专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20050270870A1 Time slot interchange switch with cache 审中-公开
标题翻译：具有缓存的时隙交换开关
公开(公告)号：US20050270870A1
公开(公告)日：2005-12-08
申请号：US11143391
申请日：2005-06-01
申请人： Sangho Shin , Sangho Lee , Kee Park
发明人： Sangho Shin , Sangho Lee , Kee Park
IPC分类号： G11C7/00 , H04Q11/04
CPC分类号： H04Q11/0421 , H04Q2213/13103 , H04Q2213/13216 , H04Q2213/13292 , H04Q2213/13393
摘要： In accordance with the invention, time slot interchange switches (“TSIS”) with a cache memory are described. A time slot interchange switch according to the present invention can include a data memory that receives and stores at least one stream of channel data; a cache memory that receives the at least one stream of channel data; and a microprocessor interface coupled to read data from the cache memory. Accordingly, a method of reading data from a time slot interchange switch to a microprocessor can include writing channel data to a cache memory in addition to a data memory; and providing data from the cache memory in response to requests from a microprocessor interface.
摘要翻译：根据本发明，描述了具有高速缓冲存储器的时隙交换开关（“TSIS”）。根据本发明的时隙交换交换机可以包括接收并存储至少一个信道数据流的数据存储器; 高速缓存存储器，其接收所述至少一个信道数据流; 以及耦合到从高速缓冲存储器读取数据的微处理器接口。因此，从时隙交换开关向微处理器读取数据的方法可以包括除了数据存储器之外还将信道数据写入高速缓存存储器; 以及响应于来自微处理器接口的请求，从高速缓冲存储器提供数据。

2. 发明授权

US08386799B2 Methods and apparatuses for providing DRM interoperability 有权
标题翻译：提供DRM互操作性的方法和设备
公开(公告)号：US08386799B2
公开(公告)日：2013-02-26
申请号：US12630646
申请日：2009-12-03
申请人： Jong Kim , Sangho Lee , Heejin Park
发明人： Jong Kim , Sangho Lee , Heejin Park
IPC分类号： G06F21/00
CPC分类号： G06F21/10 , G06F2221/0728
摘要： Methods and apparatuses for providing DRM interoperability are provided. Proxy re-encryption technique using bilinear map is used, and the same content can be used in different devices. According to the method of providing DRM interoperability includes in proxy agent with respect to digital rights management (DRM) service providers and device which supports predetermined DRM, first DRM service provider, second DRM service provider, the proxy agent, and the device identify each other, and proxy re-encrypt an interoperable content (IC) and provide the IC to the device. The IC is second-level encrypted by using a key of the first DRM service provider, and the proxy re-encryption is performed by using a proxy key generated from proxy key information provided from the first DRM service provider and the second DRM service provider. Therefore, a problem in which interoperability cannot be guaranteed since a DRM technique depends on a service provider is resolved.
摘要翻译：提供了提供DRM互操作性的方法和设备。使用双线性映射的代理重新加密技术，相同的内容可以在不同的设备中使用。根据提供DRM互操作性的方法，其包括关于数字权限管理（DRM）服务提供商的代理代理和支持预定DRM的设备，第一DRM服务提供商，第二DRM服务提供商，代理代理和设备彼此识别，并且代理重新加密可互操作的内容（IC）并将IC提供给设备。 IC通过使用第一DRM服务提供商的密钥进行二级加密，并且通过使用从第一DRM服务提供商和第二DRM服务提供商提供的代理密钥信息生成的代理密钥来执行代理重新加密。因此，解决了DRM技术取决于服务提供商的互操作性不能保证的问题。

3. 外观设计

USD637415S1 Chair 有权
公开(公告)号：USD637415S1
公开(公告)日：2011-05-10
申请号：US29363025
申请日：2010-06-03
申请人： Sangho Lee
设计人： Sangho Lee

4. 发明申请

US20110045637A1 Ultra Thin Bumped Wafer With Under-Film 有权
标题翻译：带薄膜的超薄冲压薄片
公开(公告)号：US20110045637A1
公开(公告)日：2011-02-24
申请号：US12916758
申请日：2010-11-01
申请人： Junghoon Shin , Sangho Lee , Sungyoon Lee
发明人： Junghoon Shin , Sangho Lee , Sungyoon Lee
IPC分类号： H01L21/78 , H01L21/50
CPC分类号： H01L21/78 , H01L2224/16225 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要： A method of making a semiconductor device includes forming an under-film layer over bumps disposed on a surface of a wafer to completely cover the bumps, and forming an adhesive layer over the under-film layer. The method further includes attaching a support layer over the adhesive layer, removing a portion of a back surface of the wafer, and removing the support layer to expose the adhesive layer that remains disposed over the under-film layer. The method further includes removing the adhesive layer to expose the under-film layer while the bumps remain completely covered by the under-film layer, and singulating the wafer to form a semiconductor die. The method further includes pressing the bumps into contact with a substrate while the under-film layer provides an underfill between the semiconductor die and the substrate.
摘要翻译：制造半导体器件的方法包括在设置在晶片表面上的凸起上形成底膜层，以完全覆盖凸块，并在底膜层上形成粘合剂层。所述方法还包括将粘合剂层附着在粘合剂层上，去除晶片后表面的一部分，以及去除支撑层以暴露保留设置在底膜层上的粘合剂层。该方法还包括去除粘合剂层以暴露底膜层，同时凸块保持完全被底膜层覆盖，并且将晶片单片化以形成半导体管芯。该方法进一步包括按压凸块与基底接触，同时底膜层在半导体管芯和衬底之间提供底部填充。

5. 发明申请

US20090317701A1 Electrode assembly and secondary battery having the same 失效
标题翻译：电极组件和二次电池具有相同的功能
公开(公告)号：US20090317701A1
公开(公告)日：2009-12-24
申请号：US12456624
申请日：2009-06-19
申请人： Seungyeob Cha , Sangho Lee
发明人： Seungyeob Cha , Sangho Lee
IPC分类号： H01M6/10
CPC分类号： H01M2/1066
摘要： A secondary battery includes an electrode assembly, an open-topped can accommodating the electrode assembly, and a cap assembly sealing the can. The electrode assembly includes a positive electrode plate having a positive electrode coated portion and positive electrode non-coating portions, a negative electrode plate having a negative electrode coated portion and negative electrode non-coating portions, and a separator interposed between the positive and negative electrode plates and wound with the electrode plates. The positive electrode non-coating portion has a region where the height of the positive electrode non-coating potion is lower than that of the positive electrode coating portions.
摘要翻译：二次电池包括电极组件，容纳电极组件的敞开的顶盖，以及密封罐的盖组件。电极组件包括具有正极涂覆部分和正极非涂覆部分的正极板，具有负极涂覆部分和负极非涂覆部分的负极板以及介于正极和负极之间的隔板并用电极板缠绕。正极未涂布部分具有正极未涂覆部分的高度低于正极涂覆部分的高度的区域。

6. 发明授权

US5588054A Power conservation system for a modem in a computer system 失效
标题翻译：计算机系统中调制解调器的节电系统
公开(公告)号：US5588054A
公开(公告)日：1996-12-24
申请号：US425530
申请日：1995-04-20
申请人： Seongkee Shin , Sangho Lee
发明人： Seongkee Shin , Sangho Lee
IPC分类号： H04M11/00 , G06F1/32 , G06F3/00 , H04L12/10 , H04M11/06
CPC分类号： G06F1/3209 , H04L12/10 , H04M11/06
摘要： A power conservation system for a modem in a computer system having a primary power supply and an auxiliary power supply, including a ring detect circuit coupled to a telephone ring signal line for generating a ring detect signal in response to detection of a ring signal on the telephone ring signal line, a power management system having an input coupled to the ring detect circuit and an output coupled to the primary power supply, the power management system being responsive to the ring detect signal for switching the primary power supply from a first level corresponding to a power conservation mode of operation of the computer system to a second level corresponding to a normal mode of operation, wherein the auxiliary power supply is coupled to the ring detect circuit for supplying power thereto when the computer system is in the power conservation mode of operation, whereby the ring detect circuit is maintained in an active state even during the power conservation mode of operation of the computer system.
摘要翻译：一种用于具有主电源和辅助电源的计算机系统中的调制解调器的功率节省系统，包括耦合到电话环信号线的环形检测电路，用于响应于在所述电路环上的振铃信号的检测而产生振铃检测信号电话铃声信号线，具有耦合到环形检测电路的输入和耦合到主电源的输出的电力管理系统，所述电力管理系统响应于所述环形检测信号，用于从所述第一电平相应地切换所述主电源到计算机系统的功率节省模式为对应于正常操作模式的第二电平，其中当计算机系统处于功率保存模式时，辅助电源耦合到环路检测电路以供电，从而即使在功率保持操作模式下，环路检测电路也保持在活动状态计算机系统。

7. 发明授权

US08704366B2 Ultra thin bumped wafer with under-film 有权
标题翻译：带薄膜的超薄凸起晶圆
公开(公告)号：US08704366B2
公开(公告)日：2014-04-22
申请号：US12911592
申请日：2010-10-25
申请人： Junghoon Shin , Sangho Lee , Sungyoon Lee
发明人： Junghoon Shin , Sangho Lee , Sungyoon Lee
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L21/78 , H01L2224/16225 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要： A semiconductor device includes a wafer and a dicing saw tape that is laminated to a back surface of the wafer. An active surface of the wafer is opposite the back surface of the wafer. The semiconductor device further includes a lamination tape disposed in contact with the wafer. The lamination tape includes an under-film layer contacting the active surface of the wafer. The lamination tape further includes an adhesive layer contacting the under-film layer.
摘要翻译：半导体器件包括层叠到晶片的背面的晶片和切割锯带。晶片的活性表面与晶片的背面相对。半导体器件还包括与晶片接触设置的层压带。层压带包括与晶片的活性表面接触的底膜层。层压带还包括与底膜层接触的粘合剂层。

8. 外观设计

USD650604S1 Chair 有权
公开(公告)号：USD650604S1
公开(公告)日：2011-12-20
申请号：US29383680
申请日：2011-01-20
申请人： Sangho Lee
设计人： Sangho Lee

9. 外观设计

USD641562S1 Chair 有权
标题翻译：椅子
公开(公告)号：USD641562S1
公开(公告)日：2011-07-19
申请号：US29383681
申请日：2011-01-20
申请人： Sangho Lee
设计人： Sangho Lee

10. 发明申请

US20110037172A1 Ultra Thin Bumped Wafer With Under-Film 有权
标题翻译：带薄膜的超薄冲压薄片
公开(公告)号：US20110037172A1
公开(公告)日：2011-02-17
申请号：US12911592
申请日：2010-10-25
申请人： Junghoon Shin , Sangho Lee , Sungyoon Lee
发明人： Junghoon Shin , Sangho Lee , Sungyoon Lee
IPC分类号： H01L23/498 , H01L23/00
CPC分类号： H01L21/78 , H01L2224/16225 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要： A semiconductor device includes a wafer and a dicing saw tape that is laminated to a back surface of the wafer. An active surface of the wafer is opposite the back surface of the wafer. The semiconductor device further includes a lamination tape disposed in contact with the wafer. The lamination tape includes an under-film layer contacting the active surface of the wafer. The lamination tape further includes an adhesive layer contacting the under-film layer.
摘要翻译：半导体器件包括层叠到晶片的背面的晶片和切割锯带。晶片的活性表面与晶片的背面相对。半导体器件还包括与晶片接触设置的层压带。层压带包括与晶片的活性表面接触的底膜层。层压带还包括与底膜层接触的粘合剂层。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式