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    • 7. 发明授权
    • Method of growing GaN crystal, method of producing single crystal GaN substrate, and single crystal GaN substrate
    • 生长GaN晶体的方法,单晶GaN衬底的制造方法和单晶GaN衬底
    • US07794543B2
    • 2010-09-14
    • US12068891
    • 2008-02-13
    • Kensaku MotokiRyu HirotaTakuji OkahisaSeiji Nakahata
    • Kensaku MotokiRyu HirotaTakuji OkahisaSeiji Nakahata
    • C30B25/04
    • C30B29/406C30B23/002C30B25/02C30B29/403
    • A low dislocation density GaN single crystal substrate is made by forming a seed mask having parallel stripes regularly and periodically aligning on an undersubstrate, growing a GaN crystal on a facet-growth condition, forming repetitions of parallel facet hills and facet valleys rooted upon the mask stripes, maintaining the facet hills and facet valleys, producing voluminous defect accumulating regions (H) accompanying the valleys, yielding low dislocation single crystal regions (Z) following the facets, making C-plane growth regions (Y) following flat tops between the facets, gathering dislocations on the facets into the valleys by the action of the growing facets, reducing dislocations in the low dislocation single crystal regions (Z) and the C-plane growth regions (Y), and accumulating the dislocations in cores (S) or interfaces (K) of the voluminous defect accumulating regions (H).
    • 低位错密度GaN单晶衬底通过形成具有平行条纹的种子掩模,并且定期地在下衬底上周期性地对准,在面生长条件下生长GaN晶体,形成平行的小平面重叠和基于掩模的小平面谷 条纹,保持小平面山丘和小平面谷,产生伴随谷的大量缺陷积聚区域(H),产生小面后的低位错单晶区域(Z),使平面生长区域(Y)在平面之后 通过生长小面的作用将小面上的面陷入谷中,减少低位错单晶区(Z)和C平面生长区(Y)中的位错,并在芯(S)或 大量缺陷积聚区(H)的界面(K)。
    • 10. 发明申请
    • Method of growing gallium nitride crystal
    • 生长氮化镓晶体的方法
    • US20080006201A1
    • 2008-01-10
    • US11826798
    • 2007-07-18
    • Ryu HirotaKensaku MotokiSeiji NakahataTakuji OkahisaKoji Uematsu
    • Ryu HirotaKensaku MotokiSeiji NakahataTakuji OkahisaKoji Uematsu
    • C30B25/04
    • C30B25/183C30B23/025
    • The facet growth method grows GaN crystals by preparing an undersubstrate, forming a dotmask or a stripemask on the undersubstrate, growing GaN in vapor phase, causing GaN growth on exposed parts, suppressing GaN from growing on masks, inducing facets starting from edges of the masks and rising to tops of GaN crystals on exposed parts, maintaining the facets, making defect accumulating regions H on masked parts. attracting dislocations into the defect accumulating regions H on masks and reducing dislocation density of the surrounding GaN crystals on exposed parts. The defect accumulating regions H on masks have four types. The best of the defect accumulating regions H is an inversion region J. Occurrence of the inversion regions J requires preceding appearance of beaks with inversion orientation on the facets. Sufficient inversion regions J are produced at an initial stage by maintaining the temperature Tj at 900° C. to 990° C. without fail. Allowable inversion regions J beaks are produced at an initial stage by the sets of temperatures T(K) and growing speeds Vj (μm/h) satisfying −4.39×105/T+3.87×102
    • 小面生长方法通过制备下衬底,在下衬底上形成点阵掩模或剥离掩模来生长GaN晶体,在气相中生长GaN,在曝光部分上生长GaN,抑制GaN在掩模上生长,从掩模的边缘开始引起刻面 并在暴露部分上升到GaN晶体的顶部,保持刻面,使掩模部件上的缺陷积聚区域H。 在掩模上吸引缺陷积聚区H的位错,并降低暴露部分周围GaN晶体的位错密度。 掩模上的缺陷积聚区域H具有四种类型。 缺陷累积区域H中的最好的是反转区域J.反转区域J的出现需要在面上具有反转取向的喙前面的出现。 通过将温度Tj保持在900℃至990℃而在初始阶段产生足够的反转区域J. 在初始阶段通过温度T(K)和生长速度Vj(mum / h)的集合产生允许的反转区域J喙,满足-4.39×10 5 / T +3.87×10 2