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    • 8. 发明授权
    • Polycarbonate molding compositions
    • 聚碳酸酯成型组合物
    • US5126404A
    • 1992-06-30
    • US517084
    • 1990-05-01
    • Thomas EckelDieter WittmannChristian LindnerUwe Westeppe
    • Thomas EckelDieter WittmannChristian LindnerUwe Westeppe
    • C08F2/22C08F4/40C08F279/02C08L51/04C08L55/00C08L55/02C08L69/00
    • C08L51/04C08L69/00
    • Thermoplastic molding composition comprisingA. 5 to 99% by weight (based on A+B) of a polycarbonate based on substituted dihydroxydiphenyl cycloalkanesB. 1 to 95% by weight (based on A+B) of a graft polymer prepared by a special process of5 to 90 parts by weight of a mixture ofB.1.1. 50 to 95 parts by weight styrene, .alpha.-methyl styrene, C.sub.1-4 alkyl- or halogen-nucleus-substituted styrenes, C.sub.1-8 alkyl methacrylates, C.sub.1-8 alkyl acrylates or mixtures thereof andB.1.2. 5 to 50 parts by weight acrylonitrile, methacrylonitrile, C.sub.1-8 alkyl methacrylates, C.sub.1-8 alkyl acrylates, maleic anhydride, C.sub.1-4 alkyl-N-maleic imides, phenyl-N-maleic imides or mixtures thereof onB.2. 10 to 95 parts by weight of a diene rubber having an average particle diameter d50 of from 0.09 to 1 .mu.m and a gel content of more than 50% by weight and optionally at least one other thermoplastic resin which replaces up to 75% by weight of the polycarbonate A.
    • 含有5至99重量%(基于A + B)的基于取代的二羟基二苯基环烷烃的聚碳酸酯的热塑性模制组合物.B.1至95重量%(基于A + B)由特殊的 方法为5〜90重量份B.1.1的混合物。 50至95重量份苯乙烯,α-甲基苯乙烯,C 1-4烷基或卤素 - 核取代的苯乙烯,甲基丙烯酸C 1-8烷基酯,丙烯酸C 1-8烷基酯或其混合物和B.1.2。 5至50重量份丙烯腈,甲基丙烯腈,甲基丙烯酸C 1-8烷基酯,丙烯酸C 1-8烷基酯,马来酸酐,C 1-4烷基-N-马来酰亚胺,苯基-N-马来酰亚胺或其在B.2上的混合物。 10至95重量份平均粒径d 50为0.09至1微米且凝胶含量大于50重量%的二烯橡胶和任选的至少一种其它热塑性树脂,其代替75重量% 的聚碳酸酯A.