会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 8. 发明授权
    • NAND flash memory device and method of operating same to reduce a difference between channel potentials therein
    • NAND闪存器件及其操作方法以减少其中的沟道电位之间的差异
    • US08456918B2
    • 2013-06-04
    • US12405826
    • 2009-03-17
    • Dong-Yean OhWoon-Kyung LeeJai Hyuk SongChang-Sub Lee
    • Dong-Yean OhWoon-Kyung LeeJai Hyuk SongChang-Sub Lee
    • G11C11/34G11C16/06
    • G11C16/0483G11C16/10
    • An flash memory device includes a block of NAND cell units, each NAND cell unit in the block includes n memory cell transistors MC controlled by a plurality of n wordlines, and is connected in series between a string selection transistor SST connected to a bitline and a ground selection transistor GST. While a programming voltage Vpgm is applied to a selected wordline WL , a cutoff voltage Vss is applied to a nearby unselected wordline closer to the ground selection transistor GST to isolate a first local channel Ch1 from a second local channel Ch2. As the location i of the selected wordline WL increases close to the SST, the second channel potential Vch2 tends to increase excessively, causing errors. The excessive increase of Vch2 is prevented by modifying the voltages applied to string select lines (SSL) and/or to the bit lines (BL), or the pass voltages Vpass applied to the unselected wordlines (WL location i is equal or greater than a predetermined (stored) location number x. If incremental step pulse programming (ISPP) is implemented, the applied voltages are modified only if the ISPP loop count j is equal or greater than a predetermined (stored) critical loop number y.
    • 闪速存储器件包括一块NAND单元单元,该块中的每个NAND单元单元包括由多个n个字线控制的n个存储单元晶体管MC,并串联连接在连接到位线的串选择晶体管SST和 接地选择晶体管GST。 当编程电压Vpgm被施加到所选字线WL时,截止电压Vss被施加到靠近接地选择晶体管GST的附近未选字线,以将第一本地信道Ch1与第二本地信道Ch2隔离。 当所选择的字线WL i的位置i增加到接近于SST时,第二通道电位Vch2会过度增加,导致错误。 通过修改施加到串选择线(SSL)和/或位线(BL)的电压或施加到未选择字线(WL ),只有当所选择的字线WL i位置i等于或大于预定(存储的)位置号码x时。 如果实现增量步进脉冲编程(ISPP),只有当ISPP循环计数j等于或大于预定(存储)的关键循环数y时,才施加电压。
    • 9. 发明授权
    • Nonvolatile memory device and fabrication method
    • 非易失存储器件及其制造方法
    • US07851304B2
    • 2010-12-14
    • US11641869
    • 2006-12-20
    • Woon-Kyung LeeJeong-Hyuk Choi
    • Woon-Kyung LeeJeong-Hyuk Choi
    • H01L29/76
    • H01L27/115H01L27/11521H01L27/11524Y10S438/981
    • Provided is a nonvolatile memory device and a fabrication method. The nonvolatile memory device includes an active region defined in a semiconductor substrate, a gate insulating layer formed on the active region and a plurality of gate patterns formed on the gate insulating layer, and crossing over the active region. The gate insulating layer includes a discharge region in a predetermined portion between the gate patterns, the discharge region having a lesser thickness than that of the gate insulating layer under the gate pattern, because a thickness portion of the gate insulating layer is removed to form the discharge region.
    • 提供了一种非易失性存储器件和制造方法。 非易失性存储器件包括限定在半导体衬底中的有源区,形成在有源区上的栅极绝缘层和形成在栅极绝缘层上并跨过有源区的多个栅极图案。 栅极绝缘层包括在栅极图案之间的预定部分中的放电区域,由于栅极绝缘层的厚度部分被去除以形成栅极绝缘层的厚度部分,所以放电区域的厚度小于栅极图案下的栅极绝缘层的厚度。 放电区域。