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    • 2. 发明专利
    • SIGNAL TRANSMISSION SYSTEM
    • JPS56107664A
    • 1981-08-26
    • JP1044880
    • 1980-01-30
    • NIPPON TELEGRAPH & TELEPHONEOKI ELECTRIC IND CO LTDNIPPON ELECTRIC COHITACHI LTDFUJITSU LTD
    • YASUDA TOYOJITAKEI TADASHIFUHA MASAHIROUSUI IKUOOBARA SHINICHIROU
    • H03M5/08H04J3/06H04L25/49
    • PURPOSE:To enable to completely change the receiving circuit to an integrated circuit, by constituting the system so that binary information, frame information and clock information can be transmitted by means of one transmission circuit. CONSTITUTION:When a binary signal is transmitted, the signal is inverted (for instance, the signal is made to rise) in the specified direction at the start point of the unit width T of a constant period, and corresponding to the contents (''0'', ''1'') of the binary information, the signal is inverted (for instance, the signal is made to brake) in the opposite direction of said direction by shorter width than width of T/2 (for instance, it is made ''0''), or longer width (for instance, it is made ''1''), and it is transmitted. On the other hand, when the frame information F is transmitted, the inversion of signal is halted (the signal is not made to rise or break) as to 1 signal of unit width T, and the information is transmitted. The receiving circuit generates the clock CLI of the same phase as the rise (or breaking) point of the transmission signal, the CLII (T/2 delay phase) and the CLIII (T delay phase), and the binary information, the frame information and the clock information are detected from the CLI and the transmission signal, the negative signal of the CLIII and the logical product of the CLI, and the logical sum of the CLI and III, respectively.
    • 8. 发明专利
    • ELECTRONIC CIRCUIT MODULE
    • JPH02232992A
    • 1990-09-14
    • JP5350089
    • 1989-03-06
    • NIPPON TELEGRAPH & TELEPHONE
    • SASAKI SHINICHIYASUDA TOYOJIKON TAICHI
    • H05K7/20H05K3/46
    • PURPOSE:To improve an electronic circuit module of this design in heat dissipating property without deteriorating it in wiring housing property by a method wherein two or more heat transfer bodies excellent in thermal conductivity are provided to a polyimide interlaminar insulating film. CONSTITUTION:Many heat transfer rods 15 are provided to a part of a polyimide multilayer wiring layer 5 so as to reach to the surface of a ceramic multilayer wiring board 1. The rod 15 is formed of a material such as copper or the like excellent in thermal conductivity, and an LSI chip 8 is mounted on the part where the rods 15 are provided. Therefore, heat released from the chip 8 is efficiently conducted to the board 1 passing through the rods 15. The rod 15 is made as minute as a viahole used for the interlaminar connection of the layer 5, whereby a signal and a power wiring 7a and 7b, are provided even inside a polyimide interlaminar insulating film 6. Therefore, an electronic circuit module of this design can be improved in heat dissipating property without deteriorating it in wiring housing property.
    • 9. 发明专利
    • ULTRA COMPACT PARTS ADHESION MOUNTING DEVICE
    • JPH0254999A
    • 1990-02-23
    • JP20568988
    • 1988-08-20
    • NIPPON TELEGRAPH & TELEPHONE
    • YASUDA TOYOJIKON TAICHIAKIMA KAZUICHI
    • H05K13/04H05K3/34
    • PURPOSE:To enable a parts to be mounted to a desired position accurately by retaining a needle for adhering an adhesive and a needle for sucking the parts aslant in reference to the surface of a wiring board for mounting the parts and applying the adhesive and sucking and pressing the parts while performing observation directly above the wiring board using a microscope. CONSTITUTION:First of all, the tip of a needle for adhering an adhesive 16 of a fine-moving head 6 is moved to the upper part of a well of adhesive 5 and a fine-moving screw 16 is operated to allow the needle 16 to be lowered to the inside the adhesive well and to be lifted by adhering the adhesive, thus moving closer to a position where parts are mounted. Then, by observing a microscope 15, the fine-moving screws 181-183 are rotated to allow the needle to be lowered to a specified position. Then, a parts 3 is subject to vacuum suction onto a needle for suction parts 20 where the needle tip is cut diagonally from a parts supply base 12 for retention and positioning is performed by the microscope 15, thus enabling the parts 3 to be pressed and adhered to a location where an adhesive 4 is applied.