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1. 发明授权

US08196298B2 Method for manufacturing electroconductive material-filled throughhole substrate 有权
标题翻译：导电材料填充的通孔基板的制造方法
公开(公告)号：US08196298B2
公开(公告)日：2012-06-12
申请号：US12903319
申请日：2010-10-13
申请人： Shigeki Chujo , Koichi Nakayama
发明人： Shigeki Chujo , Koichi Nakayama
IPC分类号： H01K3/10
CPC分类号： H05K3/423 , H01L21/486 , H05K1/0306 , H05K3/427 , H05K2201/09563 , H05K2203/0733 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165 , Y10T29/49204
摘要： Disclosed is a method for manufacturing an electroconductive material-filled throughhole substrate that is free from any void part in the electroconductive material filled into the throughholes. The method comprises forming an electroconductive base layer on one side of a core substrate having throughholes, and precipitating and growing an electroconductive material from one direction within the throughholes by electroplating using the electroconductive base layer as a seed layer to fill the electroconductive material into the throughholes without forming any void part and thus to manufacture an electroconductive material-filled throughhole substrate.
摘要翻译：公开了一种制造填充有导电材料的通孔基板的方法，该方法在填充到通孔中的导电材料中没有任何空隙部分。该方法包括在具有通孔的芯基板的一侧上形成导电基层，并且通过使用导电基层作为晶种层通过电镀从通孔内的一个方向沉淀和生长导电材料，以将导电材料填充到通孔而不形成任何空隙部分，从而制造填充有导电材料的通孔基板。

2. 发明授权

US09136214B2 Method for manufacturing multilayer wiring board 有权
标题翻译：多层布线板的制造方法
公开(公告)号：US09136214B2
公开(公告)日：2015-09-15
申请号：US12691226
申请日：2010-01-21
申请人： Shigeki Chujo , Koichi Nakayama
发明人： Shigeki Chujo , Koichi Nakayama
IPC分类号： H05K3/30 , H01L23/498 , H01L21/48 , H05K3/44 , H05K3/46 , H01L21/683 , H05K1/03 , H05K3/38 , H05K3/42
CPC分类号： H05K3/4076 , C23C16/0245 , C23C16/18 , H01L21/486 , H01L21/6835 , H01L23/49827 , H01L2924/0002 , H05K1/0306 , H05K3/0041 , H05K3/0079 , H05K3/388 , H05K3/423 , H05K3/445 , H05K3/4605 , H05K3/4644 , H05K3/4679 , H05K2201/09563 , H05K2201/096 , H05K2203/095 , Y10T29/49155 , H01L2924/00
摘要： A multilayer wiring board has a high degree of freedom of wiring design and can realize high-density wiring, and a method to simply manufacture the multilayer wiring board. A core substrate with two or more wiring layers provided thereon through an electrical insulating layer. The core substrate has a plurality of throughholes filled with an electroconductive material, and the front side and back side of the core substrate have been electrically conducted to each other by the electroconductive material. The throughholes have an opening diameter in the range of 10 to 100 μm. An insulation layer and an electroconductive material diffusion barrier layer are also provided, and the electroconductive material is filled into the throughholes through the insulation layer. A first wiring layer provided through an electrical insulating layer on the core substrate is connected to the electroconductive material filled into the throughhole through via.
摘要翻译：多层布线板具有高自由度的布线设计并且可以实现高密度布线，以及简单地制造多层布线板的方法。具有通过电绝缘层设置在其上的两个或多个布线层的芯基板。芯基板具有填充有导电材料的多个通孔，并且芯基板的前侧和后侧通过导电材料彼此导电。通孔的开口直径在10〜100μm的范围内。还提供绝缘层和导电材料扩散阻挡层，并且导电材料通过绝缘层填充到通孔中。通过芯基板上的电绝缘层提供的第一布线层通过通孔连接到填充到通孔中的导电材料。

3. 发明申请

US20100116782A1 METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD 有权
标题翻译：制造多层接线板的方法
公开(公告)号：US20100116782A1
公开(公告)日：2010-05-13
申请号：US12691226
申请日：2010-01-21
申请人： Shigeki Chujo , Koichi Nakayama
发明人： Shigeki Chujo , Koichi Nakayama
IPC分类号： H05K3/00
CPC分类号： H05K3/4076 , C23C16/0245 , C23C16/18 , H01L21/486 , H01L21/6835 , H01L23/49827 , H01L2924/0002 , H05K1/0306 , H05K3/0041 , H05K3/0079 , H05K3/388 , H05K3/423 , H05K3/445 , H05K3/4605 , H05K3/4644 , H05K3/4679 , H05K2201/09563 , H05K2201/096 , H05K2203/095 , Y10T29/49155 , H01L2924/00
摘要： Disclosed are a multilayer wiring board, which has a high degree of freedom of wiring design and can realize high-density wiring, and a method which can simply manufacture the multilayer wiring board. The multilayer wiring board comprises a core substrate and two or more wiring layers provided on the core substrate through an electrical insulating layer. The core substrate has a plurality of throughholes filled with an electroconductive material, and the front side and back side of the core substrate have been electrically conducted to each other by the electroconductive material. The throughholes have an opening diameter in the range of 10 to 100 μm. An insulation layer and an electroconductive material diffusion barrier layer are also provided, and the electroconductive material is filled into the throughholes through the insulation layer. A first wiring layer provided through an electrical insulating layer on the core substrate is connected to the electroconductive material filled into the throughhole through via.
摘要翻译：公开了一种具有高自由度的布线设计并且可以实现高密度布线的多层布线板以及可以简单地制造多层布线板的方法。多层布线板包括芯基板和通过电绝缘层设置在芯基板上的两个或更多布线层。芯基板具有填充有导电材料的多个通孔，并且芯基板的前侧和后侧通过导电材料彼此导电。通孔的开口直径在10〜100μm的范围内。还提供绝缘层和导电材料扩散阻挡层，并且导电材料通过绝缘层填充到通孔中。通过芯基板上的电绝缘层提供的第一布线层通过通孔连接到填充到通孔中的导电材料。

4. 发明申请

US20080092378A1 Method For Manufacturing Electroconductive Material-Filled Throughhole Substrate 有权
标题翻译：制造导电材料填充的通孔基板的方法
公开(公告)号：US20080092378A1
公开(公告)日：2008-04-24
申请号：US11791593
申请日：2005-11-14
申请人： Shigeki Chujo , Koichi Nakayama
发明人： Shigeki Chujo , Koichi Nakayama
IPC分类号： H05K3/16
CPC分类号： H05K3/423 , H01L21/486 , H05K1/0306 , H05K3/427 , H05K2201/09563 , H05K2203/0733 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165 , Y10T29/49204
摘要： Disclosed is a method for manufacturing an electroconductive material-filled throughhole substrate that is free from any void part in the electroconductive material filled into the throughholes. The method comprises forming an electroconductive base layer on one side of a core substrate having throughholes, and precipitating and growing an electroconductive material from one direction within the throughholes by electroplating using the electroconductive base layer as a seed layer to fill the electroconductive material into the throughholes without forming any void part and thus to manufacture an electroconductive material-filled throughhole substrate.
摘要翻译：公开了一种制造填充有导电材料的通孔基板的方法，该方法在填充到通孔中的导电材料中没有任何空隙部分。该方法包括在具有通孔的芯基板的一侧上形成导电基层，并且通过使用导电基层作为晶种层通过电镀从通孔内的一个方向沉淀和生长导电材料，以将导电材料填充到通孔而不形成任何空隙部分，从而制造填充有导电材料的通孔基板。

5. 发明申请

US20080083558A1 Multilayer Wiring Board And Method For Manufacturing The Same 有权
标题翻译：多层接线板及其制造方法
公开(公告)号：US20080083558A1
公开(公告)日：2008-04-10
申请号：US11791572
申请日：2005-11-14
申请人： Shigeki Chujo , Koichi Nakayama
发明人： Shigeki Chujo , Koichi Nakayama
IPC分类号： H05K3/46 , H05K1/00 , H05K3/42
CPC分类号： H05K3/4076 , C23C16/0245 , C23C16/18 , H01L21/486 , H01L21/6835 , H01L23/49827 , H01L2924/0002 , H05K1/0306 , H05K3/0041 , H05K3/0079 , H05K3/388 , H05K3/423 , H05K3/445 , H05K3/4605 , H05K3/4644 , H05K3/4679 , H05K2201/09563 , H05K2201/096 , H05K2203/095 , Y10T29/49155 , H01L2924/00
摘要： Disclosed are a multilayer wiring board, which has a high degree of freedom of wiring design and can realize high-density wiring, and a method which can simply manufacture the multilayer wiring board. The multilayer wiring board comprises a core substrate and two or more wiring layers provided on the core substrate through an electrical insulating layer. The core substrate has a plurality of throughholes filled with an electroconductive material, and the front side and back side of the core substrate have been electrically conducted to each other by the electroconductive material. The throughholes have an opening diameter in the range of 10 to 100 μm. An insulation layer and an electroconductive material diffusion barrier layer are also provided, and the electroconductive material is filled into the throughholes through the insulation layer. A first wiring layer provided through an electrical insulating layer on the core substrate is connected to the electroconductive material filled into the throughhole through via.
摘要翻译：公开了一种具有高自由度的布线设计并且可以实现高密度布线的多层布线板以及可以简单地制造多层布线板的方法。多层布线板包括芯基板和通过电绝缘层设置在芯基板上的两个或更多布线层。芯基板具有填充有导电材料的多个通孔，并且芯基板的前侧和后侧通过导电材料彼此导电。通孔的开口直径在10至100μm的范围内。还提供绝缘层和导电材料扩散阻挡层，并且导电材料通过绝缘层填充到通孔中。通过芯基板上的电绝缘层提供的第一布线层通过通孔连接到填充到通孔中的导电材料。

6. 发明授权

US07918020B2 Method for manufacturing electroconductive material-filled throughhole substrate 有权
标题翻译：导电材料填充的通孔基板的制造方法
公开(公告)号：US07918020B2
公开(公告)日：2011-04-05
申请号：US11791593
申请日：2005-11-14
申请人： Shigeki Chujo , Koichi Nakayama
发明人： Shigeki Chujo , Koichi Nakayama
IPC分类号： H01K3/10
CPC分类号： H05K3/423 , H01L21/486 , H05K1/0306 , H05K3/427 , H05K2201/09563 , H05K2203/0733 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165 , Y10T29/49204
摘要： Disclosed is a method for manufacturing an electroconductive material-filled throughhole substrate that is free from any void part in the electroconductive material filled into the throughholes. The method comprises forming an electroconductive base layer on one side of a core substrate having throughholes, and precipitating and growing an electroconductive material from one direction within the throughholes by electroplating using the electroconductive base layer as a seed layer to fill the electroconductive material into the throughholes without forming any void part and thus to manufacture an electroconductive material-filled throughhole substrate.
摘要翻译：公开了一种制造填充有导电材料的通孔基板的方法，该方法在填充到通孔中的导电材料中没有任何空隙部分。该方法包括在具有通孔的芯基板的一侧上形成导电基层，并且通过使用导电基层作为晶种层通过电镀从通孔内的一个方向沉淀和生长导电材料，以将导电材料填充到通孔而不形成任何空隙部分，从而制造填充有导电材料的通孔基板。

7. 发明申请

US20110023298A1 METHOD FOR MANUFACTURING ELECTROCONDUCTIVE MATERIAL-FILLED THROUGHHOLE SUBSTRATE 有权
标题翻译：制造电极材料填充的通孔基板的方法
公开(公告)号：US20110023298A1
公开(公告)日：2011-02-03
申请号：US12903319
申请日：2010-10-13
申请人： Shigeki Chujo , Koichi Nakayama
发明人： Shigeki Chujo , Koichi Nakayama
IPC分类号： H05K3/42 , H05K3/16
CPC分类号： H05K3/423 , H01L21/486 , H05K1/0306 , H05K3/427 , H05K2201/09563 , H05K2203/0733 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165 , Y10T29/49204
摘要： Disclosed is a method for manufacturing an electroconductive material-filled throughhole substrate that is free from any void part in the electroconductive material filled into the throughholes. The method comprises forming an electroconductive base layer on one side of a core substrate having throughholes, and precipitating and growing an electroconductive material from one direction within the throughholes by electroplating using the electroconductive base layer as a seed layer to fill the electroconductive material into the throughholes without forming any void part and thus to manufacture an electroconductive material-filled throughhole substrate.
摘要翻译：公开了一种制造填充有导电材料的通孔基板的方法，该方法在填充到通孔中的导电材料中没有任何空隙部分。该方法包括在具有通孔的芯基板的一侧上形成导电基层，并且通过使用导电基层作为晶种层通过电镀从通孔内的一个方向沉淀和生长导电材料，以将导电材料填充到通孔而不形成任何空隙部分，从而制造填充有导电材料的通孔基板。

8. 发明授权

US07800002B2 Multilayer wiring board 有权
标题翻译：多层接线板
公开(公告)号：US07800002B2
公开(公告)日：2010-09-21
申请号：US11791572
申请日：2005-11-14
申请人： Shigeki Chujo , Koichi Nakayama
发明人： Shigeki Chujo , Koichi Nakayama
IPC分类号： H01R12/04 , H05K1/11
CPC分类号： H05K3/4076 , C23C16/0245 , C23C16/18 , H01L21/486 , H01L21/6835 , H01L23/49827 , H01L2924/0002 , H05K1/0306 , H05K3/0041 , H05K3/0079 , H05K3/388 , H05K3/423 , H05K3/445 , H05K3/4605 , H05K3/4644 , H05K3/4679 , H05K2201/09563 , H05K2201/096 , H05K2203/095 , Y10T29/49155 , H01L2924/00
摘要： Disclosed are a multilayer wiring board, which has a high degree of freedom of wiring design and can realize high-density wiring, and a method which can simply manufacture the multilayer wiring board. The multilayer wiring board comprises a core substrate and two or more wiring layers provided on the core substrate through an electrical insulating layer. The core substrate has a plurality of throughholes filled with an electroconductive material, and the front side and back side of the core substrate have been electrically conducted to each other by the electroconductive material. The throughholes have an opening diameter in the range of 10 to 100 μm. An insulation layer and an electroconductive material diffusion barrier layer are also provided, and the electroconductive material is filled into the throughholes through the insulation layer. A first wiring layer provided through an electrical insulating layer on the core substrate is connected to the electroconductive material filled into the throughhole through via.
摘要翻译：公开了一种具有高自由度的布线设计并可实现高密度布线的多层布线板，以及可以简单地制造多层布线板的方法。多层布线板包括芯基板和通过电绝缘层设置在芯基板上的两个或更多布线层。芯基板具有填充有导电材料的多个通孔，并且芯基板的前侧和后侧通过导电材料彼此导电。通孔的开口直径在10〜100μm的范围内。还提供了绝缘层和导电材料扩散阻挡层，并且导电材料通过绝缘层填充到通孔中。通过芯基板上的电绝缘层提供的第一布线层通过通孔连接到填充到通孔中的导电材料。

9. 发明授权

US06548148B1 Thermal transfer film and image forming method 失效
标题翻译：热转印膜和成像方法
公开(公告)号：US06548148B1
公开(公告)日：2003-04-15
申请号：US09540271
申请日：2000-03-31
申请人： Masanori Torii , Mitsuru Maeda , Fumihiko Mizukami , Shigeki Chujo
发明人： Masanori Torii , Mitsuru Maeda , Fumihiko Mizukami , Shigeki Chujo
IPC分类号： B41M530
CPC分类号： B41M5/44 , Y10T428/24 , Y10T428/24802
摘要： The present invention is for providing a thermal transfer film capable of providing a vivid print without generation of a void, and an image forming method using the same. The thermal transfer film comprises a coloring layer formed on a substrate film via an intermediate layer, wherein the intermediate layer comprises materials according to either one of the following combinations: (1) a polycaprolactone resin having a 100-1,000 mPa·s melt viscosity at 75° C., and a binder resin having a 130-400° C. extrapolation fuse starting temperature; (2) a thermally fusible substance having a 100-1,000 mPa·s melt viscosity at 75° C., and a binder resin having a 150-400° C. extrapolation fuse starting temperature, (3) a polycaprolactone resin having a 100-1,000 mPa·s melt viscosity at 75° C., and a non-transferable binder resin having a 130-400° C softening temperature; and (4) a thermally fusible substance having a 100-1,000 mPa·s melt viscosity at 75° C., and a non-transferable binder resin having a 130-400° C. softening temperature.
摘要翻译：本发明提供一种能够提供鲜明的印刷而不产生空隙的热转印膜，以及使用该热转印膜的图像形成方法。热转印膜包括通过中间层在基材膜上形成的着色层，其中中间层包含根据下列组合之一的材料：（1）聚己内酯树脂，其熔体粘度为100-1,000mPa·s 75℃，和具有130-400℃外推熔丝开始温度的粘合剂树脂; （2）在75℃下具有100-1,000mPa.s熔体粘度的热熔性物质和具有150-400℃外推熔丝起始温度的粘合剂树脂，（3）具有100- 75℃时的熔融粘度为1,000mPa·s，软化温度为130-400℃的不可转移的粘合剂树脂; 和（4）在75℃下具有100-1,000mPa.s熔体粘度的热熔性物质和具有130-400℃软化温度的不可转移的粘合剂树脂。

10. 发明授权

US07011727B2 Thermal transfer film and image forming method 失效
标题翻译：热转印膜和成像方法
公开(公告)号：US07011727B2
公开(公告)日：2006-03-14
申请号：US10465160
申请日：2003-06-19
申请人： Masanori Torii , Mitsuru Maeda , Fumihiko Mizukami , Shigeki Chujo
发明人： Masanori Torii , Mitsuru Maeda , Fumihiko Mizukami , Shigeki Chujo
IPC分类号： B32B31/20 , B41J2/315
CPC分类号： B41M5/42 , B41M5/38207 , B41M5/423 , B41M5/426 , B41M5/44 , Y10T428/24802 , Y10T428/249953
摘要： A thermal transfer film comprises a coloring layer formed on a substrate film via an intermediate layer, wherein the intermediate layer contains a thermally fusible substance and a non-transferable binder resin, the melt viscosity of the thermally fusible substance in the temperature range 15 to 25° C. higher than the fuse peak temperature of the thermally fusible substance is in the range of 100 to 1000 mPa·s, the fuse peak temperature of the thermally fusible substance is in the range of 50 to 110° C., the crystallization peak temperature of the thermally fusible substance is in the range of −20 to 100 ° C., the crystallization peak temperature of the thermally fusible substance is lower than the fuse peak temperature by 10° C. or more, and the softening temperature of the binder resin measured by the ring and ball method is in the range of 130 to 400° C. This thermal transfer film is capable of forming a printed product with a good printing quality.
摘要翻译：热转印膜包括通过中间层在基材膜上形成的着色层，其中中间层含有热熔性物质和不可转移的粘合剂树脂，热熔性物质的熔体粘度在15〜25℃的范围内高于热熔物质的熔丝峰值温度在100〜1000mPa·s的范围内，则热熔物质的熔断峰温度在50〜110℃的范围内，结晶峰热熔性物质的温度在-20〜100℃的范围内，热熔性物质的结晶峰值温度比熔丝峰值温度低10℃以上，粘合剂的软化温度通过环球法测定的树脂在130〜400℃的范围内。该热转印膜能够形成印刷品质良好的印刷品。

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