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    • 3. 发明授权
    • Methods and circuits for testing open collectors and open drains
    • 开放收集器和开放式排水管的测试方法和电路
    • US06107814A
    • 2000-08-22
    • US530936
    • 1995-09-20
    • William C. Martin
    • William C. Martin
    • G01R31/28
    • G01R31/31715
    • The present invention is directed to methods and circuits for testing open collector or open drain output pads. In a preferred embodiment, the open collector or open drain outputs are hard driven to both their normal low and high level logic states during a test mode of operation. By actively driving open collector or open drain output pads to both their active and their inactive states, the existence of a stable output at any given sample time is guaranteed during a functionality test. The need to accurately estimate time delays associated with RC loads of external circuitry and the need to precisely strobe an open collector or open drain output following transition to an inactive, disabled state are therefore eliminated. Further, control signal inputs associated with a high impedance condition of open collector or open drain output pads can be directly examined at the circuit output using appropriate test logic.
    • 本发明涉及用于测试开路集电极或开漏输出焊盘的方法和电路。 在优选实施例中,开路集电极或开漏输出在测试操作模式期间被硬驱动到其正常的低电平和高电平逻辑状态。 通过主动驱动开路集电极或开路漏极输出焊盘到其有源和无效状态,在功能测试期间保证任何给定采样时间的稳定输出的存在。 因此,需要精确地估计与外部电路的RC负载相关联的时间延迟,并且在转换到非活动的禁用状态之后,需要精确地选通开路集电极或开漏输出。 此外,可以使用适当的测试逻辑在电路输出处直接检查与开路集电极或开漏输出焊盘的高阻抗条件相关联的控制信号输入。
    • 5. 发明授权
    • Computer cooling system using recycled coolant
    • 使用回收冷却液的计算机冷却系统
    • US4644443A
    • 1987-02-17
    • US781064
    • 1985-09-27
    • Michael W. SwensenWilliam C. MartinHenry H. Kight
    • Michael W. SwensenWilliam C. MartinHenry H. Kight
    • H05K7/20
    • H05K7/20572
    • An enclosed, electronic system has a plurality of lower power-dissipating electronic components mounted on a chassis. The components are positioned adjacent each other to form low volume fluid ducts therebetween. A low volume fluid duct is formed between one side of the plurality and one end enclosure of the system. At least one higher power-dissipating electronc component is also mounted on the chassis, forming a high volume fluid duct between one of its sides and one side of the last of the lower power-dissipating electronic components, and a high volume fluid duct also formed between the other side of the higher power-dissipating electronic component and the other end enclosure. Air is caused to blow through the low volume fluid duct and then to be exhausted through the high volume fluid ducts. The rate of air flow through the high volume ducts is one half of the minimum required to cool the higher power-dissipating component. The rate of air flow through the low volume fluid ducts is at least one half of that required to cool each of the lower power-dissipating electronic components. By exhausting the cooling air from the low volume fluid channels through the high volume fluid ducts, the air flow required is less than the total required for the low volume fluid ducts plus the high volume fluid ducts.
    • 封闭的电子系统具有安装在底盘上的多个较低功率耗散的电子部件。 这些部件彼此相邻地定位,以在它们之间形成低体积的流体管道。 在系统的多个一端和一端封套之间形成低体积的流体管道。 至少一个较高的功率消耗电子部件也安装在底盘上,在其一侧和最后一个功率耗散电子部件的一侧之间形成大体积的流体管道,并且还形成了大体积的流体管道 在较高功率耗散电子部件的另一侧和另一端壳体之间。 使空气吹过低体积流体管道,然后通过高体积流体管道排出。 通过高容量管道的空气流速是冷却较高功率耗散部件所需的最小值的一半。 通过低体积流体管道的空气流速是冷却每个较低功率耗散电子部件所需的空气流量的至少一半。 通过从低体积流体通道排出冷却空气通过高容积流体管道,所需的空气流量小于低体积流体管道加上高体积流体管道所需的总气流量。