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    • 7. 发明专利
    • Organic-inorganic complex and its manufacturing method
    • 有机无机复合材料及其制造方法
    • JP2006040954A
    • 2006-02-09
    • JP2004214674
    • 2004-07-22
    • Nitto Denko Corp日東電工株式会社
    • IKEDA KENICHINAKATSUKA YASUOMAEKAWA OSAMUMASAKI TOSHIAKITADA MASATAKA
    • H01L21/60C08J9/36C08L67/00C08L69/00H01R11/01
    • PROBLEM TO BE SOLVED: To provide an organic-inorganic complex which is applicable to other uses by obtaining an anisotropic conductive sheet in the form which is totally different from a conventional one, and also to provide a manufacturing method of the complex.
      SOLUTION: The organic-inorganic complex 1 has a separation film 10 where a plurality of through holes 11 are formed in a film formed of organic resin and inorganic particles 12 with which the through holes 11 are filled. The suitable manufacturing method of the organic-inorganic complex 1 has a process for making suspension 3 including the inorganic particles and solvent exist on one main face side of the separation film 10 where a plurality of through holes 11 are formed in the film formed of organic resin, for making solvent of suspension pass from the other main face side of the separation film 10 and sucking the inorganic particles through an auxiliary film 2 where they are substantially prevented from passing so as to fill the through holes 11 of the separation film 10 with the inorganic particles 12.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 待解决的问题:通过获得与传统方式完全不同的形式的各向异性导电片,提供适用于其它用途的有机 - 无机络合物,并提供复合物的制造方法。 有机 - 无机络合物1具有分离膜10,其中在由有机树脂形成的膜中形成有多个通孔11和填充有通孔11的无机颗粒12。 有机 - 无机配合物1的合适的制造方法具有在分离膜10的一个主面上形成包含无机颗粒和溶剂的悬浮液3的方法,其中在由有机 - 无机复合物形成的膜中形成多个通孔11 用于制造悬浮溶剂的树脂从分离膜10的另一个主面侧通过,并且通过辅助膜2吸附无机颗粒,在辅助膜2中基本上防止其通过,从而填充分离膜10的通孔11, 无机颗粒12.版权所有(C)2006,JPO&NCIPI
    • 9. 发明专利
    • Multilayer wiring board
    • 多层接线板
    • JP2003008233A
    • 2003-01-10
    • JP2001184567
    • 2001-06-19
    • Nitto Denko Corp日東電工株式会社
    • MOTOGAMI MITSURUKAWASHIMA TOSHIYUKITAWARA SHINJIIKEDA KENICHI
    • H05K1/02H05K3/46
    • PROBLEM TO BE SOLVED: To provide a multilayer wiring board, in which the density of a signal layer can be increased, because it is superior in high-frequency characteristics and a noise-resistant properties, and which hardly influences the matching of a characteristic impedance.
      SOLUTION: In the multilayer wiring board comprising a structure in which a ground layer 1 or a power supply layer and the signal layer 3 are arranged via an insulation layer 2, the insulation layer 2 is constituted of a porous layer whose porosity is different in its thickness direction, and a face 2a on a side on which the porosity of the porous film is high is arranged on the side of the signal layer 3.
      COPYRIGHT: (C)2003,JPO
    • 要解决的问题:为了提供信号层的密度可以提高的多层布线基板,因为它具有优异的高频特性和抗噪声性能,并且几乎不影响特性阻抗的匹配 。 解决方案:在包括通过绝缘层2布置接地层1或电源层和信号层3的结构的多层布线板中,绝缘层2由孔隙率不同的多孔层构成 厚度方向和多孔膜的孔隙率高的一侧的面2a配置在信号层3侧。