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1. 发明申请

US20050197048A1 Method for manufacturing a workpiece and torque transducer module 审中-公开
标题翻译：制造工件和扭矩传感器模块的方法
公开(公告)号：US20050197048A1
公开(公告)日：2005-09-08
申请号：US10791828
申请日：2004-03-04
申请人： Leping Li , Werner Moser , Yingru Gu
发明人： Leping Li , Werner Moser , Yingru Gu
IPC分类号： B24B49/00 , B24B51/00
CPC分类号： B24B37/013 , B24B49/16 , Y10T29/49007
摘要： A method for manufacturing a workpiece and a torque transducer module for material removal techniques, are disclosed, where machining friction varies in dependency of machining depth and the torque/deformation of a shaft is monitored for controlling material removal. The module has a body extending along a central axis and two end portions. Each end portion is part of an axial mount for a respective part to be axially mounted thereto. The module also includes a strain gage sensor arrangement with at least one electric output.
摘要翻译：公开了用于制造工件的方法和用于材料去除技术的扭矩传感器模块，其中加工摩擦随着加工深度而变化，并且监测轴的扭矩/变形以控制材料去除。模块具有沿中心轴线和两个端部部分延伸的主体。每个端部是用于相应部件轴向安装到其上的轴向安装件的一部分。该模块还包括具有至少一个电输出的应变计传感器装置。

2. 发明授权

US06835117B1 Endpoint detection in chemical-mechanical polishing of patterned wafers having a low pattern density 失效
标题翻译：具有低图案密度的图案化晶片的化学机械抛光中的端点检测
公开(公告)号：US06835117B1
公开(公告)日：2004-12-28
申请号：US10707120
申请日：2003-11-21
申请人： Xinhui Wang , Leping Li , Yingru Gu , Hung-Chin Guthrie
发明人： Xinhui Wang , Leping Li , Yingru Gu , Hung-Chin Guthrie
IPC分类号： B24B4900
CPC分类号： B24B37/013 , B24B49/00 , B24B57/02
摘要： A chemical-mechanical polishing (CMP) system and method includes pumping polishing slurry from a CMP apparatus through a sampling tube to an endpoint detection apparatus during a polishing operation, and flushing the sampling tube while a polishing operation is not in progress. The flushing of the sampling tube is commenced in accordance with a control signal from the endpoint detection apparatus terminating the polishing operation; the flushing is terminated in accordance with a starting signal to the CMP apparatus. The pump, which pumps a sample of slurry into the endpoint detection apparatus, continuously pumps slurry and/or water. Clogging of the slurry sampling tube is thus eliminated, thereby ensuring robust operation of the CMP apparatus. Contamination of the sampling tube is also avoided, so that the system may reliably provide sensitive endpoint detection and process control, even when a film of low pattern density is polished.
摘要翻译：化学机械抛光（CMP）系统和方法包括在抛光操作期间将抛光浆料从CMP装置通过采样管泵送到端点检测装置，并且在抛光操作未进行时冲洗采样管。取样管的冲洗是根据来自终点检测装置的终止抛光操作的控制信号开始的; 根据到CMP设备的启动信号来终止冲洗。将浆料样品泵入端点检测装置的泵连续地泵送浆液和/或水。因此消除了浆料采样管的堵塞，从而确保CMP设备的稳定操作。也避免了采样管的污染，使得系统可以可靠地提供敏感的端点检测和过程控制，即使当低图案密度的膜被抛光时。

3. 发明授权

US06741913B2 Technique for noise reduction in a torque-based chemical-mechanical polishing endpoint detection system 失效
标题翻译：基于扭矩的化学机械抛光终点检测系统降噪技术
公开(公告)号：US06741913B2
公开(公告)日：2004-05-25
申请号：US10013196
申请日：2001-12-11
申请人： Xinhui Wang , Yingru Gu , Leping Li
发明人： Xinhui Wang , Yingru Gu , Leping Li
IPC分类号： G05B1300
CPC分类号： B24B37/013 , B24B49/16
摘要： A method is described for noise reduction in a CMP endpoint detection system employing torque measurement. The torque signals are acquired using an adjustable sampling rate and sample size, and averaged using a moving array of adjustable size. By introducing these three adjustable quantities in the torque-based endpoint control algorithm and properly setting their values in the endpoint detection recipe, periodic noise associated with carrier rotation and carrier oscillation can be effectively removed. This in turn permits reliable, closed-loop control of the CMP process.
摘要翻译：描述了在采用扭矩测量的CMP端点检测系统中降噪的方法。转矩信号采用可调取样率和采样尺寸获得，并使用可调节尺寸的移动阵列进行平均。通过在基于扭矩的端点控制算法中引入这三个可调整量，并在端点检测配方中正确设置它们的值，可以有效地消除与载波旋转和载波振荡相关的周期性噪声。这反过来又允许对CMP工艺进行可靠的闭环控制。

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