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    • 1. 发明授权
    • Three-dimensional macro-chip including optical interconnects
    • 三维宏片包括光互连
    • US08267583B2
    • 2012-09-18
    • US12581709
    • 2009-10-19
    • Jin YaoXuezhe ZhengAshok V. KrishnamoorthyJohn E. Cunningham
    • Jin YaoXuezhe ZhengAshok V. KrishnamoorthyJohn E. Cunningham
    • G02B6/26G02B6/34G02B6/12
    • G02B6/13G02B6/12002
    • A multi-chip module (MCM), which includes a three-dimensional (3D) stack of chips that are coupled using optical interconnects, is described. In this MCM, disposed on a first surface of a middle chip in the 3D stack, there are: a first optical coupler, an optical waveguide, which is coupled to the first optical coupler, and a second optical coupler, which is coupled to the optical waveguide. The first optical coupler redirects an optical signal from the optical waveguide to a first direction (which is not in the plane of the first surface), or from the first direction to the optical waveguide. Moreover, the second optical coupler redirects the optical signal from the optical waveguide to a second direction (which is not in the plane of the first surface), or from the second direction to the optical waveguide. Note that an optical path associated with the second direction passes through an opening in a substrate in the middle chip.
    • 描述了包括使用光学互连耦合的三维(3D)芯片堆叠的多芯片模块(MCM)。 在该MCM中,设置在3D堆叠中的中间芯片的第一表面上,存在:耦合到第一光耦合器的第一光耦合器,光波导和耦合到第三光耦合器的第二光耦合器, 光波导。 第一光学耦合器将来自光波导的光信号重定向到第一方向(其不在第一表面的平面中)或从第一方向到光波导。 此外,第二光学耦合器将来自光波导的光信号重定向到第二方向(其不在第一表面的平面)或从第二方向到光波导。 注意,与第二方向相关联的光路通过中间芯片中的衬底中的开口。
    • 2. 发明申请
    • THREE-DIMENSIONAL MACRO-CHIP INCLUDING OPTICAL INTERCONNECTS
    • 三维宏块包括光学互连
    • US20110091157A1
    • 2011-04-21
    • US12581709
    • 2009-10-19
    • Jin YaoXuezhe ZhengAshok V. KrishnamoorthyJohn E. Cunningham
    • Jin YaoXuezhe ZhengAshok V. KrishnamoorthyJohn E. Cunningham
    • G02B6/26
    • G02B6/13G02B6/12002
    • A multi-chip module (MCM), which includes a three-dimensional (3D) stack of chips that are coupled using optical interconnects, is described. In this MCM, disposed on a first surface of a middle chip in the 3D stack, there are: a first optical coupler, an optical waveguide, which is coupled to the first optical coupler, and a second optical coupler, which is coupled to the optical waveguide. The first optical coupler redirects an optical signal from the optical waveguide to a first direction (which is not in the plane of the first surface), or from the first direction to the optical waveguide. Moreover, the second optical coupler redirects the optical signal from the optical waveguide to a second direction (which is not in the plane of the first surface), or from the second direction to the optical waveguide. Note that an optical path associated with the second direction passes through an opening in a substrate in the middle chip.
    • 描述了包括使用光学互连耦合的三维(3D)芯片堆叠的多芯片模块(MCM)。 在该MCM中,设置在3D堆叠中的中间芯片的第一表面上,存在:耦合到第一光耦合器的第一光耦合器,光波导和耦合到第三光耦合器的第二光耦合器, 光波导。 第一光学耦合器将来自光波导的光信号重定向到第一方向(其不在第一表面的平面中)或从第一方向到光波导。 此外,第二光耦合器将来自光波导的光信号重定向到第二方向(其不在第一表面的平面)或从第二方向到光波导。 注意,与第二方向相关联的光路通过中间芯片中的衬底中的开口。
    • 3. 发明授权
    • Three-dimensional macro-chip including optical interconnects
    • 三维宏片包括光互连
    • US08768123B2
    • 2014-07-01
    • US13566598
    • 2012-08-03
    • Jin YaoXuezhe ZhengAshok V. KrishnamoorthyJohn E. Cunningham
    • Jin YaoXuezhe ZhengAshok V. KrishnamoorthyJohn E. Cunningham
    • G02B6/02
    • G02B6/13G02B6/12002
    • A multi-chip module (MCM) includes a stack of chips that are coupled using optical interconnects. On a first surface of a middle chip in the stack, there are: a first optical coupler, an optical waveguide, which is coupled to the first optical coupler, and a second optical coupler, which is coupled to the optical waveguide. The first optical coupler redirects an optical signal from the optical waveguide to a first direction (which is not in the plane of the first surface), or from the first direction to the optical waveguide. The second optical coupler redirects the optical signal from the optical waveguide to a second direction (which is not in the plane of the first surface), or from the second direction to the optical waveguide. An optical path associated with the second direction passes through an opening in a substrate in the middle chip.
    • 多芯片模块(MCM)包括使用光学互连耦合的一堆芯片。 在堆叠中的中间芯片的第一表面上,存在:耦合到第一光耦合器的第一光耦合器,光波导和耦合到光波导的第二光耦合器。 第一光学耦合器将来自光波导的光信号重定向到第一方向(其不在第一表面的平面中)或从第一方向到光波导。 第二光耦合器将来自光波导的光信号重定向到第二方向(其不在第一表面的平面中)或从第二方向到光波导。 与第二方向相关联的光路通过中间芯片中的基板的开口。
    • 4. 发明申请
    • THREE-DIMENSIONAL MACRO-CHIP INCLUDING OPTICAL INTERCONNECTS
    • 三维宏块包括光学互连
    • US20120321251A1
    • 2012-12-20
    • US13566598
    • 2012-08-03
    • Jin YaoXuezhe ZhengAshok V. KrishnamoorthyJohn E. Cunningham
    • Jin YaoXuezhe ZhengAshok V. KrishnamoorthyJohn E. Cunningham
    • G02B6/26
    • G02B6/13G02B6/12002
    • A multi-chip module (MCM) includes a stack of chips that are coupled using optical interconnects. On a first surface of a middle chip in the stack, there are: a first optical coupler, an optical waveguide, which is coupled to the first optical coupler, and a second optical coupler, which is coupled to the optical waveguide. The first optical coupler redirects an optical signal from the optical waveguide to a first direction (which is not in the plane of the first surface), or from the first direction to the optical waveguide. The second optical coupler redirects the optical signal from the optical waveguide to a second direction (which is not in the plane of the first surface), or from the second direction to the optical waveguide. An optical path associated with the second direction passes through an opening in a substrate in the middle chip.
    • 多芯片模块(MCM)包括使用光学互连耦合的一堆芯片。 在堆叠中的中间芯片的第一表面上,存在:耦合到第一光耦合器的第一光耦合器,光波导和耦合到光波导的第二光耦合器。 第一光学耦合器将来自光波导的光信号重定向到第一方向(其不在第一表面的平面中)或从第一方向到光波导。 第二光耦合器将来自光波导的光信号重定向到第二方向(其不在第一表面的平面中)或从第二方向到光波导。 与第二方向相关联的光路通过中间芯片中的基板的开口。
    • 6. 发明授权
    • Macro-chip including a surface-normal device
    • 宏芯片包括表面正常的设备
    • US08121446B2
    • 2012-02-21
    • US12566101
    • 2009-09-24
    • Xuezhe ZhengAshok V. KrishnamoorthyJohn E. Cunningham
    • Xuezhe ZhengAshok V. KrishnamoorthyJohn E. Cunningham
    • G02B6/12G02B6/26G02B6/36
    • G02B6/4214G02B6/4201G02B6/43
    • A multi-chip module (MCM) is described. This MCM includes two substrates having facing surfaces. Disposed on a surface of a first of these substrates, there is an optical waveguide, having an eigenmode in the plane of the surface, and an optical coupler, which redirects optical signals to and/or from the optical waveguide and a direction normal to the surface. Furthermore, disposed on a surface of a second of the substrates, which faces the surface of the first substrate, and which overlaps the optical coupler, there is an optoelectronic device. This optoelectronic device, which has an eigenmode in a direction perpendicular to the surface of the second substrate, selectively receives or provides the optical signal to and/or from the optical coupler. For example, the selective receiving or providing may be controlled by selectively applying a potential to the quantum-well device, thereby changing the optical properties of the optoelectronic device.
    • 描述了多芯片模块(MCM)。 该MCM包括具有相对表面的两个基板。 设置在这些基板中的第一个基板的表面上,存在在表面的平面中具有本征模的光波导和光耦合器,其将光信号重定向到和/或从光波导和垂直于 表面。 此外,设置在面对第一基板的表面并且与光耦合器重叠的第二基板的表面上,存在光电子器件。 该光电子器件在垂直于第二衬底的表面的方向上具有本征模式,选择性地接收或向光耦合器提供光信号。 例如,可以通过选择性地向量子阱器件施加电势来控制选择性接收或提供,从而改变光电器件的光学特性。