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    • 1. 发明授权
    • Process for operating an electronic device including a memory array and conductive lines
    • 用于操作包括存储器阵列和导线的电子设备的工艺
    • US07262997B2
    • 2007-08-28
    • US11188898
    • 2005-07-25
    • Jane A. YaterGowrishankar L. ChindaloreCheong M. Hong
    • Jane A. YaterGowrishankar L. ChindaloreCheong M. Hong
    • G11C16/04G11C11/34
    • G11C16/10
    • An electronic circuit can include a first memory cell and a second memory cell. In one embodiment, source/drain regions of the first and second memory cells can be electrically connected to each other. The source/drain regions may electrically float regardless of direction in which carriers flow through channel regions of the memory cells. In another embodiment, the first memory cell can be electrically connected to a first gate line, and the second memory cell can be electrically connected to a greater number of gate lines as compared to the first memory cell. In another aspect, the first and second memory cells are connected to the same bit line. Such bit line can electrically float when programming or reading the first memory cell or the second memory cell or any combination thereof.
    • 电子电路可以包括第一存储单元和第二存储单元。 在一个实施例中,第一和第二存储器单元的源极/漏极区域可彼此电连接。 源极/漏极区域可以电浮动,而不管载流子流过存储器单元的沟道区域的方向如何。 在另一个实施例中,与第一存储器单元相比,第一存储单元可以电连接到第一栅极线,并且第二存储单元可以电连接到更多数量的栅极线。 在另一方面,第一和第二存储器单元连接到相同的位线。 当编程或读取第一存储器单元或第二存储单元或其任何组合时,这种位线可以电浮动。
    • 2. 发明授权
    • Electronic device including a memory array and conductive lines
    • 电子设备包括存储器阵列和导线
    • US07471560B2
    • 2008-12-30
    • US11834391
    • 2007-08-06
    • Jane A. YaterGowrishankar L. ChindaloreCheong M. Hong
    • Jane A. YaterGowrishankar L. ChindaloreCheong M. Hong
    • G11C11/34
    • G11C16/10
    • An electronic circuit can include a first memory cell and a second memory cell. In one embodiment, source/drain regions of the first and second memory cells can be electrically connected to each other. The source/drain regions may electrically float regardless of direction in which carriers flow through channel regions of the memory cells. In another embodiment, the first memory cell can be electrically connected to a first gate line, and the second memory cell can be electrically connected to a greater number of gate lines as compared to the first memory cell. In another aspect, the first and second memory cells are connected to the same bit line. Such bit line can electrically float when programming or reading the first memory cell or the second memory cell or any combination thereof.
    • 电子电路可以包括第一存储单元和第二存储单元。 在一个实施例中,第一和第二存储器单元的源极/漏极区域可彼此电连接。 源极/漏极区域可以电浮动,而不管载流子流过存储器单元的沟道区域的方向如何。 在另一个实施例中,与第一存储器单元相比,第一存储单元可以电连接到第一栅极线,并且第二存储单元可以电连接到更多数量的栅极线。 在另一方面,第一和第二存储器单元连接到相同的位线。 当编程或读取第一存储器单元或第二存储单元或其任何组合时,这种位线可以电浮动。
    • 5. 发明授权
    • Non-volatile memory having a reference transistor
    • 具有参考晶体管的非易失性存储器
    • US06969883B2
    • 2005-11-29
    • US10950855
    • 2004-09-27
    • Gowrishankar L. ChindaloreRajesh A. RaoJane A. Yater
    • Gowrishankar L. ChindaloreRajesh A. RaoJane A. Yater
    • G11C5/00G11C16/28H01L21/28H01L21/336H01L21/8242H01L21/8246H01L27/105H01L29/76
    • H01L27/11568B82Y10/00G11C16/28H01L21/28273H01L21/28282H01L27/105H01L27/11573
    • A non-volatile memory (30) comprises nanocrystal memory cells (50, 51, 53). The program and erase threshold voltage of the memory cell transistors (50, 51, 53) increase as a function of the number of program/erase operations. During a read operation, a reference transistor (46) provides a reference current for comparing with a cell current. The reference transistor (46) is made from a process similar to that used to make the memory cell transistors (50, 51, 53), except that the reference transistor (46) does not include nanocrystals. By using a similar process to make both the reference transistor (46) and the memory cell transistors (50, 51, 53), a threshold voltage of the reference transistor (46) will track the threshold voltage shift of the memory cell transistor (50, 51, 53). A read control circuit (42) is provided to bias the gate of the reference transistor (46). The read control circuit (42) senses a drain current of the reference transistor (46) and adjusts the gate bias voltage to maintain the reference current at a substantially constant value relative to the cell current.
    • 非易失性存储器(30)包括纳米晶体存储单元(50,51,53)。 存储单元晶体管(50,51,53)的编程和擦除阈值电压作为编程/擦除操作的次数增加。 在读取操作期间,参考晶体管(46)提供用于与单元电流进行比较的参考电流。 除了参考晶体管(46)不包括纳米晶体之外,参考晶体管(46)由与制造存储单元晶体管(50,51,53)类似的工艺制成。 通过使用类似的工艺来使参考晶体管(46)和存储单元晶体管(50,51,53)同时工作,参考晶体管(46)的阈值电压将跟踪存储单元晶体管(50)的阈值电压偏移 ,51,53)。 提供读控制电路(42)以偏置参考晶体管(46)的栅极。 读取控制电路(42)感测参考晶体管(46)的漏极电流并调整栅极偏置电压,以使参考电流相对于单元电流保持在基本恒定的值。
    • 6. 发明授权
    • Method for forming a multi-bit non-volatile memory device
    • 用于形成多位非易失性存储器件的方法
    • US07064030B2
    • 2006-06-20
    • US10961014
    • 2004-10-08
    • Gowrishankar L. ChindaloreJane A. Yater
    • Gowrishankar L. ChindaloreJane A. Yater
    • H01L21/336
    • H01L27/115H01L27/11521
    • Forming a non-volatile memory device includes providing a semiconductor substrate, forming a masking layer having a first plurality of openings overlying the semiconductor substrate, forming diffusion regions in the semiconductor substrate at locations determined by the masking layer, forming a dielectric within the first plurality of openings, removing the masking layer to form a second plurality of openings, forming sacrificial spacers along edges of the second plurality of openings and adjacent to the dielectric, forming a separating dielectric to separate the sacrificial spacers within each of the second plurality of openings, forming a sacrificial protection layer overlying the separating dielectric, removing the sacrificial spacers, removing the sacrificial protection layer, forming at least two memory storage regions within each of the second plurality of openings, and forming a common control electrode overlying the at least two memory storage regions. This device may be used, for example, in a VGA memory array.
    • 形成非易失性存储器件包括提供半导体衬底,形成具有覆盖半导体衬底的第一多个开口的掩模层,在由掩模层确定的位置处在半导体衬底中形成扩散区,在第一多个 的开口,去除所述掩模层以形成第二多个开口,沿着所述第二多个开口的边缘并且邻近所述电介质形成牺牲隔离物,形成分离电介质以在所述第二多个开口的每一个内分离所述牺牲隔离物, 形成覆盖所述分离电介质的牺牲保护层,去除所述牺牲隔离物,去除所述牺牲保护层,在所述第二多个开口的每一个内形成至少两个存储器存储区域,以及形成覆盖所述至少两个存储器存储器 地区。 该装置可以用于例如VGA存储器阵列中。
    • 8. 发明授权
    • Non-volatile memory having a reference transistor and method for forming
    • 具有参考晶体管的非易失性存储器及其形成方法
    • US06955967B2
    • 2005-10-18
    • US10609361
    • 2003-06-27
    • Gowrishankar L. ChindaloreRajesh A. RaoJane A. Yater
    • Gowrishankar L. ChindaloreRajesh A. RaoJane A. Yater
    • G11C5/00G11C16/28H01L21/28H01L21/336H01L21/8242H01L21/8246H01L27/105H01L29/76
    • H01L27/11568B82Y10/00G11C16/28H01L21/28273H01L21/28282H01L27/105H01L27/11573
    • A non-volatile memory (30) comprises nanocrystal memory cells (50, 51, 53). The program and erase threshold voltage of the memory cell transistors (50, 51, 53) increase as a function of the number of program/erase operations. During a read operation, a reference transistor (46) provides a reference current for comparing with a cell current. The reference transistor (46) is made from a process similar to that used to make the memory cell transistors (50, 51, 53), except that the reference transistor (46) does not include nanocrystals. By using a similar process to make both the reference transistor (46) and the memory cell transistors (50, 51, 53), a threshold voltage of the reference transistor (46) will track the threshold voltage shift of the memory cell transistor (50, 51, 53). A read control circuit (42) is provided to bias the gate of the reference transistor (46). The read control circuit (42) senses a drain current of the reference transistor (46) and adjusts the gate bias voltage to maintain the reference current at a substantially constant value relative to the cell current.
    • 非易失性存储器(30)包括纳米晶体存储单元(50,51,53)。 存储单元晶体管(50,51,53)的编程和擦除阈值电压作为编程/擦除操作的次数增加。 在读取操作期间,参考晶体管(46)提供用于与单元电流进行比较的参考电流。 除了参考晶体管(46)不包括纳米晶体之外,参考晶体管(46)由与制造存储单元晶体管(50,51,53)类似的工艺制成。 通过使用类似的工艺来使参考晶体管(46)和存储单元晶体管(50,51,53)同时工作,参考晶体管(46)的阈值电压将跟踪存储单元晶体管(50)的阈值电压偏移 ,51,53)。 提供读控制电路(42)以偏置参考晶体管(46)的栅极。 读取控制电路(42)感测参考晶体管(46)的漏极电流并调整栅极偏置电压,以使参考电流相对于单元电流保持在基本恒定的值。
    • 9. 发明授权
    • Variable gate bias for a reference transistor in a non-volatile memory
    • 非易失性存储器中的参考晶体管的可变栅极偏置
    • US06839280B1
    • 2005-01-04
    • US10609359
    • 2003-06-27
    • Gowrishankar L. ChindaloreRajesh A. RaoJane A. Yater
    • Gowrishankar L. ChindaloreRajesh A. RaoJane A. Yater
    • G11C20060101G11C11/34G11C16/00G11C16/06G11C16/28H01L21/28H01L21/8247
    • B82Y10/00G11C16/28G11C2216/06H01L21/28273H01L27/11531
    • A non-volatile memory (30) comprises nanocrystal memory cells (50, 51, 53). The program and erase threshold voltage of the memory cell transistors (50, 51, 53) increase as a function of the number of program/erase operations. During a read operation, a reference transistor (46) provides a reference current for comparing with a cell current. The reference transistor (46) is made from a process similar to that used to make the memory cell transistors (50, 51, 53), except that the reference transistor (46) does not include nanocrystals. By using a similar process to make both the reference transistor (46) and the memory cell transistors (50, 51, 53), a threshold voltage of the reference transistor (46) will track the threshold voltage shift of the memory cell transistor (50, 51, 53). A read control circuit (42) is provided to bias the gate of the reference transistor (46). The read control circuit (42) senses a drain current of the reference transistor (46) and adjusts the gate bias voltage to maintain the reference current at a substantially constant value relative to the cell current.
    • 非易失性存储器(30)包括纳米晶体存储单元(50,51,53)。 存储单元晶体管(50,51,53)的编程和擦除阈值电压作为编程/擦除操作的次数增加。 在读取操作期间,参考晶体管(46)提供用于与单元电流进行比较的参考电流。 除了参考晶体管(46)不包括纳米晶体之外,参考晶体管(46)由与制造存储单元晶体管(50,51,53)类似的工艺制成。 通过使用类似的工艺来使参考晶体管(46)和存储单元晶体管(50,51,53)同时工作,参考晶体管(46)的阈值电压将跟踪存储单元晶体管(50)的阈值电压偏移 ,51,53)。 提供读控制电路(42)以偏置参考晶体管(46)的栅极。 读取控制电路(42)感测参考晶体管(46)的漏极电流并调整栅极偏置电压,以使参考电流相对于单元电流保持在基本恒定的值。