertures closed on one side by means of a pressuresensitive adhesive wall bonded to one side of the tape. Devices are dropped onto the wall and adhere thereto. Sprocket holes are formed along the marginal edge of the tape for engagement with an indexing drive mechanism.

2. 发明专利

DE1962577A1 未知
公开(公告)号：DE1962577A1
公开(公告)日：1970-08-13
申请号：DE1962577
申请日：1969-12-13
申请人： TELEDYNE INC
发明人： WIESLER MORDECHAI , MARTINONIS VIRGIL , S MACINTYRE JOHN
IPC分类号： H01L21/66 , B07C5/34 , B07C5/344 , G01R31/28 , G01R31/311 , H01L21/00 , G01R31/22
摘要： 1289840 Handling semi-conductor devices TELEDYNE Inc 15 Dec 1969 [19 Dec 1968] 40682/71 Divided out of 1289837 Heading H1K [Also in Division B8] The subject-matter of the Specification is included in the Specification 1,289,837, but the claims relate to apparatus for handling a flexible tape 140 having sprocket holes 142 along one margin and spaced openings 144 in which are situated semi-conductor devices 100 stuck to an adhesive web 146 bonded to one side of the tape 140. The apparatus includes guide surfaces 158, 160 which direct the intermittently advanced tape 140 from a supply reel 148 to a position between a vacuum probe 80 and a needle 164, both of which members are vertically reciprocable, and hence to a take-up reel 154. The apparatus may be used to place devices 100 supplied by the vacuum probe 80, which is one of several arranged around a turret indexer, on the adhesive web 146 through the openings 144, or may alternatively be used to feed devices 100 from the tape 140 to the vacuum probe 80. In the latter case the reciprocating needle 164 is used to push against the web 146 to displace the device 100 upwardly through the opening 144.

3. 发明授权

US3648169A Probe and head assembly 失效
标题翻译：探头和头组件
公开(公告)号：US3648169A
公开(公告)日：1972-03-07
申请号：US3648169D
申请日：1969-05-26
申请人： TELEDYNE INC
发明人： WIESLER MORDECHAI
IPC分类号： G01R1/067 , G01R31/22
CPC分类号： G01R1/06705 , G01R1/067
摘要： A probe and head assembly is provided for use particularly in testing electronically microelectronic devices such as integrated circuit wafers and the like. A very thin probe tip of one piece construction is formed with an integral parallel beam construction and plugs into the head assembly which is adjustable in different coordinate directions.
摘要翻译：提供探头和头部组件，用于特别用于测试电子微电子器件如集成电路晶片等。单件结构的非常薄的探针尖端形成有一体的平行梁结构，并插入头部组件中，该组件可在不同的坐标方向上调节。

4. 发明授权

US3695414A Die sorting system 失效
标题翻译： DIE分拣系统
公开(公告)号：US3695414A
公开(公告)日：1972-10-03
申请号：US3695414D
申请日：1970-11-27
申请人： TELEDYNE INC
发明人： WIESLER MORDECHAI , MARTINONIS VIRGIL , MACINTYRE JOHN S
IPC分类号： B07C5/344 , H05K13/00 , B65G35/00
CPC分类号： H05K13/003 , B07C5/344
摘要： A wafer of semiconductor devices is tested to determine the quality of each device. The test data with respect to each die is electro-optically encoded and photographically recorded in a pattern corresponding to the die pattern on the wafer. Upon completion of the testing and recording operations the wafer is scored, mounted on a flexible pressure sensitive adhesive web and broken so as to separate the dies from one another while maintaining their original orientation. The dice and their respective test record are then mounted on a common frame, side by side, so that each die and its test data are readily matched. The frame is then mounted on a die sorting mechanism comprised of an XY indexing table which indexes through an electrooptical reader where the test data is read out to designate the die to a selected delivery station.
摘要翻译：测试半导体器件的晶圆以确定每个器件的质量。相对于每个管芯的测试数据以对应于晶片上的管芯图案的图案进行电光编码和照相记录。在完成测试和记录操作之后，将晶片刻痕，安装在柔性压敏粘合剂纤维网上并断裂，以便将模具彼此分离，同时保持它们的原始取向。然后将骰子及其各自的测试记录并排安装在共同的框架上，使得每个管芯及其测试数据容易匹配。然后将框架安装在由XY索引表组成的模具分类机构上，该索引工作台通过电光读取器进行索引，其中读取测试数据以将模具指定到所选择的传送站。

5. 发明授权

US3702923A Die sorting system 失效
标题翻译： DIE分拣系统
公开(公告)号：US3702923A
公开(公告)日：1972-11-14
申请号：US3702923D
申请日：1970-11-27
申请人： TELEDYNE INC
发明人： WIESLER MORDECHAI , MARTINONIS VIRGIL , MACINTYRE JOHN S
IPC分类号： B07C5/344 , G01R31/28 , G06K7/10
CPC分类号： G01R31/2851 , B07C5/344 , G01R31/2893
摘要： A wafer of semiconductor devices is tested to determine the quality of each device. The test data with respect to each die is electro-optically encoded and photographically recorded in a pattern corresponding to the die pattern on the wafer. Upon completion of the testing and recording operations the wafer is scored, mounted on a flexible pressure sensitive adhesive web and broken so as to separate the dies from one another while maintaining their original orientation. The dice and their respective test record are then mounted on a common frame, side by side, so that each die and its test data are readily matched. The frame is then mounted on a die sorting mechanism comprised of an XY indexing table which indexes the wafer die by die through a removal station and the film indexed through an electro-optical reader where the test data is read out to designate the die to a selected delivery station.
摘要翻译：测试半导体器件的晶圆以确定每个器件的质量。相对于每个管芯的测试数据以对应于晶片上的管芯图案的图案进行电光编码和照相记录。在完成测试和记录操作之后，将晶片刻痕，安装在柔性压敏粘合剂纤维网上并断裂，以便将模具彼此分离，同时保持它们的原始取向。然后将骰子及其各自的测试记录并排安装在共同的框架上，使得每个管芯及其测试数据容易匹配。然后将框架安装在由XY分度台组成的模具分拣机构上，该分度台通过模具将晶片模片通过去除站进行索引，并且通过电光读取器索引薄膜，其中读出测试数据以将模具指定为选择送货站。

6. 发明授权

US3900244A Visual selection and precision isolation system for microelectronic units 失效
标题翻译：微电子单元的视觉选择和精密隔离系统
公开(公告)号：US3900244A
公开(公告)日：1975-08-19
申请号：US48621774
申请日：1974-07-05
申请人： TELEDYNE INC
发明人： WIESLER MORDECHAI , MCCARRON JOHN C
IPC分类号： G02B21/00 , G02B21/20
CPC分类号： G02B21/20 , G02B21/0016
摘要： In a system for visually selecting and precisely isolating microelectronic units, two object fields communicate via a beam splitter arrangement with a binocular component, and bright cross hairs are imaged on one of the object fields by a projector component, so that adjusting the position of a wafer supporting the microelectronic units permits precise location of any unit at the center of the cross hairs for visual examination of its top face in one of the object fields, for visual examination of its bottom face in the other of the object fields, and for precision movement with respect to the center of the cross hairs to any selected location.

7. 发明授权

US3668044A Apparatus for bonding semi-conductive devices 失效
标题翻译：用于连接半导体器件的装置
公开(公告)号：US3668044A
公开(公告)日：1972-06-06
申请号：US3668044D
申请日：1970-04-09
申请人： TELEDYNE INC
发明人： WIESLER MORDECHAI , MACINTYRE JOHN S
IPC分类号： H01L21/00 , B32B31/20
CPC分类号： H01L21/67144 , Y10T156/1744
摘要： Semi-conductive devices are assembled and bonded to package bases on an automatic basis. The devices are transferred one at a time from a tape indexing unit onto an indexing carrier which convey package assemblies through a heating zone prior to receipt of the dice. The tape indexer includes a drive mechanism adapted to feed a tape carrying a plurality of longitudinally spaced dice past a pick-off point where a vacuum transfer arm moves an individual die from the tape to a pre-positioned and pre-heated package unit on the carrier. The transfer arm includes a vibratory tip to produce a scrubbing motion between the die and the lead to enhance the bonding action between the parts.
摘要翻译：半导体器件自动组装并结合到封装基座上。这些装置一次一个地从带索引单元传送到索引载体上，索引载体在收到骰子之前通过加热区传送包装组件。带索引器包括驱动机构，其适于将承载多个纵向隔开的骰子的带材通过拾纸点，真空传送臂将单独的模具从带移动到预定位和预加热的包装单元载体传送臂包括振动尖端，以在模具和引线之间产生擦洗运动，以增强部件之间的接合作用。

8. 发明授权

US3436132A Slide assembly 失效
标题翻译：幻灯片总成
公开(公告)号：US3436132A
公开(公告)日：1969-04-01
申请号：US3436132D
申请日：1966-05-02
申请人： TELEDYNE INC
发明人： WIESLER MORDECHAI
IPC分类号： F16C29/00 , F16C29/06 , F16C29/12 , F16C33/61 , F16C17/00 , F16C19/00 , F16C21/00
CPC分类号： F16C29/0623 , F16C29/005 , F16C29/0671 , F16C29/12 , F16C33/61

9. 发明专利

GB1271128A METHOD AND APPARATUS FOR SORTING SEMI-CONDUCTOR DEVICES 未知
公开(公告)号：GB1271128A
公开(公告)日：1972-04-19
申请号：GB5365969
申请日：1969-11-01
申请人： TELEDYNE INC
发明人： WIESLER MORDECHAI , GOREN AVIGDOR , HUNT ROBERT E
IPC分类号： B07C5/344 , H01L21/00
摘要： 1,271,128. Sorting semi-conductor dies. TELEDYNE Inc. 1 Nov., 1969, No. 53659/69. Heading B2H. [Also in Divisions B5, B8 and H1] A method of sorting semi-conductor dies from a monolithic wafer comprises scoring the surface of the wafer 10, Fig. 1, along lines 12, 14 dividing the dies 16, mounting the wafer on a flexible adhesive tape 18, Fig. 3, applying the tape and wafer to a resilient surface 22 with the wafer between the tape and surface, applying a moving line of pressure 24 against the tape parallel to the score lines to break the wafer into an array of separated dies, separating the tape with the array of dies from the surface, and removing individual dies from the tape and placing them in pre-determined groups. The wafer is initially formed with a plurality of microscopic circuits or components which may be of 5 to 10 different types and the score lines 12, 14 divide the circuits one from another. After scoring, the wafer is mounted on the adhesive tape with the score lines facing outwardly and then placed on a smooth release surface 20 covering a resilient backing member 22. A tool 24 is rubbed over the non-adhesive surface of the tape to cause the wafer to fracture along the score lines. The tape is then peeled from the surface 20 with the separated dies adhering to the tape. Before breaking, each circuit on the wafer is examined and its electrical characteristic recorded on a tape 28 which is fitted into a tape reader control 26. Sorting. The adhesive tape 18 carrying the separated dies 16 is mounted on a rest 38, Figs. 4 and 5, having a rear portion 50 of small radius and has its ends secured to clamps 52 on the front and rear surfaces of the rest, the rear clamp being carried by a slide (58, Fig. 6, not shown) acted on by a spring (60) to tension the tape, and the front clamp being connected by adjusting screws 54, 56 to a slide 58 movable by a micro-adjustment screw 44 and a Y-axis drive motor 48. The rest is adjustable in an X direction by a microadjustment screw 42 and an X-axis drive motor 46. The rest 38 is mounted on a pantograph 40 for positioning on a base 32 which has an upright 34 carrying a microscope 36 for visual inspection of the dies. Each die can be removed from the adhesive tape by an electromechanical tweezer 62 having jaws 61 on a split ring 64 actuated by a coil 66, the tweezer being actuated to embrace, grip and lift a die from the tape. The tweezer is carried by a slide 68 which is retracted under the control of the tape reader 26 to deposit the die on a selected one of a series of carrier belts 72 extending between feed spools 74 and take-up spools 76 driven by a motor 80. Packaging. Each belt 72, Fig. 7, is formed with shallow pockets 80 for receiving the dies deposited by the tweezers 62 and is indexed upon receiving a die. As the belt is indexed, an overlay of pressure sensitive adhesive tape 78 is pressed against the upper surface of the belt to seal the semi-conductor dies in the pockets.

10. 发明专利

DE1961588A1 未知
公开(公告)号：DE1961588A1
公开(公告)日：1971-06-09
申请号：DE1961588
申请日：1969-12-09
申请人： TELEDYNE INC
发明人： WIESLER MORDECHAI , GOREN AVIGDOR , E HUNT ROBERT
IPC分类号： B07C5/344

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