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1. 发明授权

US06969672B1 Method and apparatus for controlling a thickness of a conductive layer in a semiconductor manufacturing operation 失效
标题翻译：用于在半导体制造操作中控制导电层的厚度的方法和装置
公开(公告)号：US06969672B1
公开(公告)日：2005-11-29
申请号：US09909074
申请日：2001-07-19
申请人： Joyce S. Obey Hewett , Alexander James Pasadyn
发明人： Joyce S. Obey Hewett , Alexander James Pasadyn
IPC分类号： C25D5/10 , C25D7/12 , C25D21/12 , H01L21/20 , H01L21/288 , H01L21/66
CPC分类号： H01L22/20 , C25D5/10 , C25D7/12 , C25D7/123 , C25D21/12 , H01L21/2885
摘要： A method of controlling a conductive layer deposition process includes depositing a conductive layer onto a semiconductor wafer based upon a deposition recipe, measuring a thickness of the conductive layer deposited on the semiconductor wafer, determining whether the measured thickness of the conductive layer is within a predetermined tolerance, and revising the deposition recipe if the thickness of the conductive layer is not within the predetermined tolerance. An apparatus includes a deposition unit capable of depositing a conductive layer according to a deposition recipe; a thickness measuring unit capable of measuring at least one thickness of the conductive layer and outputting thickness data; and a deposition control unit capable of receiving the thickness data from the thickness measuring unit, determining whether the thickness data is within a predetermined tolerance, revising the deposition recipe if the thickness data is not within the predetermined tolerance, and outputting the revised deposition recipe.
摘要翻译：控制导电层沉积工艺的方法包括：基于沉积配方将导电层沉积到半导体晶片上，测量沉积在半导体晶片上的导电层的厚度，确定所测量的导电层的厚度是否在预定的如果导电层的厚度不在预定的公差范围内，则修改沉积配方。一种装置包括能够根据沉积配方沉积导电层的沉积单元; 厚度测量单元，其能够测量导电层的至少一个厚度并输出厚度数据; 以及沉积控制单元，其能够从厚度测量单元接收厚度数据，确定厚度数据是否在预定公差内，如果厚度数据不在预定公差内，则修改沉积配方，并输出修改的沉积配方。

2. 发明授权

US06988017B2 Adaptive sampling method for improved control in semiconductor manufacturing 有权
标题翻译：用于改进半导体制造控制的自适应采样方法
公开(公告)号：US06988017B2
公开(公告)日：2006-01-17
申请号：US11075401
申请日：2005-03-08
申请人： Alexander James Pasadyn , Anthony John Toprac , Michael Lee Miller
发明人： Alexander James Pasadyn , Anthony John Toprac , Michael Lee Miller
IPC分类号： G06F19/00
CPC分类号： G05B21/02 , G05B11/42 , G05B13/048 , G05B17/02
摘要： A method is provided, the method comprising sampling at least one parameter characteristic of processing performed on a workpiece in at least one processing step, and modeling the at least one characteristic parameter sampled using an adaptive sampling processing model, treating sampling as an integrated part of a dynamic control environment, varying the sampling based upon at least one of situational information, upstream events and requirements of run-to-run controllers. The method also comprises applying the adaptive sampling processing model to modify the processing performed in the at least one processing step.
摘要翻译：提供了一种方法，所述方法包括在至少一个处理步骤中对在工件上执行的处理的至少一个参数特性进行采样，以及使用自适应采样处理模型对采样的至少一个特征参数进行建模，将采样作为动态控制环境，基于情境信息，上游事件和运行控制器的要求中的至少一个来改变采样。该方法还包括应用自适应采样处理模型来修改在至少一个处理步骤中执行的处理。

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