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    • 3. 发明授权
    • Programmable integrated circuit with thin-oxide passgates
    • 可编程集成电路与薄氧化物通风门
    • US08633731B1
    • 2014-01-21
    • US13206401
    • 2011-08-09
    • Irfan RahimMao DuJeffrey Xiaoqi TungJun LiuQi Xiang
    • Irfan RahimMao DuJeffrey Xiaoqi TungJun LiuQi Xiang
    • G06F7/38
    • H03K19/1733G11C8/16G11C11/419
    • Integrated circuits such as programmable integrated circuits may have configuration random-access memory elements. The configuration random-access memory elements may be loaded with configuration data to customize programmable circuitry on the integrated circuits. Each memory element may have a bistable element that is powered using a positive power supply voltage and a negative power supply voltage. Programmable transistors in the programmable circuitry may have gates coupled to outputs of the bistable elements. The programmable transistors may have gate insulators that are thinner than gate insulators in the transistors of the bistable elements and may have threshold voltages of about zero volts. During operation, some of the configuration random-access memory elements may supply negative voltages to their associated programmable transistors so that the programmable transistors are provided with gate-source voltages of less than zero volts.
    • 诸如可编程集成电路的集成电路可以具有配置随机存取存储器元件。 配置随机存取存储器元件可以被加载配置数据以定制集成电路上的可编程电路。 每个存储元件可以具有使用正电源电压和负电源电压供电的双稳态元件。 可编程电路中的可编程晶体管可以具有耦合到双稳态元件的输出的栅极。 可编程晶体管可以具有比双稳态元件的晶体管中的栅极绝缘体更薄的栅极绝缘体,并且可以具有约零伏特的阈值电压。 在操作期间,一些配置随机存取存储器元件可以向其相关联的可编程晶体管提供负电压,使得可编程晶体管具有小于零伏的栅极 - 源极电压。
    • 4. 发明授权
    • Mixed-gate metal-oxide-semiconductor varactors
    • 混合栅极金属氧化物半导体变容二极管
    • US08242581B1
    • 2012-08-14
    • US12324793
    • 2008-11-26
    • Albert RatnakumarWilson WongJun LiuQi XiangJeffrey Xiaoqi Tung
    • Albert RatnakumarWilson WongJun LiuQi XiangJeffrey Xiaoqi Tung
    • H01L29/93
    • H01L29/94H01L29/4983H01L29/93
    • Mixed gate varactors are provided. The mixed gate varactors may include a semiconductor region of a given doping type. A first terminal for the varactor may be formed from a gate structure on the semiconductor region. A second terminal for the varactor may be formed from a heavily doped region in the semiconductor region that has the same doping type as the given doping type. A third terminal for the varactor may be formed from a heavily doped region in the semiconductor region that has a different doping type than the given doping type. The gate structure may include multiple gate conductors on a gate insulator. The gate insulator may be a high-K dielectric. The gate conductors may be metals or other materials that have different work functions. A conductive layer such as a layer of polysilicon may electrically connect the first and second gate conductors.
    • 提供混合栅极变容二极管。 混合栅极变容二极管可以包括给定掺杂型的半导体区域。 用于变容二极管的第一端可以由半导体区域上的栅极结构形成。 用于变容二极管的第二端子可以由具有与给定掺杂类型相同的掺杂类型的半导体区域中的重掺杂区域形成。 用于变容二极管的第三端子可以由具有与给定掺杂类型不同的掺杂类型的半导体区域中的重掺杂区域形成。 栅极结构可以包括栅极绝缘体上的多个栅极导体。 栅极绝缘体可以是高K电介质。 栅极导体可以是具有不同功函数的金属或其它材料。 诸如多晶硅层的导电层可电连接第一和第二栅极导体。
    • 6. 发明授权
    • Stressed transistors with reduced leakage
    • 压力降低的晶体管泄漏
    • US08138791B1
    • 2012-03-20
    • US12694603
    • 2010-01-27
    • Albert RatnakumarJun LiuJeffrey Xiaoqi TungQi Xiang
    • Albert RatnakumarJun LiuJeffrey Xiaoqi TungQi Xiang
    • H03K19/177
    • H03K19/0008H01L27/11807H01L29/78H01L29/7843H01L29/7847H01L29/7848
    • Integrated circuits with stressed transistors are provided. Stressing transistors may increase transistor threshold voltage without the need to increase channel doping. Stressing transistors may reduce total leakage currents. It may be desirable to compressively stress N-channel metal-oxide-semiconductor (NMOS) transistors and tensilely stress P-channel metal-oxide-semiconductor (PMOS) transistors to reduce leakage currents. Techniques that can be used to alter the amount of stressed experienced by transistors may include forming a stress-inducing layer, forming a stress liner, forming diffusion active regions using silicon germanium, silicon carbon, or standard silicon, implementing transistors in single-finger instead of multi-finger configurations, and implanting particles. Any combination of these techniques may be used to provide appropriate amounts of stress to increase the performance or decrease the total leakage current of a transistor.
    • 提供了具有应力晶体管的集成电路。 应力晶体管可以增加晶体管阈值电压,而不需要增加沟道掺杂。 应力晶体管可能会减少总漏电流。 可能需要压缩应力N沟道金属氧化物半导体(NMOS)晶体管和拉伸应力P沟道金属氧化物半导体(PMOS)晶体管以减少漏电流。 可用于改变晶体管经受的应力的技术可包括形成应力诱导层,形成应力衬垫,使用硅锗,硅碳或标准硅形成扩散有源区,以单指代替晶体管 的多指配置和植入颗粒。 可以使用这些技术的任何组合来提供适当量的应力以增加晶体管的性能或降低总泄漏电流。
    • 7. 发明申请
    • ASYMMETRIC METAL-OXIDE-SEMICONDUCTOR TRANSISTORS
    • 不对称金属氧化物半导体晶体管
    • US20100127331A1
    • 2010-05-27
    • US12324789
    • 2008-11-26
    • Albert RatnakumarJun LiuJeffrey Xiaoqi TungQi Xiang
    • Albert RatnakumarJun LiuJeffrey Xiaoqi TungQi Xiang
    • H01L29/78G06F17/50
    • G06F17/5063H01L29/4983H01L29/66545H01L29/78
    • Mixed gate metal-oxide-semiconductor transistors are provided. The transistors may have an asymmetric configuration that exhibits increased output resistance. Each transistor may be formed from a gate insulating layer formed on a semiconductor. The gate insulating layer may be a high-K material. Source and drain regions in the semiconductor may define a transistor gate length. The gate length may be larger than the minimum specified by semiconductor fabrication design rules. The transistor gate may be formed from first and second gate conductors with different work functions. The relative sizes of the first and gate conductors in a given transistor control the threshold voltage for the transistor. A computer-aided design tool may be used to receive a circuit design from a user. The tool may generate fabrication masks for the given design that include mixed gate transistors with threshold voltages optimized to meet circuit design criteria.
    • 提供混合栅极金属氧化物半导体晶体管。 晶体管可以具有表现出增加的输出电阻的非对称配置。 每个晶体管可以由形成在半导体上的栅极绝缘层形成。 栅极绝缘层可以是高K材料。 半导体中的源极和漏极区域可以限定晶体管栅极长度。 栅极长度可以大于由半导体制造设计规则规定的最小值。 晶体管栅极可以由具有不同功函数的第一和第二栅极导体形成。 给定晶体管中的第一和栅极导体的相对尺寸控制晶体管的阈值电压。 计算机辅助设计工具可用于从用户接收电路设计。 该工具可以为给定的设计生成包括混合栅极晶体管的制造掩模,其具有优化的阈值电压以满足电路设计标准。
    • 10. 发明授权
    • Integrated circuits with asymmetric pass transistors
    • 具有不对称传输晶体管的集成电路
    • US08921170B1
    • 2014-12-30
    • US13408959
    • 2012-02-29
    • Jun LiuAlbert RatnakumarMark T. ChanIrfan Rahim
    • Jun LiuAlbert RatnakumarMark T. ChanIrfan Rahim
    • H01L21/338
    • H01L21/823418H01L21/324H01L21/823814H01L27/082H01L27/088H01L29/1083H01L29/6653H01L29/66659
    • Asymmetric transistors such as asymmetric pass transistors may be formed on an integrated circuit. The asymmetric transistors may have gate structures. Symmetric pocket implants may be formed in source-drains on opposing sides of each transistor gate structure. Selective heating may be used to asymmetrically diffuse the implants. Selective heating may be implemented by patterning the gate structures on a semiconductor substrate so that the spacing between adjacent gate structures varies. A given gate structure may be located between first and second adjacent gate structures spaced at different respective distances from the given gate structure. A larger gate structure spacing leads to a greater substrate temperature rise than a smaller gate structure spacing. The pocket implant diffuses more in portions of the substrate with the greater temperature rise, producing asymmetric transistors. Asymmetric pass transistors may be controlled by static control signals from memory elements to implement circuits such as programmable multiplexers.
    • 不对称晶体管,例如不对称传输晶体管可以形成在集成电路上。 不对称晶体管可以具有栅极结构。 可以在每个晶体管栅极结构的相对侧上的源极漏极中形成对称的袋状植入物。 选择性加热可用于不对称地扩散植入物。 可以通过在半导体衬底上图案化栅极结构来实现选择性加热,使得相邻栅极结构之间的间隔变化。 给定的栅极结构可以位于与给定栅极结构不同的相应距离处间隔开的第一和第二相邻栅极结构之间。 较大的栅极结构间隔导致比较小栅极结构间隔更大的衬底温度升高。 在较大的温度上升的情况下,口袋植入物在衬底的部分扩散,产生不对称晶体管。 不对称传输晶体管可以由来自存储器元件的静态控制信号来控制,以实现诸如可编程多路复用器之类的电路。