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1. 发明申请

US20060252177A1 Semiconductor package with selective underfill and fabrication method therfor 有权
标题翻译：具有选择性底部填充的半导体封装及其制造方法
公开(公告)号：US20060252177A1
公开(公告)日：2006-11-09
申请号：US11121847
申请日：2005-05-03
申请人： Il Shim , Sheila Alvarez , Romeo Alvarez
发明人： Il Shim , Sheila Alvarez , Romeo Alvarez
IPC分类号： H01L21/00
CPC分类号： H01L21/67092 , H01L2224/16245
摘要： A method of manufacturing a semiconductor package includes providing a substrate having a plurality of contacts with solder bump contact areas that are unmasked. A plurality of underfill bumps is formed on the plurality of contacts selectively in the solder bump contact areas. A die having a plurality of solder bumps is positioned on the substrate so the plurality of solder bumps is substantially vertically aligned with the plurality of underfill bumps. The plurality of solder bumps is pressed into the plurality of underfill bumps until the plurality of solder bumps contacts the plurality of contacts. The plurality of solder bumps is reflowed. The die, the plurality of solder bumps, and the plurality of contacts are encapsulated to expose a lower surface of the plurality of contacts.
摘要翻译：制造半导体封装的方法包括提供具有多个触点的衬底，该触点具有未被掩模的焊料凸块接触区域。多个底部填充凸块在焊料凸块接触区域中选择性地形成在多个触点上。具有多个焊料凸块的裸片位于衬底上，使得多个焊料凸块基本上与多个底部填充凸块垂直对齐。多个焊料凸块被压入多个底部填充凸块中，直到多个焊料凸块接触多个触点。多个焊料凸块被回流。模具，多个焊料凸块和多个触点被封装以暴露多个触点的下表面。

2. 发明申请

US20060125110A1 Method for solder bumping, and solder-bumping structures produced thereby 有权
标题翻译：焊接凸块的方法以及由此产生的焊料凸起结构
公开(公告)号：US20060125110A1
公开(公告)日：2006-06-15
申请号：US11009436
申请日：2004-12-09
申请人： Byung Do , Romeo Alvarez , Yaojian Lin
发明人： Byung Do , Romeo Alvarez , Yaojian Lin
IPC分类号： H01L23/48 , H01L21/60
CPC分类号： H05K3/3484 , H01L24/11 , H01L24/13 , H01L2224/0401 , H01L2224/05018 , H01L2224/05027 , H01L2224/05147 , H01L2224/05171 , H01L2224/05558 , H01L2224/05572 , H01L2224/05644 , H01L2224/05647 , H01L2224/1132 , H01L2224/13021 , H01L2224/13099 , H01L2224/13111 , H01L2224/16 , H01L2924/0002 , H01L2924/01006 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/30105 , H01L2924/30107 , H05K3/1216 , H05K3/3452 , H05K2203/043 , H05K2203/0568 , H01L2224/05552 , H01L2924/00 , H01L2924/00014 , H01L2924/013
摘要： A method for solder bumping provides a substrate and forms a film on the substrate. The film has openings therethrough. A stencil is aligned on the film. The stencil has openings therethrough over the openings through the film. Solder paste is printed onto the substrate and into the openings through the stencil and the openings through the film. The solder paste is reflowed to form solder balls therefrom. The stencil and the film are then removed.
摘要翻译：焊接凸块的方法提供基板并在基板上形成膜。该膜具有开口。模板在电影上对齐。模板在穿过薄膜的开口上方具有穿过其的开口。焊膏通过模版印刷到基板上并通过薄膜印刷到开口中。焊膏被回流以从其形成焊球。然后去除模板和胶片。

3. 发明申请

US20070114639A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH BUMP PAD 有权
标题翻译：集成电路封装系统与BUMP PAD
公开(公告)号：US20070114639A1
公开(公告)日：2007-05-24
申请号：US11556035
申请日：2006-11-02
申请人： Yaojian Lin , Romeo Alvarez , Haijing Cao , Wan Lay Looi
发明人： Yaojian Lin , Romeo Alvarez , Haijing Cao , Wan Lay Looi
IPC分类号： H01L23/495
CPC分类号： H01L24/10 , H01L23/3114 , H01L24/13 , H01L2224/05008 , H01L2224/05548 , H01L2224/05572 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2924/00014 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/00 , H01L2224/05599 , H01L2224/05099
摘要： An integrated circuit package system includes an integrated circuit, and forming a patterned redistribution pad over the integrated circuit.
摘要翻译：集成电路封装系统包括集成电路，并在该集成电路上形成图案化再分配焊盘。

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