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1. 发明专利

DE3891340T1 未知
公开(公告)号：DE3891340T1
公开(公告)日：1990-06-07
申请号：DE3891340
申请日：1988-07-05
申请人： MITSUBISHI ELECTRIC CORP , MITSUBISHI RAYON CO
发明人： KUBOTA SHIGERU , MASUI KATSUE , MORIWAKI TOSHIMOTO , ANDOU TORAHIKO
IPC分类号： C08F2/50 , C08F20/36 , C08F299/06 , C08G18/67 , C08J3/24 , C08J3/28 , C08L75/14 , G03F7/028

2. 发明专利

DE3891340C2 Heat and chemical resistant photosensitive resin for printed circuits 未知
公开(公告)号：DE3891340C2
公开(公告)日：1996-11-28
申请号：DE3891340
申请日：1988-07-05
申请人： MITSUBISHI ELECTRIC CORP , MITSUBISHI RAYON CO
发明人： KUBOTA SHIGERU , MASUI KATSUE , MORIWAKI TOSHIMOTO , ANDOU TORAHIKO
IPC分类号： G03F7/035 , C08F2/50 , C08F20/36 , C08F299/06 , C08G18/67 , C08J3/24 , C08J3/28 , C08L75/14 , G03C1/00 , G03F7/004 , G03F7/027 , G03F7/028 , G03F7/038 , G03F7/039 , H05K3/00 , H05K3/06 , H05K3/28
摘要： A photosensitive resin compsn. contains (a) a polyurethane poly(meth)acrylate obtd. by reaction of an isocyanate (I) with diol mono(meth)acrylate (where k is 1 or 2; j is 1 or 2; m is 1 or 2; n is 0-20; P1 is H or methyl; Q1 is H or methyl; R1 is H or methyl); (b) a linear high mol.wt. cpd.; (c) a polymerisation initiator which releases free radicals when irradiated with light. The compsn. may also contain a bisphenol epoxy(meth)acrylate (aa); or tetrazole or a tetrazole deriv.; or a cpd. (II) (where T is an ortho-substd. divalent aryl hydrocarbon residue; X is CH2, NCl, NH, S, O or Se; Z is N or CY; Y is H, amino, 1-4C alkyl or halogen). The proportion (a):(b):(c) by wt. is pref. (a) 20-80 (esp. 30-60); (b) 20-80 (esp. 30-60); (c) 1-10 (esp. 3-7). Where (aa) is present (a) is pref. 10-60 pts.; (b) 20-60 pts. and (aa) 5-45 pts. (where (a)+(b)+(aa) = 100).

3. 发明专利

JPS63216399A MANUFACTURE OF PRINTED CIRCUIT BOARD 失效
公开(公告)号：JPS63216399A
公开(公告)日：1988-09-08
申请号：JP5075887
申请日：1987-03-05
申请人： MITSUBISHI ELECTRIC CORP
发明人： MASUI KATSUE , KUBOTA SHIGERU , YANAGIURA SATOSHI , MORIWAKI NORIMOTO , ANDO TORAHIKO
IPC分类号： H05K3/42 , H05K3/18

4. 发明专利

JPS62159140A PHOTOSENSITIVE RESIN COMPOSITION AND ITS PATTERN FORMING METHOD 失效
公开(公告)号：JPS62159140A
公开(公告)日：1987-07-15
申请号：JP243886
申请日：1986-01-07
申请人： MITSUBISHI ELECTRIC CORP
发明人： MASUI KATSUE , MORIWAKI NORIMOTO , ANDO TORAHIKO
IPC分类号： C08F2/44 , C08F2/48 , C08F290/00 , C08F299/02 , G03F7/032 , H05K3/00 , H05K3/18
摘要： PURPOSE:To obtain a photosensitive resin composition capable of forming a fine pattern by photography and enduring nonelectrolytic copper plating conditions by incorporating the reaction product of a monocarboxylic acid having an ethylenically unsaturated bond and an epoxy resin, and a compound having an ethylenically unsaturated bond. CONSTITUTION:This photosensitive resin composition is composed of the reaction product of the monocarboxylic acid having an ethylenically unsaturated bond and the epoxy resin, the compound having an ethylenically unsaturated bond, a binder polymer, a photopolymerization initiator, a heat polymerization inhibitor, a solvent, and a colorant. A base plate is coated with said composition, subjected to a photographic pattern forming process, and to at least imperfect polymerization, and then, to perfect polymerization by using strong UV rays irradiation in combination with heating, thus permitting a pattern having resistance to nonelectrolytic plating solution and heat resistance for forming a permanent plated pattern.

5. 发明专利

JPH01105240A PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE ELEMENT 失效
公开(公告)号：JPH01105240A
公开(公告)日：1989-04-21
申请号：JP16845288
申请日：1988-07-05
申请人： MITSUBISHI ELECTRIC CORP
发明人： KUBOTA SHIGERU , MASUI KATSUE , MORIWAKI NORIMOTO , ANDO TORAHIKO
IPC分类号： G03F7/035 , C08F2/50 , C08F20/36 , C08F299/06 , C08G18/67 , C08J3/24 , C08J3/28 , C08L75/14 , G03C1/00 , G03F7/004 , G03F7/027 , G03F7/028 , G03F7/038 , G03F7/039 , H05K3/00 , H05K3/06 , H05K3/28
摘要： PURPOSE:To provide the title compsn. which has heat resistance and chemical resistance and is usable for formation of a protective film for chemical plating in particular by using the compsn. contg. specific polyurethane (meth)acrylate, linear high-polymer compd. and polymn. initiator which forms free radicals when subjected to photoirradiation. CONSTITUTION:The compsn. contg. the polyurethane (meth)acrylate which is obtd. by bringing the polyvalent arom. isocyanate expressed by formula and monoester of (meth)acrylate of dihydric alcohol into reaction and has >=2 (meth)acryloyl groups and >=2 urethane bonds in one molecule, the linear high- polymer compd. and the polymn. initiator which forms the free radicals when subjected to photoirradiation is used. In formula, (k), (l), (m) denote 1 or 2; P1-(5-k) denotes a hydrogen atom or methyl group; Q1-(4-l) denotes a hydrogen atom or methyl group; R1-(5-m) denotes a hydrogen atom or methyl group; (n) denotes integer in the range of 0-20. The compsn. having the heat resistance and chemical resistance is thereby obtd. Said compsn. is usable for forming the protective film for chemical plating in particular.

6. 发明专利

JPS63185092A MANUFACTURE OF PRINTED CIRCUIT BOARD 失效
公开(公告)号：JPS63185092A
公开(公告)日：1988-07-30
申请号：JP1683487
申请日：1987-01-27
申请人： MITSUBISHI ELECTRIC CORP
发明人： MASUI KATSUE , KUBOTA SHIGERU , YANAGIURA SATOSHI , MORIWAKI NORIMOTO , ANDO TORAHIKO
IPC分类号： H05K3/42

7. 发明专利

JPH0555074B2 失效
公开(公告)号：JPH0555074B2
公开(公告)日：1993-08-16
申请号：JP6052787
申请日：1987-03-16
申请人： MITSUBISHI ELECTRIC CORP
发明人： KUBOTA SHIGERU , YANAGIURA SATOSHI , MASUI KATSUE , MORIWAKI NORIMOTO , ANDO TORAHIKO
IPC分类号： C08G59/00 , C08G59/14 , C08G59/17 , C08G59/18 , G03F7/027 , G03F7/038 , H05K3/18 , H05K3/06

8. 发明专利

JPH0555072B2 失效
公开(公告)号：JPH0555072B2
公开(公告)日：1993-08-16
申请号：JP6052587
申请日：1987-03-16
申请人： MITSUBISHI ELECTRIC CORP
发明人： KUBOTA SHIGERU , YANAGIURA SATOSHI , MASUI KATSUE , MORIWAKI NORIMOTO , ANDO TORAHIKO
IPC分类号： C08G59/00 , C08G59/14 , C08G59/16 , C08G59/17 , C08G59/18 , C08G59/40 , G03F7/027 , G03F7/028 , G03F7/032 , G03F7/038 , H05K3/18 , H05K3/06

9. 发明专利

JPH02238942A IMPROVEMENT OF ADHESIVE PROPERTY BETWEEN COPPER FOIL AND RESIN 失效
公开(公告)号：JPH02238942A
公开(公告)日：1990-09-21
申请号：JP5997289
申请日：1989-03-13
申请人： MITSUBISHI ELECTRIC CORP
发明人： MASUI KATSUE , KUBOTA SHIGERU , MORIWAKI NORIMOTO , SATO SADAO , FUJITA IWAO , MORI KAZUOKI
IPC分类号： B32B15/08 , C23F1/00 , C23G1/10 , H05K3/06 , H05K3/28
摘要： PURPOSE:To improve adhesive properties between a resin and a copper foil by forming a film of copper oxide on the surface of the copper foil, dissolving and removing the oxide film formed on the surface with an acid and thereby roughening the surface of the copper foil when the copper foil and the resin are heat-pressed. CONSTITUTION:When a copper foil and a resin are heat-pressed, after a film of copper oxide is formed on the surface of the copper foil, the oxide film is dissolved and removed by means of a chem. treatment with an acid and the surface of the copper foil is thereby roughened to improved adhesive properties between the copper foil and the resin. As copper oxide is easily dissolved by means of an acid hydrolysis compared with copper, when acid treatment is performed after the oxide film is formed, only the oxide layer is selectively dissolved and removed and a roughened copper surface appears. As the thickness of the copper oxide film is scores to thousands Angstrom , there is no possibility that all the copper foil is converted to copper oxide and then dissolved and removed. Adhesive properties between a conductive metal and the resin can be improved by this method and peeling of a resist pattern, getting into inside of a plating, infiltration of a plating liq., peeling and crack caused by thermal and mechanical shock, an interlaminar peeling of the inner conductive body and a prepreg can be prevented.

10. 发明专利

JPH0284413A PHOTOSENSITIVE RESIN COMPOSITION FOR CHEMICAL PLATING 失效
公开(公告)号：JPH0284413A
公开(公告)日：1990-03-26
申请号：JP23537188
申请日：1988-09-20
申请人： MITSUBISHI ELECTRIC CORP
发明人： MASUI KATSUE , KUBOTA SHIGERU , MORIWAKI NORIMOTO
IPC分类号： C08F299/06 , C08F290/00 , H05K3/00
摘要： PURPOSE:To obtain the title composition readily photocurable, to be used for forming protective films by incorporating a silane coupling agent as an adherability improver into a composition comprising a specific ethylenic unsaturated compound, thermoplastic polymer, polymerization initiator and thermal polymerization inhibitor. CONSTITUTION:The objective composition comprising (A) an ethylenic unsaturated compound liquid or solid at normal temperature, containing at least two ethylenic unsaturated bonds and capable of forming a polymer by addition polymerization using a photopolymerization initiator [e.g., (meth)acrylic ester], (B) a thermoplastic polymer (e.g., polyvinyl butyral), (C) a photopolymerization initiator capable of generating free radicals by active ray irradiation (e.g., 2-ethyl anthraquinone), (D) a thermal polymerization inhibitor (e.g., p- methoxyphenol), and (E) a silane coupling agent as an adherability improver.

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