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1. 发明授权

US06278180B1 Ball-grid-array-type semiconductor device and its fabrication method and electronic device 失效
标题翻译：球栅阵列型半导体器件及其制造方法和电子器件
公开(公告)号：US06278180B1
公开(公告)日：2001-08-21
申请号：US09066876
申请日：1998-04-28
申请人： Kiyoshi Mizushima , Makoto Aoki , Satoshi Ikeda , Noriyuki Tanagi
发明人： Kiyoshi Mizushima , Makoto Aoki , Satoshi Ikeda , Noriyuki Tanagi
IPC分类号： H01L2312
CPC分类号： H01L24/81 , H01L23/3128 , H01L23/49816 , H01L24/48 , H01L24/73 , H01L2224/05001 , H01L2224/05009 , H01L2224/05022 , H01L2224/05568 , H01L2224/0557 , H01L2224/13111 , H01L2224/13147 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/81801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/351 , H05K3/3436 , H05K2201/10234 , H05K2201/10734 , H05K2201/10992 , H05K2203/041 , Y02P70/613 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： A ball-grid-array-type semiconductor device comprising a package substrate constituted with a ceramic wiring board having a semiconductor chip mounting portion on the principal plane and electrodes arranged like an array on the back, a semiconductor chip secured to the principal plane of the package substrate, connection means for electrically connecting the electrodes of the semiconductor chip with the wiring of the wiring board, a sealing body provided for the principal plane side of the wiring board and made of an insulating resin to cover the semiconductor chip and the connection means, a pedestal layer made of low-fusion-point solder and formed on the electrodes, and a metallic ball secured onto the pedestal layer; wherein a buffering layer made of high-fusion-point solder which covers the entire surface of the electrodes and whose margin extends up to a predetermined length on the back of the package substrate is formed on the electrodes and the pedestal layer is formed on the buffering layer.
摘要翻译：一种球栅阵列型半导体器件，包括：由在主平面上具有半导体芯片安装部分的陶瓷布线板和背面排列成阵列的电极构成的封装基板，固定在该主体上的主平面的半导体芯片封装基板，用于将半导体芯片的电极与布线板的布线电连接的连接装置，设置在布线板的主平面侧并由绝缘树脂制成以覆盖半导体芯片和连接装置的密封体由低熔点焊料制成并形成在电极上的基座层和固定在基座层上的金属球; 其特征在于，在所述电极上形成有由覆盖所述电极的整个表面并且其边缘在所述封装基板的背面延伸至预定长度的高熔点焊料制成的缓冲层，并且所述基座层形成在所述缓冲层。

2. 发明授权

US6165816A Fabrication of electronic components having a hollow package structure with a ceramic lid 失效
标题翻译：具有陶瓷盖的具有中空封装结构的电子部件的制造
公开(公告)号：US6165816A
公开(公告)日：2000-12-26
申请号：US925928
申请日：1997-09-08
申请人： Kiyoshi Mizushima , Makoto Aoki , Satoshi Ikeda
发明人： Kiyoshi Mizushima , Makoto Aoki , Satoshi Ikeda
IPC分类号： H01L23/10 , H01L21/44
CPC分类号： H01L23/10 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2924/01079 , H01L2924/13091 , H01L2924/16152 , H01L2924/00014 , H01L2924/00
摘要： A process for fabricating an electronic component having a hollow packaging structure comprises the steps of: (a) printing an organic polymeric material on at least a portion of a main surface of a ceramic substrate where a ceramic lid is to be bonded and curing the printed organic polymeric material to form a cured product; (c) hermetic sealing the ceramic lid on a surface of the cured product with an organic bonding agent; and preferably (b) irradiating ultraviolet rays onto a surface of said cured product to form activated bonding sites between said steps (a) and (c). According to the process, a hollow package mounted with an electronic component can be fabricated efficiently.
摘要翻译：一种制造具有中空包装结构的电子部件的方法，包括以下步骤：（a）在陶瓷基板的至少一部分的陶瓷基板上印刷有机聚合物材料，陶瓷基板的主表面将要接合并固化印刷有机聚合物材料以形成固化产物; （c）用有机粘合剂将陶瓷盖密封在固化产品的表面上; 并且优选（b）在所述固化产物的表面上照射紫外线以在所述步骤（a）和（c）之间形成活化的结合位点。根据该方法，可以有效地制造安装有电子部件的中空包装。

3. 发明授权

US08175894B2 X-ray exposure report system, medical apparatus, and examination protocol distribution system 有权
标题翻译： X射线曝光报告系统，医疗仪器和检查协议分发系统
公开(公告)号：US08175894B2
公开(公告)日：2012-05-08
申请号：US11071347
申请日：2005-03-04
申请人： Naoki Oowaki , Yoichi Takada , Satoshi Ikeda , Fumiaki Teshima , Akihiro Miyauchi
发明人： Naoki Oowaki , Yoichi Takada , Satoshi Ikeda , Fumiaki Teshima , Akihiro Miyauchi
IPC分类号： G06Q10/00 , G06Q50/00 , H05G1/28
CPC分类号： A61B6/542 , A61B6/545 , A61B6/566 , G06F19/00 , G06Q10/10 , G06Q50/22 , G06Q50/24 , G16H40/20 , G16H50/70
摘要： A radiation report system includes a storage unit for storing a plurality of records including an exposure dose, an examination protocol, an examination part, a patient's age and a patient's weight with regard to the plurality of radiation examinations using a plurality of radiation diagnosis apparatuses. The plurality of records stored in the storage unit is classified into a plurality of groups based on the examination protocol, the examination part or patient information. An exposure report is created for each group based on the plurality of records stored in the storage unit. The data of the exposure report is served with a client side terminal.
摘要翻译：辐射报告系统包括：存储单元，用于使用多个辐射诊断装置存储关于多个辐射检查的曝光剂量，检查方案，检查部分，患者年龄和患者体重的多个记录。存储在存储单元中的多个记录基于检查协议，检查部分或患者信息被分类为多个组。基于存储在存储单元中的多个记录，为每个组创建曝光报告。曝光报告的数据与客户端终端一起提供。

4. 发明授权

US07820607B2 Viscosity modifier for lubricating oils, additive composition for lubricating oils, and lubricating oil compositions 有权
标题翻译：用于润滑油的粘度调节剂，用于润滑油的添加剂组合物和润滑油组合物
公开(公告)号：US07820607B2
公开(公告)日：2010-10-26
申请号：US11662139
申请日：2005-09-08
申请人： Akihiro Matsuda , Ryousuke Kaneshige , Satoshi Ikeda , Keiji Okada
发明人： Akihiro Matsuda , Ryousuke Kaneshige , Satoshi Ikeda , Keiji Okada
IPC分类号： C10M143/00
CPC分类号： C08F210/06 , C08F4/65908 , C08F4/65912 , C08F210/16 , C08F2420/02 , C10M143/06 , C10M143/08 , C10M2203/1006 , C10M2205/022 , C10N2220/021 , C10N2220/022 , C10N2230/02 , C08F4/6592 , C08F210/14 , C08F2500/17 , C08F2500/03 , C08F2500/20 , C10M2205/026 , C10M2205/024 , C10M2205/028
摘要： A viscosity modifier for lubricating oils or an additive composition for lubricating oils, which is excellent in oil-thickening properties and can provide lubricating oil compositions excellent in low-temperature characteristics and handleability at low temperatures; and lubricating oil compositions excellent in low-temperature characteristics and handleability at low temperatures. The viscosity modifier comprises an ethylene/α-olefin copolymer (B) which comprises (i) a structural unit derived from ethylene, (ii) a structural unit derived from an α-olefin having 3 to 19 carbon atoms, and (iii) a structural unit derived from a higher α-olefin having 4 to 20 carbon atoms whose carbon number is by one or more larger than that of the α-olefin having the unit (ii) which has the following properties of (1) and (2): (1) the contents of units (i), (ii) and (iii) are 25-49 mol %, 15-55 mol %, and 9-40 mol % respectively (with the proviso that the total of the units (i), (ii), and (iii) is 100 mol %) and (2) the intrinsic viscosity [η] is 0.5 to 5.0 dl/g.
摘要翻译：一种用于润滑油的粘度调节剂或润滑油添加剂组合物，其油增稠性能优异，并且可以提供低温特性和低温处理性优异的润滑油组合物; 以及在低温下具有优异的低温特性和可操作性的润滑油组合物。粘度调节剂包括乙烯/α-烯烃共聚物（B），其包含（i）衍生自乙烯的结构单元，（ii）衍生自具有3至19个碳原子的α-烯烃的结构单元，和（iii）具有碳原子数为1以上的具有碳原子数4〜20的高级α-烯烃的结构单元比具有（1）和（2）的以下性质的具有单元（ⅱ）的α-烯烃的碳原子数为1以上，：（1）单位（i），（ii）和（iii）的含量分别为25-49mol％，15-55mol％和9-40mol％（条件是单位（ i），（ii）和（iii）为100摩尔％）和（2）特性粘度[ηe]为0.5〜5.0dl / g。

5. 发明申请

US20100171823A1 ALIGNMENT APPARATUS FOR SEMICONDUCTOR WAFER 审中-公开
标题翻译：半导体波形对准装置
公开(公告)号：US20100171823A1
公开(公告)日：2010-07-08
申请号：US12649120
申请日：2009-12-29
申请人： Masayuki Yamamoto , Satoshi Ikeda
发明人： Masayuki Yamamoto , Satoshi Ikeda
IPC分类号： H04N7/18 , G01B11/26
CPC分类号： H01L21/681
摘要： A wafer has an annular ridge formed along an outer periphery thereof to serve as a reinforcing portion, and a circuit pattern surrounded with the reinforcing portion. The wafer is placed on a wafer placement plane of a holding stage in a state that the circuit pattern is directed downward. The wafer placement plane is larger in size than the wafer. On the holding stage, a center of the wafer is aligned with a center of the holding stage in such a manner that a plurality of guide pins are engaged with relevant cutout portions formed on the reinforcing portion. Then, the holding stage rotates while suction-holding the reinforcing portion of the wafer, and simultaneously a photosensor detects a portion for alignment formed on the outer periphery of the wafer.
摘要翻译：晶片具有沿其外周形成的环形脊，用作加强部分，以及由加强部分包围的电路图案。将晶片放置在电路图案向下的状态下的保持台的晶片放置平面上。晶片放置平面的尺寸大于晶片。在保持台上，将晶片的中心与保持台的中心对准，使得多个引导销与形成在加强部上的相关切口部接合。然后，在保持晶片的加强部分的同时，保持台旋转，同时光电传感器检测形成在晶片的外周上的对准部分。

6. 发明申请

US20070160346A1 READING APPARATUS, READING METHOD, PROGRAM, AND PROGRAM RECORDING MEDIUM 审中-公开
标题翻译：阅读设备，阅读方法，程序和程序记录介质
公开(公告)号：US20070160346A1
公开(公告)日：2007-07-12
申请号：US11609044
申请日：2006-12-11
申请人： Satoshi Ikeda , Koichi Kasai , Masaaki Isozaki
发明人： Satoshi Ikeda , Koichi Kasai , Masaaki Isozaki
IPC分类号： H04N7/00
CPC分类号： G11B27/105 , G11B27/329 , G11B2020/10768 , G11B2220/2562 , G11B2220/415
摘要： A reading apparatus for reading data from a digital versatile disc (DVD) generates information indicating a plurality of predetermined portions of content stored on the digital versatile disc, based on navigation information of the DVD on which the content is recorded. A storage reads the predetermined portions from the DVD based on the generated information and stores the predetermined portions on a storage medium. A reading control section controls reading of data from the DVD and the storage medium so that the data of the predetermined portions stored on the storage medium is read and data subsequent to the data read from the storage medium is read from the DVD if reading of the data of the content is requested.
摘要翻译：用于从数字通用盘（DVD）读取数据的读取装置基于内容被记录在其上的DVD的导航信息产生指示存储在数字多功能光盘上的多个预定部分内容的信息。存储器基于所生成的信息从DVD读取预定部分，并将预定部分存储在存储介质上。读取控制部分控制从DVD和存储介质的数据的读取，以便读取存储在存储介质上的预定部分的数据，并从DVD中读取从数据读取数据之后的数据，如果读取请求内容的数据。

7. 发明授权

US07208833B2 Electronic circuit device having circuit board electrically connected to semiconductor element via metallic plate 失效
标题翻译：具有通过金属板电连接到半导体元件的电路板的电子电路装置
公开(公告)号：US07208833B2
公开(公告)日：2007-04-24
申请号：US11069975
申请日：2005-03-03
申请人： Kazuhiro Nobori , Satoshi Ikeda , Yasushi Kato , Yasufumi Nakajima
发明人： Kazuhiro Nobori , Satoshi Ikeda , Yasushi Kato , Yasufumi Nakajima
IPC分类号： H01L25/07 , H01L23/04 , H01L23/34 , H01L23/10 , B23K31/02
CPC分类号： H01L23/492 , H01L23/49562 , H01L23/645 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/81 , H01L24/83 , H01L25/072 , H01L25/162 , H01L2224/05571 , H01L2224/05573 , H01L2224/13144 , H01L2224/16 , H01L2224/16225 , H01L2224/291 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2224/48247 , H01L2224/48472 , H01L2224/73153 , H01L2224/73253 , H01L2224/73265 , H01L2224/81193 , H01L2224/81801 , H01L2224/8319 , H01L2224/83801 , H01L2224/85205 , H01L2924/00011 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/15153 , H01L2924/15165 , H01L2924/15174 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/351 , H05K1/144 , H01L2924/00014 , H01L2924/00 , H01L2924/00015 , H01L2224/83205 , H01L2924/00012
摘要： An electronic circuit device comprises: a semiconductor element having a first surface and a second surface, with the first and second surfaces being on first and second sides of the semiconductor element, respectively, and facing in opposite directions; a first electrode on the first surface; a second electrode on the second surface; a first circuit board electrically connected to the first electrode via a metallic plate such that the metallic plate and the semiconductor element are on the first circuit board; a second circuit board on the second side of the semiconductor element, the second circuit board having a control circuit for the semiconductor element; and a metallic wire for directly electrically interconnecting the second electrode and the second circuit board.
摘要翻译：电子电路装置包括：具有第一表面和第二表面的半导体元件，其中第一和第二表面分别在半导体元件的第一和第二侧上并面向相反方向; 第一表面上的第一电极; 在第二表面上的第二电极; 第一电路板，经由金属板电连接到第一电极，使得金属板和半导体元件在第一电路板上; 在所述半导体元件的第二侧上的第二电路板，所述第二电路板具有用于所述半导体元件的控制电路; 以及用于将第二电极和第二电路板直接电互连的金属线。

8. 发明申请

US20070030568A1 High-reflectance visible-light reflector member, liquid-crystal display backlight unit employing the same, and manufacture of the high-reflectance visible-light reflector member 审中-公开
标题翻译：高反射率可见光反射器部件，采用该反射器的液晶显示器背光单元以及高反射率可见光反射器部件
公开(公告)号：US20070030568A1
公开(公告)日：2007-02-08
申请号：US11492217
申请日：2006-07-25
申请人： Tadahiro Ohmi , Tetsuya Goto , Nobuaki Seki , Satoshi Ikeda , Kouichi Niikura
发明人： Tadahiro Ohmi , Tetsuya Goto , Nobuaki Seki , Satoshi Ikeda , Kouichi Niikura
IPC分类号： G02B1/10 , F21V9/04 , G02F1/1335 , B32B17/06 , C23C14/00 , C23C14/32
CPC分类号： G02B5/0858 , C23C14/022 , C23C14/205 , C23C14/345 , C23C14/584 , C23C16/0281 , C23C16/345 , C23C28/322 , C23C28/34 , C23C28/36 , G02B6/0055
摘要： A reflector member of the present invention includes a silver thin film formed on a substrate and a silicon nitride protection film formed on the silver thin film. The silver thin film has the (111) orientation as the principal plane orientation. Preferably, 99% or more of the silver thin film has the (111) orientation as the principal plane orientation. The thickness of the silver thin film is in a range of 100 nm to 350 nm.
摘要翻译：本发明的反射构件包括形成在基板上的银薄膜和形成在银薄膜上的氮化硅保护膜。银薄膜具有（111）取向作为主平面取向。优选地，99％以上的银薄膜的（111）取向为主面取向。银薄膜的厚度在100nm至350nm的范围内。

9. 发明授权

US07033461B2 Thin film forming apparatus and method 有权
标题翻译：薄膜成膜装置及方法
公开(公告)号：US07033461B2
公开(公告)日：2006-04-25
申请号：US10284287
申请日：2002-10-31
申请人： Noriaki Tani , Toshihiro Suzuki , Satoshi Ikeda , Hiroaki Kawamura , Satoru Ishibashi , Kouichi Hanzawa , Takafumi Matsumoto
发明人： Noriaki Tani , Toshihiro Suzuki , Satoshi Ikeda , Hiroaki Kawamura , Satoru Ishibashi , Kouichi Hanzawa , Takafumi Matsumoto
IPC分类号： C23C14/35 , C23C16/00
CPC分类号： C23C14/044 , C23C14/545
摘要： The present invention provides an efficient thin film forming apparatus which is capable of correcting a film thickness so as to take care of a variation in distribution in the film thickness and to take care of the circumferential distribution of the film thickness, as well as a method for forming a thin film using this film forming apparatus. The method comprises the first step of first forming a thin film to a predetermined percentage out of thickness through an opening 8a in a shutter 8, the second step of then using a film thickness monitor 10 to measure the distribution of the thickness of the thin film formed in the first step, and the third step of reducing a film formation rate by an opening 8b in the shutter 8 between a substrate 4 and a sputtering cathode 6 as compared to that of the first step and correcting the thickness of the thin film by an opening 13a in the first film thickness correcting plate 13 between the substrate 4 and the sputtering cathode 6 corresponding to the distribution of the film thickness measured by the film thickness monitor 10 in the second step. Then, the second step is carried out again, during which the film thickness monitor 10 is used to measure the distribution of the thickness of the thin film formed in the third step. Further, the third and second steps are repeatedly carried out.
摘要翻译：本发明提供了一种有效的薄膜形成装置，该薄膜形成装置能够校正膜厚度，以便保证薄膜厚度分布的变化，并且能够保证薄膜厚度的周向分布，以及方法用于使用该成膜装置形成薄膜。该方法包括首先通过快门8中的开口8a将薄膜首先形成预定百分比的厚度的第一步骤，然后使用薄膜厚度监测器10来测量薄膜厚度的分布的第二步骤在第一步骤中形成的薄膜，以及第三步骤，通过与第一步骤相比在基板4和溅射阴极6之间的快门8中的开口8b降低成膜速率，并且校正薄膜的厚度在第二步骤中，由基板4和溅射阴极6之间的第一膜厚校正板13的开口部分13a对应于由膜厚度监视器10测量的膜厚度的分布。然后，再次进行第二步骤，在此期间，膜厚度监测器10用于测量在第三步骤中形成的薄膜的厚度分布。此外，重复执行第三和第二步骤。

10. 发明申请

US20050231440A1 Plasma display panel driver and plasma display 审中-公开
公开(公告)号：US20050231440A1
公开(公告)日：2005-10-20
申请号：US11049564
申请日：2005-02-02
申请人： Manabu Inoue , Satoshi Ikeda , Yasuhiro Arai
发明人： Manabu Inoue , Satoshi Ikeda , Yasuhiro Arai
IPC分类号： G09G3/28
CPC分类号： G09G3/2965 , G09G3/2927 , G09G2320/0238 , G09G2330/024 , G09G2330/06
摘要： A reset pulse generating section applies the total of voltages of a positive voltage source and two constant-voltage sources from a high side ramp wave generating section to a high side scan switching device as the upper limit of a reset voltage pulse, and applies the ground potential from a low side ramp wave generating section to a low side scan switching device as the lower limit of the reset voltage pulse. A sustaining pulse generating section applies the upper and lower limits of a sustaining voltage pulse through a common sustaining pulse transmission path to the low side scan switching device.

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