专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08356455B2 Packaging system including control means with power-saving mode 失效
标题翻译：包装系统包括具有省电模式的控制装置
公开(公告)号：US08356455B2
公开(公告)日：2013-01-22
申请号：US12733505
申请日：2008-10-31
申请人： Ryoichi Sato , Shinji Koike
发明人： Ryoichi Sato , Shinji Koike
IPC分类号： B65B57/10 , B65B1/32 , B65B9/10
CPC分类号： G01G19/387 , B29C65/18 , B29C65/7451 , B29C66/1122 , B29C66/4312 , B29C66/4322 , B29C66/81422 , B29C66/81427 , B29C66/81431 , B29C66/8226 , B29C66/8227 , B29C66/8246 , B29C66/83421 , B29C66/83513 , B29C66/849 , B29C66/87441 , B29C66/91212 , B29C66/91231 , B29C66/91421 , B29C66/91431 , B29C66/9161 , B29C66/91655 , B29C66/961 , B65B1/22 , B65B1/32 , B65B9/2028 , B65B9/207 , B65B51/306 , B65B57/16 , G01G19/393
摘要： A system for reducing power consumption of a packaging machine, including a processing device performing a predetermined process on supplied processing objects and discharging them, and a packaging machine packaging the objects discharged from the processing device. The packaging machine includes a centralized control unit controlling the operation of the packaging machine. The control unit operates the packaging machine in a power-saving mode when an insufficient supply of the processing objects is in or is likely to be in the processing device.
摘要翻译：一种用于降低包装机的功耗的系统，包括对所提供的处理对象执行预定处理并将其排出的处理装置，以及封装从处理装置排出的物体的包装机。包装机包括控制包装机操作的集中控制单元。当处理对象的供给不足或可能处于处理装置时，控制单元以省电模式操作包装机。

2. 发明申请

US20100242416A1 PACKAGING SYSTEM 失效
标题翻译：包装系统
公开(公告)号：US20100242416A1
公开(公告)日：2010-09-30
申请号：US12733505
申请日：2008-10-31
申请人： Ryoichi Sato , Shinji Koike
发明人： Ryoichi Sato , Shinji Koike
IPC分类号： B65B57/10
CPC分类号： G01G19/387 , B29C65/18 , B29C65/7451 , B29C66/1122 , B29C66/4312 , B29C66/4322 , B29C66/81422 , B29C66/81427 , B29C66/81431 , B29C66/8226 , B29C66/8227 , B29C66/8246 , B29C66/83421 , B29C66/83513 , B29C66/849 , B29C66/87441 , B29C66/91212 , B29C66/91231 , B29C66/91421 , B29C66/91431 , B29C66/9161 , B29C66/91655 , B29C66/961 , B65B1/22 , B65B1/32 , B65B9/2028 , B65B9/207 , B65B51/306 , B65B57/16 , G01G19/393
摘要： An object of the present invention is to provide a technology capable of reducing the power consumption of a packaging machine without declining the availability factor of the whole of the system in a packaging system. In order to achieve the object, the packaging system includes a processing device performing a predetermined process on supplied processing objects and discharging them, and a packaging machine packaging the processing objects discharged from the processing device. The packaging machine includes a control unit centralized controlling the operation of the whole of the packaging machine. The control unit operates the packaging machine in the power-saving mode when the insufficient supply of the processing objects has occurred in the processing device, or when the insufficient supply of the processing objects is likely to occur in the processing device.
摘要翻译：本发明的目的是提供一种能够降低包装机的功耗而不降低整个系统在包装系统中的可用性因素的技术。为了实现该目的，包装系统包括对所提供的处理对象执行预定处理并进行放电的处理装置，以及包装机，其对从处理装置排出的处理对象进行封装。包装机包括集中控制整个包装机的操作的控制单元。当处理装置中没有发生处理对象的供给不足时，或者处理装置中容易发生处理对象的供给不足时，控制部以省电模式操作包装机。

3. 发明申请

US20150336230A1 MACHINE TOOL 有权
标题翻译：机床
公开(公告)号：US20150336230A1
公开(公告)日：2015-11-26
申请号：US14409776
申请日：2012-06-25
申请人： Shinji Koike , Kazuya Mayumi , Satoshi Kobayashi
发明人： Shinji Koike , Kazuya Mayumi , Satoshi Kobayashi
IPC分类号： B23Q11/00 , B23Q1/01
CPC分类号： B23Q1/015 , B23C1/027 , B23C2230/00 , B23Q1/017 , B23Q1/70 , B23Q11/0042 , B23Q11/0053 , B23Q11/0067 , Y02P70/171 , Y10T409/30392 , Y10T409/304088
摘要： A machine tool includes: a bed, the upper surface of which has the table provided thereon; a cut debris duct which is provided so as to extend rearward from a cut debris discharge opening open at the center, in the left-right direction, of the rear face of the bed, and which discharges cut debris from within the bed to outside of the machine tool; a bifurcated vertically movable body which vertically moves along a pair of vertical guides, and which straddles the cut debris duct, the pair of vertical guides vertically extending on the rear face of the bed at positions on both the left and right sides of the cut debris duct; and a pair of left and right feed screws which extend parallel to the vertical guides, and which move the vertically movable body along the vertical guides.
摘要翻译：一种机床包括：床，其上表面设置有桌子; 切割的碎屑管被设置成从床的后表面的中心的左右方向上的切割碎屑排出口向后延伸，并且将切碎的碎屑从床内排出到机床; 一个分叉的可垂直移动的主体，其沿着一对垂直引导件垂直移动，并且跨越切割的碎屑管道，一对垂直引导件在切割碎片的左侧和右侧的位置处垂直延伸在床的后表面上管; 以及一对平行于垂直导向件延伸的左右进给螺钉，并使垂直移动体沿垂直导向件移动。

4. 发明申请

US20130322979A1 MACHINE TOOL 有权
标题翻译：机床
公开(公告)号：US20130322979A1
公开(公告)日：2013-12-05
申请号：US13984818
申请日：2011-02-17
申请人： Shinji Koike , Kazumasa Nakayasu , Kazuya Mayumi
发明人： Shinji Koike , Kazumasa Nakayasu , Kazuya Mayumi
IPC分类号： B23Q1/25
CPC分类号： B23Q1/25 , B23Q1/015 , B23Q1/017 , B23Q5/40 , B23Q11/0053 , B23Q11/0067 , Y02P70/171 , Y10T409/307952
摘要： According to the machine tool according to the present invention, a top-bottom guide is attached to a back surface of a base frame. By being guided by this top-bottom guide, the lifter moves in the top-bottom direction with respect to the base frame. A drive source which drives rotation of a top-bottom feed screw which extends parallel to the top-bottom guide is attached to a back surface of the base frame. This drive source is coupled with a bottom end of the top-bottom feed screw. As a result, compared to when the drive source is coupled with a top end of the top-bottom feed screw, the center of gravity of the machine tool can be set to a lower position. In this way, a machine tool can be increased in stability.
摘要翻译：根据本发明的机床，顶底引导件附接到基架的后表面。通过由该顶部底部引导件引导，升降器相对于基架在上下方向上移动。驱动源驱动源，其驱动平行于顶部底部引导件延伸的顶部底部进给螺杆的旋转，附接到基部框架的后表面。该驱动源与顶部底部进料螺杆的底端连接。结果，与驱动源与顶部底部进给螺杆的顶端连接的情况相比，机床的重心可以设定在较低的位置。以这种方式，可以提高机床的稳定性。

5. 发明授权

US06786686B1 Numerically controlled machine tool 有权
标题翻译：数控机床
公开(公告)号：US06786686B1
公开(公告)日：2004-09-07
申请号：US09889489
申请日：2001-07-17
申请人： Shinji Koike
发明人： Shinji Koike
IPC分类号： B23D700
CPC分类号： B23Q1/40 , B23Q1/525 , B23Q1/626 , B23Q1/66 , B23Q1/70 , B23Q1/76 , B23Q7/1431 , B23Q11/0053 , B23Q11/0057 , B23Q37/00 , Y10T29/5124 , Y10T29/5196 , Y10T409/304088 , Y10T409/308232 , Y10T409/309576
摘要： A numerically controlled machine tool is disclosed including a spindle support structure for moving the spindle having a tool mounted thereon in directions along an X-axis, a Y-axis and a Z-axis, a workpiece support structure having an indexing workpiece mounting table, and a chip discharge means located between the spindle support structure and the workpiece support structure for discharging chips produced in the machining area to the outside. Since the workpiece mounting table is allowed for rotational indexing, the setup process for the workpiece can be performed with the workpiece mounting surface of the workpiece mounting table facing upward, and therefore the setup process can be shortened while at the same time improving the machine operating rate. Also, since the spindle support structure, the workpiece support structure and the chip discharge means can be configured separately from each other, the machine tool can be manufactured and installed easily.
摘要翻译：公开了一种数控机床，其包括：主轴支撑结构，用于使具有安装在其上的工具的主轴沿着X轴，Y轴和Z轴移动;具有分度工件安装台的工件支撑结构，以及位于主轴支撑结构和工件支撑结构之间的排屑装置，用于将在加工区域中产生的切屑排出到外部。由于工件安装台被允许进行旋转分度，因此可以在工件安装台的工件安装面朝上的情况下进行工件的安装处理，因此可以缩短设置过程，同时改善机器的运行率。此外，由于主轴支撑结构，工件支撑结构和切屑排出装置可以彼此分开地构造，所以可以容易地制造和安装机床。

6. 发明授权

US4821598A Steering wheel core material 失效
标题翻译：方向盘芯材料
公开(公告)号：US4821598A
公开(公告)日：1989-04-18
申请号：US116245
申请日：1987-11-03
申请人： Yasushi Yamazawa , Katsumi Kondo , Yasuhiro Tsuchiya , Shinji Koike , Masaki Terada
发明人： Yasushi Yamazawa , Katsumi Kondo , Yasuhiro Tsuchiya , Shinji Koike , Masaki Terada
IPC分类号： B62D1/04 , B32B5/12 , D06C11/00
CPC分类号： B62D1/04 , Y10T29/49488 , Y10T428/218 , Y10T428/24124 , Y10T428/24661 , Y10T428/24744 , Y10T428/249993 , Y10T74/20834
摘要： A steering wheel core material of continuous filament FRP for vehicles which is made up of a ring, a boss positioned at the center of the ring, and spokes connecting the boss to the ring, said boss being integrally joined to a boss metal fitting. It is formed by winding resin-impregnated continous filaments in layer around the ring- and spoke-forming mold and the body of the boss metal fitting, with an elastic material interposed between the body of the boss metal fitting and the FRP.
摘要翻译：用于车辆的连续长丝FRP的方向盘芯材料，其由环，位于环的中心的凸台和将凸起连接到环的轮辐，轮毂与凸台金属配件一体地接合。它通过将环状和轮辐形成模具周围的树脂浸渍的连续长丝缠绕在凸台金属配件的主体上，弹性材料插入在凸台金属配件的主体和FRP之间。

7. 发明授权

US09149900B2 Machine tool 有权
标题翻译：机床
公开(公告)号：US09149900B2
公开(公告)日：2015-10-06
申请号：US13984818
申请日：2011-02-17
申请人： Shinji Koike , Kazumasa Nakayasu , Kazuya Mayumi
发明人： Shinji Koike , Kazumasa Nakayasu , Kazuya Mayumi
IPC分类号： B23Q5/40 , B23Q1/25 , B23Q1/01 , B23Q11/00
CPC分类号： B23Q1/25 , B23Q1/015 , B23Q1/017 , B23Q5/40 , B23Q11/0053 , B23Q11/0067 , Y02P70/171 , Y10T409/307952
摘要： According to the machine tool according to the present invention, a top-bottom guide is attached to a back surface of a base frame. By being guided by this top-bottom guide, the lifter moves in the top-bottom direction with respect to the base frame. A drive source which drives rotation of a top-bottom feed screw which extends parallel to the top-bottom guide is attached to a back surface of the base frame. This drive source is coupled with a bottom end of the top-bottom feed screw. As a result, compared to when the drive source is coupled with a top end of the top-bottom feed screw, the center of gravity of the machine tool can be set to a lower position. In this way, a machine tool can be increased in stability.
摘要翻译：根据本发明的机床，顶底引导件附接到基架的后表面。通过由该顶部底部引导件引导，升降器相对于基架在上下方向上移动。驱动源驱动源，其驱动平行于顶部底部引导件延伸的顶部底部进给螺杆的旋转，附接到基部框架的后表面。该驱动源与顶部底部进料螺杆的底端连接。结果，与驱动源与顶部底部进给螺杆的顶端连接的情况相比，机床的重心可以设定在较低的位置。以这种方式，可以提高机床的稳定性。

8. 发明申请

US20100101188A1 BAG MANUFACTURING AND PACKAGING APPARATUS AND BAG MANUFACTURING AND PACKAGING METHOD 失效
标题翻译：袋制造和包装设备和包装制造和包装方法
公开(公告)号：US20100101188A1
公开(公告)日：2010-04-29
申请号：US12444317
申请日：2007-10-29
申请人： Shinji Koike
发明人： Shinji Koike
IPC分类号： B65B9/06
CPC分类号： B65B9/2028 , B65B9/2007 , B65B9/213 , B65B51/306
摘要： A bag manufacturing and packaging apparatus manufactures a bag by sealing a packaging material formed in a tubular shape and at the same time fills the bag with articles to be packaged. The bag manufacturing and packaging apparatus includes a conveyance mechanism, a squeezing mechanism and a conveyance adjusting unit. The conveyance mechanism is configured and arranged to convey the packaging material in a conveying direction. The squeezing mechanism includes a squeezing unit configured and arranged to sandwich the packaging material and to perform a squeezing motion so as to move the articles to be packaged to the downstream side in the conveying direction. The conveyance adjusting unit configured and arranged to move the packaging material towards the upstream side in the conveying direction during the squeezing motion of the squeezing unit.
摘要翻译：袋制造和包装装置通过密封形成为管状形状的包装材料制造袋子，并且同时用包装物品填充袋子。袋制造和包装设备包括输送机构，挤压机构和输送调节单元。输送机构被构造和布置成沿输送方向输送包装材料。挤压机构包括挤压单元，该挤压单元构造和布置成夹持包装材料并进行挤压运动，以将要包装的物品沿输送方向移动到下游侧。输送调节单元构造和布置成在挤压单元的挤压运动期间将包装材料朝向输送方向的上游侧移动。

9. 发明授权

US07936065B2 Semiconductor devices and method of manufacturing them 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US07936065B2
公开(公告)日：2011-05-03
申请号：US11808465
申请日：2007-06-11
申请人： Yoshihito Mizuno , Masahiro Kinokuni , Shinji Koike , Masahiro Matsumoto , Fumitsugu Yanagihori
发明人： Yoshihito Mizuno , Masahiro Kinokuni , Shinji Koike , Masahiro Matsumoto , Fumitsugu Yanagihori
IPC分类号： H01L23/48
CPC分类号： H01L29/7397 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/83 , H01L29/41708 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15787 , H01L2924/00
摘要： A semiconductor device is provided with a silicon substrate, with a surface for soldering the silicon substrate to a ceramic substrate, and an electrode making contact with the surface of the silicon substrate. The electrode comprises a first conductor layer, a second conductor layer, and a third conductor layer. The first conductor layer makes contact with the surface of the silicon substrate and includes aluminum and silicon. The second conductor layer makes contact with the first conductor layer and includes titanium. The third conductor layer is separated from the first conductor layer by the second conductor layer and includes nickel.
摘要翻译：半导体器件设置有硅衬底，具有用于将硅衬底焊接到陶瓷衬底的表面，以及与硅衬底的表面接触的电极。电极包括第一导体层，第二导体层和第三导体层。第一导体层与硅衬底的表面接触并且包括铝和硅。第二导体层与第一导体层接触并包括钛。第三导体层通过第二导体层与第一导体层分离并且包括镍。

10. 发明申请

US20070296080A1 Semiconductor devices and method of manufacturing them 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20070296080A1
公开(公告)日：2007-12-27
申请号：US11808465
申请日：2007-06-11
申请人： Yoshihito Mizuno , Masahiro Kinokuni , Shinji Koike , Masahiro Matsumoto , Fumitsugu Yanagihori
发明人： Yoshihito Mizuno , Masahiro Kinokuni , Shinji Koike , Masahiro Matsumoto , Fumitsugu Yanagihori
IPC分类号： H01L23/48
CPC分类号： H01L29/7397 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/83 , H01L29/41708 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15787 , H01L2924/00
摘要： A semiconductor device is provided with a silicon substrate, with a surface for soldering the silicon substrate to a ceramic substrate, and an electrode making contact with the surface of the silicon substrate. The electrode comprises a first conductor layer, a second conductor layer, and a third conductor layer. The first conductor layer makes contact with the surface of the silicon substrate and includes aluminum and silicon. The second conductor layer makes contact with the first conductor layer and includes titanium. The third conductor layer is separated from the first conductor layer by the second conductor layer and includes nickel.
摘要翻译：半导体器件设置有硅衬底，具有用于将硅衬底焊接到陶瓷衬底的表面，以及与硅衬底的表面接触的电极。电极包括第一导体层，第二导体层和第三导体层。第一导体层与硅衬底的表面接触并且包括铝和硅。第二导体层与第一导体层接触并包括钛。第三导体层通过第二导体层与第一导体层分离并且包括镍。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式