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    • 1. 发明申请
    • Method for manufacturing multilayered unit for multilayered electronic component
    • US20060286500A1
    • 2006-12-21
    • US10553714
    • 2004-04-12
    • Syougo MurosawaShigeki SatoMasaaki Kanasugi
    • Syougo MurosawaShigeki SatoMasaaki Kanasugi
    • F27D5/00
    • H01G4/30H01G4/12H01G4/308
    • It is an object of the present invention is to provide a method for manufacturing a multi-layered unit for a multi-layered ceramic electronic component which can prevent a ceramic green sheet from being deformed and destroyed and prevent a solvent contained in an electrode paste from sinking into a ceramic green sheet, thereby enabling manufacture of a multi-layered unit including a ceramic green sheet and an electrode layer laminated to each other in a desired manner. The method for manufacturing a multi-layered unit for a multi-layered ceramic electronic component according to the present invention includes a step of forming a ceramic green sheet on the surface of a first carrier film including a surface-treated region and non-surface-treated regions on which no surface treatment is performed on both sides of the surface-treated region, a step of forming a release layer on the surface of a second carrier film having a width substantially equal to that of the first carrier film, a step of forming an electrode layer in a predetermined pattern and a spacer layer in a complementary pattern to that of the electrode layer on the surface of the release layer, thereby forming an inner electrode layer, a step of forming an adhesive layer on the surface of a third carrier film having a width substantially equal to that of the first carrier film, a step of transferring the adhesive layer formed on the surface of the third carrier film onto the surface of the ceramic green sheet, and a step of transferring the inner electrode layer formed on the surface of the second carrier film onto the adhesive layer formed on the surface of the ceramic green sheet, thereby fabricating a multi-layered unit including the ceramic green sheet and the inner electrode layer laminated onto each other, wherein the adhesive layer is formed by coating the surface of the third carrier film with an adhesive agent solution so that the width of the adhesive layer is narrower than that of the third carrier film by at least 2a where α is a positive value, wider than the width of the ceramic green sheet formed on the surface of the first carrier film and the widths of the release layer and the inner electrode layer formed on the surface of the second carrier film by at least 2a and wider than the width of the surface-treated region of the first carrier film at least 2a.
    • 2. 发明申请
    • Method for manufacturing multi-layered unit for multi-layered ceramic electronic component
    • US20060254701A1
    • 2006-11-16
    • US10553536
    • 2004-04-12
    • Syougo MurosawaShigeki SatoMasaaki Kanasugi
    • Syougo MurosawaShigeki SatoMasaaki Kanasugi
    • B32B37/12B44C1/165B32B37/00B32B38/00B32B38/10
    • H01G4/30H01G4/12H01G4/308
    • It is an object of the present invention is to provide a method for manufacturing a multi-layered unit for a multi-layered ceramic electronic component which can prevent a ceramic green sheet from being deformed and destroyed and prevent a solvent contained in an electrode paste from sinking into a ceramic green sheet, thereby enabling manufacture of a multi-layered unit including a ceramic green sheet and an electrode layer laminated to each other in a desired manner. The method for manufacturing a multi-layered unit for a multi-layered ceramic electronic component according to the present invention includes a step of forming a ceramic green sheet on the surface of a first carrier film, a step of forming a release layer on the surface of a second carrier film including a surface-treated region on which a surface treatment is performed for improving releasability and non-surface-treated regions on which no surface treatment is performed on both sides of the surface-treated region and having a width substantially equal to that of the first carrier film, a step of forming an electrode layer in a predetermined pattern and a spacer layer in a complementary pattern to that of the electrode layer on the surface of the release layer, thereby forming an inner electrode layer, a step of forming an adhesive layer on the surface of a third carrier film having a width substantially equal to that of the second carrier film, a step of transferring the adhesive layer formed on the third carrier film onto the surface of the inner electrode layer, and a step of transferring the ceramic green sheet formed on the surface of the first carrier film onto the adhesive layer transferred on the surface of the inner electrode layer formed on the surface of the second carrier film, thereby fabricating a multi-layered unit including the ceramic green sheet and the inner electrode layer laminated onto each other, wherein the adhesive layer is formed by coating the surface of the third carrier film with an adhesive agent solution so that the width of the adhesive layer is narrower than the width of the third carrier film by at least 2α where α is a positive value, wider than the width of the ceramic green sheet formed on the surface of the first carrier film and the widths of the release layer and the inner electrode layer formed on the surface of the second carrier film by at least 2α and wider than the width of the surface-treated region of the second carrier film by at least 2α.
    • 6. 发明申请
    • Production method for laminated ceramic electronic component
    • 层压陶瓷电子元件的生产方法
    • US20060196592A1
    • 2006-09-07
    • US10550749
    • 2004-03-31
    • Masahiro KaratsuShigeki SatoMasaaki Kanasugi
    • Masahiro KaratsuShigeki SatoMasaaki Kanasugi
    • B31B1/60
    • H01G4/30Y10T156/10
    • It is an object of the present invention is to provide a method for manufacturing a multi-layered ceramic electronic component which can reliably prevent a multi-layered unit including a ceramic green sheet and an electrode layer from being damaged and efficiently laminate a desired number of the multi-layered units, thereby manufacturing the multi-layered ceramic electronic component. The method for manufacturing a multi-layered ceramic electronic component according to the present invention includes a step of laminating a plurality of multi-layered units each formed by laminating a ceramic green sheet, an electrode layer and a release layer on a support sheet in this order, the method further including steps of positioning the multi-layered unit on a base substrate so that the surface of the release layer is contact with an agglutinant layer formed on the surface of the base substrate in such a manner that the bonding strength between itself and the support substrate is higher than the bonding strength between the support sheet and the ceramic green sheet and lower than the bonding strength between itself and the release layer, pressing it and laminating multi-layered units on the base substrate.
    • 本发明的目的是提供一种制造多层陶瓷电子部件的方法,其可以可靠地防止包括陶瓷生片和电极层的多层单元被损坏并有效地层压所需数量的 多层单元,从而制造多层陶瓷电子部件。 根据本发明的多层陶瓷电子部件的制造方法包括如下步骤:在该载体片材上层叠多个多层单元,每个多层单元通过将陶瓷生片,电极层和剥离层层叠在支撑片上而形成 该方法还包括以下步骤:将多层单元定位在基底基板上,使得剥离层的表面与形成在基底表面上的凝集层接触,使得其本身之间的结合强度 并且支撑基板高于支撑片和陶瓷生片之间的接合强度,并且低于其本身和剥离层之间的接合强度,将其压制并层压在基底基板上的多层单元。
    • 7. 发明授权
    • Method for manufacturing multi-layered ceramic electronic component
    • 多层陶瓷电子元件制造方法
    • US07491282B2
    • 2009-02-17
    • US10550743
    • 2004-03-31
    • Masahiro KaratsuShigeki SatoMasaaki Kanasugi
    • Masahiro KaratsuShigeki SatoMasaaki Kanasugi
    • B32B37/12B32B37/26
    • H01G4/30
    • It is an object of the present invention is to provide a method for manufacturing a multi-layered ceramic electronic component which can reliably prevent a multi-layered unit including a ceramic green sheet and an electrode layer from being damaged and efficiently laminate a desired number of the multi-layered units, thereby manufacturing the multi-layered ceramic electronic component.The method for manufacturing a multi-layered ceramic electronic component according to the present invention includes a step of laminating a plurality of multi-layered units each formed by laminating a release layer, an electrode layer and a ceramic green sheet on a support sheet in this order, the method further including steps of positioning the multi-layered unit on a base substrate so that the surface of the ceramic green sheet is contact with an agglutinant layer formed on the surface of the base substrate in such a manner that the bonding strength between itself and the support substrate is higher than the bonding strength between the support sheet and the release layer and lower than the bonding strength between itself and the ceramic green sheet, pressing it and laminating multi-layered units on the base substrate.
    • 本发明的目的是提供一种制造多层陶瓷电子部件的方法,其可以可靠地防止包括陶瓷生片和电极层的多层单元被损坏并有效地层压所需数量的 多层单元,从而制造多层陶瓷电子部件。 根据本发明的多层陶瓷电子部件的制造方法包括如下步骤:将多个多层单元层压在该层叠单元上,所述多层单元通过在该支撑片上层叠剥离层,电极层和陶瓷生片 该方法还包括以下步骤:将多层单元定位在基底基板上,使得陶瓷生片的表面与形成在基底基板的表面上的凝集层接触, 其本身和支撑基底的高度大于支撑片和剥离层之间的结合强度,并且低于其本身与陶瓷生片之间的接合强度,将其压制并层压在基底上的多层单元。
    • 8. 发明申请
    • Method for Manufacturing Multi-Layered Ceramic Electronic Component
    • 多层陶瓷电子元件制造方法
    • US20070017091A1
    • 2007-01-25
    • US10550713
    • 2004-03-31
    • Masahiro KaratsuShigeki SatoMasaaki Kanasugi
    • Masahiro KaratsuShigeki SatoMasaaki Kanasugi
    • H05K3/36
    • H01G4/30Y10T29/49126Y10T29/4913
    • It is an object of the present invention is to provide a method for manufacturing a multi-layered ceramic electronic component which can reliably prevent a multi-layered unit including a ceramic green sheet and an electrode layer from being damaged and efficiently laminate a desired number of the multi-layered units, thereby manufacturing the multi-layered ceramic electronic component. The method for manufacturing a multi-layered ceramic electronic component according to the present invention includes a step of positioning a multi-layered unit including a release layer, an electrode layer and a ceramic green sheet formed on a support sheet in such a manner that the surface of the multi-layered unit is located on a base substrate and a step of pressing the multi-layered unit toward the base substrate, thereby laminating the multi-layered unit on the base substrate, and employs as the base substrate a base substrate having such surface roughness as to include per 0.01 mm2 thereof not more than one protrusion that can penetrate the ceramic green sheet of the multi-layered unit laminated on the base substrate to half or more the thickness of the ceramic green sheet and include per 100 mm2 thereof not more than one protrusion that can completely penetrate the ceramic green sheet.
    • 本发明的目的是提供一种制造多层陶瓷电子部件的方法,其可以可靠地防止包括陶瓷生片和电极层的多层单元被损坏并有效地层压所需数量的 多层单元,从而制造多层陶瓷电子部件。 根据本发明的多层陶瓷电子部件的制造方法包括如下步骤:将形成在支撑片上的剥离层,电极层和陶瓷生坯片的多层单元定位成使得 多层单元的表面位于基底基板上,并且将多层单元朝向基底基板按压的步骤,从而将多层单元层叠在基底基板上,并且使用基底基板作为基底基板, 这种表面粗糙度包括每0.01mm 2不超过一个突起,其可以穿透层压在基底基底上的多层单元的陶瓷生片的一半以上,陶瓷的厚度 绿色片材,并且每100mm 2不超过一个可完全穿透陶瓷生片的突起。
    • 9. 发明授权
    • Method for manufacturing multi-layered ceramic electronic component
    • 多层陶瓷电子元件制造方法
    • US07360305B2
    • 2008-04-22
    • US10550713
    • 2004-03-31
    • Masahiro KaratsuShigeki SatoMasaaki Kanasugi
    • Masahiro KaratsuShigeki SatoMasaaki Kanasugi
    • H05K3/36
    • H01G4/30Y10T29/49126Y10T29/4913
    • A method for manufacturing a multi-layered ceramic electronic component includes positioning a multi-layered unit including a release layer, an electrode layer and a ceramic green sheet formed on a support sheet in such a manner that the surface of the multi-layered unit is located on a base substrate and a step of pressing the multi-layered unit toward the base substrate, thereby laminating the multi-layered unit on the base substrate, and employs as the base substrate a base substrate having such surface roughness as to include per 0.01 mm2 thereof not more than one protrusion that can penetrate the ceramic green sheet of the multi-layered unit laminated on the base substrate to half or more the thickness of the ceramic green sheet and include per 100 mm2 thereof not more than one protrusion that can completely penetrate the ceramic green sheet.
    • 一种多层陶瓷电子部件的制造方法,其特征在于,将形成在所述支撑片上的剥离层,电极层,陶瓷生片等的多层单元定位成多层单元的表面为 位于基底基板上的步骤和将多层单元朝向基底基板的步骤,从而将多层单元层叠在基底基板上,并且使用具有这样的表面粗糙度的基底基板作为基底基板, 其不超过一个突出部,其可以穿透层叠在基底基板上的多层单元的陶瓷生片的厚度为陶瓷生片的厚度的一半以上, SUP> 2 <! - SIPO - >不超过一个可完全穿透陶瓷生片的突起。