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1. 发明申请

US20090151688A1 Piston for Internal Combustion Engine and Internal Combustion Engine with the Same 有权
标题翻译：内燃机和内燃机的活塞同样
公开(公告)号：US20090151688A1
公开(公告)日：2009-06-18
申请号：US12226205
申请日：2007-05-21
申请人： Jun Matsui , Kenji Hayama
发明人： Jun Matsui , Kenji Hayama
IPC分类号： F02F3/22
CPC分类号： F02F3/22 , F01P3/06
摘要： A piston (10) for an internal combustion engine including: a piston head (11) located at an uppermost section of the piston; a land (12) located on a circumference of the piston head (11); a skirt (13) located below the land (12); and a pair of pin bosses (14) located on the lower section of the piston head (11). The piston head (11) has a first cavity (24) on the bottom of the piston bead (11). Each of the pair of pin bosses (14) has a second cavity (20) in an outer upper section of the pin boss (14). The pin boss (14) has a through hole (21) that communicably connects the first cavity (24) with the second cavity (20).
摘要翻译：一种用于内燃机的活塞（10），包括：活塞头（11），位于所述活塞的最上部; 位于活塞头（11）的圆周上的平台（12）; 位于土地（12）下方的裙子（13）; 以及位于活塞头（11）的下部上的一对销凸起（14）。活塞头（11）在活塞珠（11）的底部上具有第一空腔（24）。所述一对销凸起（14）中的每一个在所述销凸起（14）的外部上部具有第二腔（20）。销凸台（14）具有通孔（21），其将第一空腔（24）与第二空腔（20）可通信地连接。

2. 发明授权

US07997249B2 Piston for internal combustion engine and internal combustion engine with the same 有权
标题翻译：内燃机和内燃机的活塞同样
公开(公告)号：US07997249B2
公开(公告)日：2011-08-16
申请号：US12226205
申请日：2007-05-21
申请人： Jun Matsui , Kenji Hayama
发明人： Jun Matsui , Kenji Hayama
IPC分类号： F02F3/00
CPC分类号： F02F3/22 , F01P3/06
摘要： A piston for an internal combustion engine including: a piston head located at an uppermost section of the piston; a land located on a circumference of the piston head; a skirt located below the land; and a pair of pin bosses located on the lower section of the piston head. The piston head has a first cavity on the bottom of the piston head. Each of the pair of pin bosses has a second cavity in an outer upper section of the pin boss. The pin boss has a through hole that communicably connects the first cavity with the second cavity.
摘要翻译：一种用于内燃机的活塞，包括：位于所述活塞的最上部的活塞头; 位于活塞头的圆周上的平台; 位于土地下方的裙子; 以及位于活塞头的下部上的一对销凸台。活塞头在活塞头的底部具有第一腔。一对销凸台中的每一个在销凸台的外上部具有第二腔。销凸台具有可将第一腔和第二腔连通的通孔。

3. 发明授权

US08503496B2 Device for judging state of semiconductor laser and method for judging state of semiconductor laser 有权
标题翻译：用于判断半导体激光器的状态的装置以及判断半导体激光器的状态的方法
公开(公告)号：US08503496B2
公开(公告)日：2013-08-06
申请号：US13094968
申请日：2011-04-27
申请人： Jun Matsui
发明人： Jun Matsui
IPC分类号： H01S3/00
CPC分类号： H01S5/0021
摘要： A device includes: a providing unit that provides a driving electric current to a semiconductor laser, the electric current being superimposed a first alternating current signal having a first frequency at a low side of an operational range of the semiconductor laser and a second alternating current signal having a second frequency at a high side of the operational range; a first filter that extracts a first component corresponding to the first frequency from a voltage to be applied to the semiconductor laser; a second filter that extracts a second component corresponding to the second frequency from the voltage to be applied to the semiconductor laser; and a judge circuit that judges a state of the semiconductor laser based on a first differential resistance obtained from the result of the extracting by the first filter and a second differential resistance obtained from the result of the extracting by the second filter.
摘要翻译：一种装置包括：向半导体激光器提供驱动电流的提供单元，电流叠加在半导体激光器的工作范围的低侧具有第一频率的第一交流信号和第二交流信号在操作范围的高侧具有第二频率; 第一滤波器，从施加到半导体激光器的电压中提取对应于第一频率的第一分量; 第二滤波器，从施加到半导体激光器的电压中提取对应于第二频率的第二分量; 以及基于从第一滤波器的提取结果获得的第一差分电阻和由第二滤波器的提取结果获得的第二差分电阻来判断半导体激光器的状态的判断电路。

4. 发明授权

US07943866B2 Housing 有权
标题翻译：住房
公开(公告)号：US07943866B2
公开(公告)日：2011-05-17
申请号：US12396801
申请日：2009-03-03
申请人： Makoto Oya , Jun Matsui
发明人： Makoto Oya , Jun Matsui
IPC分类号： H05K7/02
CPC分类号： H02G11/00
摘要： A housing of the present invention can house an electronic device therein and is provided with a cable housing capable of housing a part of a cable. The cable housing is formed of a depression and a protrusion extending out from a part of a first sidewall of the depression toward a fourth sidewall of the depression along a second sidewall, a third sidewall, and a bottom wall of the depression. At a boundary portion between a housing area and a passing area, a distance between the second sidewall and the third sidewall in the housing area is longer than a distance between the second sidewall and the third sidewall in the passing area.
摘要翻译：本发明的壳体可以在其中容纳电子设备，并且设置有能够容纳电缆的一部分的电缆壳体。电缆壳体由凹部和从凹部的第一侧壁的一部分向凹部的第四侧壁延伸出的突起形成，沿着凹部的第二侧壁，第三侧壁和底壁延伸。在壳体区域和通过区域之间的边界部分处，壳体区域中的第二侧壁和第三侧壁之间的距离比通过区域中的第二侧壁和第三侧壁之间的距离长。

5. 发明申请

US20110042124A1 MULTILAYER WIRING SUBSTRATE HAVING CAVITY PORTION 审中-公开
标题翻译：具有空腔部分的多层接线基板
公开(公告)号：US20110042124A1
公开(公告)日：2011-02-24
申请号：US12745651
申请日：2008-12-03
申请人： Jun Matsui , Shingetsu Yamada
发明人： Jun Matsui , Shingetsu Yamada
IPC分类号： H01B17/00 , H05K1/00 , H05K3/06 , H05K3/00
CPC分类号： H05K1/183 , H01L33/486 , H01L2224/32013 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49107 , H01L2224/73265 , H01L2924/12044 , H05K1/0274 , H05K1/0373 , H05K3/4617 , H05K3/4632 , H05K3/4688 , H05K3/4697 , H05K2201/0129 , H05K2201/0209 , H05K2201/10106 , H05K2201/2054 , H05K2203/063 , H01L2924/00014 , H01L2924/00
摘要： The present invention provides a multilayer wiring substrate comprising: a plurality of wiring substrate laminated each other; and a cavity portion. In the multilayer wiring substrate, a wiring substrate 1 being arranged along the bottom face of the cavity portion and a wiring substrate 2 being arranged at an upper layer side of the wiring substrate 1, the wiring substrate 1 and/or the wiring substrate 2 respectively comprising an insulating base material having a predetermined properties, the wiring substrate 2 being provided with a cavity hole. Thus, it is possible to provide a multilayer wiring substrate having a cavity portion and even a function of reflector.
摘要翻译：本发明提供一种多层布线基板，包括：多个彼此层叠的布线基板; 和空腔部分。在多层布线基板中，布线基板1沿着空腔部的底面配置，布线基板2分别配置在布线基板1，布线基板1和/或布线基板2的上层侧包括具有预定特性的绝缘基材，所述布线基板2设置有空腔孔。因此，可以提供具有空腔部分和甚至反射器功能的多层布线基板。

6. 发明授权

US07583867B2 Optical module 有权
标题翻译：光模块
公开(公告)号：US07583867B2
公开(公告)日：2009-09-01
申请号：US11064454
申请日：2005-02-24
申请人： Koji Terada , Jun Matsui , Hiroyuki Nobuhara
发明人： Koji Terada , Jun Matsui , Hiroyuki Nobuhara
IPC分类号： G02B6/12
CPC分类号： H05K1/189 , G02B6/4201 , G02B6/4249 , G02B6/4256 , G02B6/4281 , G02B6/4283 , H05K1/02 , H05K2201/09063 , H05K2201/10121
摘要： An optical module includes a photoelectric element that performs a conversion between an optical signal and an electric signal; a body having a first surface and a second surface, the first surface and the second surface being continued and adjacent to each other; and an electric circuit board that is mounted on the body, the electric circuit board having a bending portion that is bent along the first surface and the second surface. The photoelectric element is mounted on one portion arranged on the first surface bordering on the bending portion. An electric wiring board on which a wiring unit for an external connection is formed is mounted on other portion arranged on the second surface.
摘要翻译：光学模块包括执行光信号和电信号之间的转换的光电元件; 具有第一表面和第二表面的主体，所述第一表面和所述第二表面相互连续并相邻; 以及安装在所述本体上的电路板，所述电路板具有沿着所述第一表面和所述第二表面弯曲的弯曲部分。光电元件安装在与弯曲部分邻接的第一表面上的一个部分上。形成有用于外部连接的布线单元的电布线板安装在布置在第二表面上的另一部分上。

7. 发明申请

US20080018423A1 Electronic part and circuit substrate 有权
标题翻译：电子部件和电路基板
公开(公告)号：US20080018423A1
公开(公告)日：2008-01-24
申请号：US11898713
申请日：2007-09-14
申请人： Jun Matsui , Koji Terada , Hiroyuki Nobuhara
发明人： Jun Matsui , Koji Terada , Hiroyuki Nobuhara
IPC分类号： H01H67/02
CPC分类号： H05K3/326 , H01R13/2421 , H05K3/3436 , H05K3/4092 , H05K2201/094 , H05K2201/10734
摘要： Electrical connection is established by bringing solder bumps formed as electrical connecting terminals of an electronic part and spiral contactors formed as electrical contactors of a circuit substrate into contact with each other. The solder bumps are formed such that heights thereof relative to a surface on which the solder bumps are formed are different from each other.
摘要翻译：通过将形成为形成为电路基板的电接触器的电连接端子的焊料凸块和形成为电路基板的电接触器的螺旋接触器彼此接触来建立电连接。焊料凸点形成为使得其高度相对于其上形成焊料凸块的表面彼此不同。

8. 发明授权

US07141515B2 Method for manufacturing device 失效
标题翻译：制造装置的方法
公开(公告)号：US07141515B2
公开(公告)日：2006-11-28
申请号：US11017752
申请日：2004-12-22
申请人： Jun Matsui , Hidehiko Nakata
发明人： Jun Matsui , Hidehiko Nakata
IPC分类号： H01L21/31
CPC分类号： G02B6/136 , G02B2006/121
摘要： A method for manufacturing a device where an improvement of etching accuracy and curtailing of manufacturing costs are realized when a device is manufactured attended with etching, such as RIE, in which a device; i.e., an object of etching, evolves heat.The method includes a coating step of applying over the surface of a device a photosensitive resin containing a phenol-based resin as a main ingredient; a transfer step of transferring a desired pattern on a device surface coated with the photosensitive resin by means of exposing the device surface coated with the photosensitive resin to light with the desired pattern; a development step of subjecting to development treatment the device having the pattern transferred thereon; and an etching step of etching the device surface while the pattern of the photosensitive resin developed through the development treatment is taken as a mask pattern.
摘要翻译：一种制造装置的方法，其中在制造装置时实现了蚀刻精度的提高和制造成本的削减，其中诸如RIE的蚀刻，其中装置; 即蚀刻的对象放出热量。该方法包括在装置的表面上施加含有酚醛树脂作为主要成分的感光性树脂的涂布步骤; 转印步骤，通过将所述感光性树脂涂覆的装置表面以所需图案曝光，将涂布有感光性树脂的装置表面转印所需图案; 显影步骤，对其上转印图案的装置进行显影处理; 以及当通过显影处理显影的感光性树脂的图案被作为掩模图案时蚀刻该器件表面的蚀刻步骤。

9. 发明申请

US20060110096A1 Optical module 有权
公开(公告)号：US20060110096A1
公开(公告)日：2006-05-25
申请号：US11064454
申请日：2005-02-24
申请人： Koji Terada , Jun Matsui , Hiroyuki Nobuhara
发明人： Koji Terada , Jun Matsui , Hiroyuki Nobuhara
IPC分类号： G02B6/12
CPC分类号： H05K1/189 , G02B6/4201 , G02B6/4249 , G02B6/4256 , G02B6/4281 , G02B6/4283 , H05K1/02 , H05K2201/09063 , H05K2201/10121
摘要： An optical module includes a photoelectric element that performs a conversion between an optical signal and an electric signal; a body having a first surface and a second surface, the first surface and the second surface being continued and adjacent to each other; and an electric circuit board that is mounted on the body, the electric circuit board having a bending portion that is bent along the first surface and the second surface. The photoelectric element is mounted on one portion arranged on the first surface bordering on the bending portion. An electric wiring board on which a wiring unit for an external connection is formed is mounted on other portion arranged on the second surface.

10. 发明申请

US20120138990A1 METAL SUBSTRATE AND LIGHT SOURCE DEVICE 失效
标题翻译：金属基板和光源设备
公开(公告)号：US20120138990A1
公开(公告)日：2012-06-07
申请号：US13310131
申请日：2011-12-02
申请人： Yoshihito SATO , Nobuhiro Arai , Jun Matsui , Shingetsu Yamada , Shuuji Suzuki
发明人： Yoshihito SATO , Nobuhiro Arai , Jun Matsui , Shingetsu Yamada , Shuuji Suzuki
IPC分类号： H01L33/46
CPC分类号： H01L33/641 , H01L23/142 , H01L33/62 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/01322 , H01L2924/10253 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The invention provides a metal substrate and a light source device ensuring that a semiconductor chip working as a light source can be firmly joined by using a metal joining material, such that heat generated in the mounted semiconductor chip can be efficiently dissipated through a metal plate. The metal substrate includes a heat dissipating metal plate made of a metal except for Au, an insulating resin-made white film stacked on a part of the heat dissipating metal plate, and a light source mounting surface-forming layer stacked on another part of the heat dissipating metal plate. The metal substrate is such that the light source mounting surface-forming layer is a metal layer directly contacting the heat dissipating metal plate, and the light source mounting surface is a surface of an Au layer which is the outermost layer of the light source mounting surface-forming layer.
摘要翻译：本发明提供一种金属基板和光源装置，其确保通过使用金属接合材料可以将作为光源工作的半导体芯片牢固地接合，使得能够通过金属板有效地散发在安装的半导体芯片中产生的热量。金属基板包括由金除外的金属制成的散热金属板，层叠在散热金属板的一部分上的绝缘树脂制白色膜和层叠在该散热金属板的另一部分上的光源安装面形成层散热金属板。金属基板使得光源安装表面形成层是直接接触散热金属板的金属层，光源安装表面是作为光源安装表面的最外层的Au层的表面形成层。

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