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1. 发明申请

US20060180921A1 Method for producing an FBGA component and substrate for carrying out the method 审中-公开
标题翻译：制造用于实施该方法的FBGA部件和基板的方法
公开(公告)号：US20060180921A1
公开(公告)日：2006-08-17
申请号：US11336615
申请日：2006-01-20
申请人： Steffen Kroehnert , Knut Kahlisch , Ruediger Uhlmann , Carsten Bender
发明人： Steffen Kroehnert , Knut Kahlisch , Ruediger Uhlmann , Carsten Bender
IPC分类号： H01L23/28 , H01L21/56
CPC分类号： H01L21/565 , H01L23/3128 , H01L24/48 , H01L2224/48091 , H01L2224/4824 , H01L2924/00014 , H01L2924/0102 , H01L2924/181 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A semiconductor component includes a substrate having a chip side and a solder ball side. A semiconductor chip is mounted on the chip side of a substrate. The semiconductor chip is electrically conductively connected to a conductor structure on the substrate. Ball pads are disposed over the solder ball side of the substrate. The ball pads are electrically conductively connected to the conductor structure and suitable for application of solder balls. A mask made from a soldering resist is disposed on the solder ball side. A sealing region at a surface of the solder ball side of the substrate is provided with seal elements for a sealing connection to an encapsulation mold on the surface of the solder ball side.
摘要翻译：半导体部件包括具有芯片侧和焊球侧的基板。半导体芯片安装在基板的芯片侧。半导体芯片与基板上的导体结构导电连接。球垫设置在衬底的焊球侧上。球垫与导体结构导电连接，适用于焊球的应用。在焊锡球侧设置由阻焊剂制成的掩模。在基板的焊球侧的表面上的密封区域设置有用于密封连接到焊球侧表面上的封装模具的密封元件。

2. 发明申请

US20050218484A1 Wiring carrier design 审中-公开
标题翻译：接线架设计
公开(公告)号：US20050218484A1
公开(公告)日：2005-10-06
申请号：US11089542
申请日：2005-03-24
申请人： Ruediger Uhlmann
发明人： Ruediger Uhlmann
IPC分类号： H01L21/48 , H01L21/58 , H01L21/60 , H01L23/13 , H01L23/495
CPC分类号： H01L21/4867 , H01L24/27 , H01L2224/2732 , H01L2224/83136 , H01L2224/83192 , H01L2224/83801
摘要： The invention relates to a wiring carrier design for a planar wiring carrier for receiving a plurality of chips, on the chip side of which chips of identical type are arranged in matrix-like fashion, a long narrow bonding channel surrounded by a soldering resist layer being situated in the center of each chip receptacle, and the further region of the chip receptacle area being free of soldering resist, and the chips in each case being encapsulated with a molding material. The invention is based on the object of providing a wiring carrier design with which a uniform application of adhesive can be achieved using simple means. The object is achieved by virtue of the fact that additional supporting elements (9) made of soldering resist, or made of some other suitable material, are applied on the wiring carrier (1) at least in the region of narrow stencil webs (8) that are readily flexible during the printing operation.
摘要翻译：本发明涉及一种用于接收多个芯片的平面布线载体的布线载体设计，其芯片侧的相同类型的芯片以矩阵状排列，由抗焊剂层包围的长的窄接合通道，位于每个芯片插座的中心，并且芯片插座区域的另外的区域没有抗焊剂，并且每种情况下的芯片都用模制材料封装。本发明基于提供一种布线载体设计的目的，其中使用简单的手段可以实现粘合剂的均匀应用。该目的是通过以下事实实现的：至少在狭窄的网板（8）的区域中，在布线载体（1）上施加由焊接抗蚀剂制成或由其它合适的材料制成的附加的支撑元件（9）这在打印操作期间容易灵活。

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