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1. 发明专利

JPH0212706B2 失效
公开(公告)号：JPH0212706B2
公开(公告)日：1990-03-26
申请号：JP9583383
申请日：1983-06-01
申请人： HITACHI LTD
发明人： GOTO TETSUYA , KONO MICHINAGA , OOWADA SHUNICHI , ISOBE MITSUNOBU , SEKIGUCHI KOICHIRO
IPC分类号： B25J9/16 , B25J9/00 , H05K13/00

2. 发明专利

JPH11273289A Magnetic head assembly 失效
标题翻译：磁头组件
公开(公告)号：JPH11273289A
公开(公告)日：1999-10-08
申请号：JP6972198
申请日：1998-03-19
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： HASHIMOTO KAZUE , MITA TORU , SHIRAKAWA MASANORI , SEKIGUCHI KOICHIRO , UMAGOE YUKIMORI , YAMAZAKI MUNEYUKI
IPC分类号： G11B5/49 , G11B21/21
摘要： PROBLEM TO BE SOLVED: To keep parallelism between a slider and a gimbal spring and to obtain high adhesive strength while preventing an adhesive from entering a terminal part by forming a terminal pattern, an adhesive entering protection means, a slider warp protection means and a flatness securement means in the same manufacturing process and setting a wiring pattern structure of a gimbal part of a suspension tip in the same height.
SOLUTION: The wiring pattern 35 structure in the gimbal spring 33 is provided with the terminal pattern 1, an adhesive entering protection pattern 2, a slider warp protection pattern 3 and a flatness securing pattern 4. At this time, respective pattern heights are arranged by manufacturing respective patterns 1-4 in the same manufacturing process. Thus, the parallelism between the slider (alternate long and short dash line part) and the gimbal spring 33 is secured, and the contraction of the adhesive 34 is uniformized, and the warp in the slider is eliminated by prescribing adhesive thickness with a plane formed by respective patterns 1-4, and stable floating is obtained.
COPYRIGHT: (C)1999,JPO
摘要翻译：要解决的问题：为了保持滑块和万向弹簧之间的平行度，并且通过形成端子图案防止粘合剂进入端子部分，获得高粘合强度，粘合剂进入保护装置，滑块翘曲保护装置和平坦度固定装置在相同的制造过程中，并且将悬架尖端的万向节部分的布线图案结构设置在同一高度。解决方案：万向弹簧33中的布线图案35的结构设置有端子图案1，粘合剂进入保护图案2，滑块翘曲保护图案3和平坦度固定图案4.此时，各图案高度通过在相同的制造过程中制造相应的图案1-4。因此，固定滑块（交替的长短虚线部分）和万向弹簧33之间的平行度，并且粘合剂34的收缩是均匀的，并且通过用形成的平面规定粘合剂厚度来消除滑块中的翘曲通过各自的图案1-4，获得稳定的浮动。

3. 发明专利

JP2001296044A CLEAN BOOTH STRUCTURE 失效
公开(公告)号：JP2001296044A
公开(公告)日：2001-10-26
申请号：JP2000117172
申请日：2000-04-13
申请人： HITACHI LTD
发明人： MIYAHARA OSAMU , MOROTA NAOKI , RACHI MIKIO , KATO HIROSHI , SEKIGUCHI KOICHIRO
IPC分类号： F24F7/06
摘要： PROBLEM TO BE SOLVED: To eliminate some problems that a controlling operation most suitable for a state of each of clean booths could not be carried out in the prior art for adjustment of temperature and humidity of an entire room and further remove a disadvantage that an air flow in the booth is inclined and the booth is easily influenced with dusts generated from a worker. SOLUTION: A unit capable of adjusting both temperature and humidity is installed in the prior art clean booth. The most suitable temperature and humidity control in the booth can be carried out. An air flow regulating plate is fixed to the central part of an air-blowing segment in the booth. A working area is arranged just below it. Workers are placed at both sides of the working area and then the cleanest air not influenced by dusts generated from the workers can be supplied to a working surface.

4. 发明专利

JP2001296043A CELL BOOTH 失效
公开(公告)号：JP2001296043A
公开(公告)日：2001-10-26
申请号：JP2000117171
申请日：2000-04-13
申请人： HITACHI LTD
发明人： MIYAHARA OSAMU , RACHI MIKIO , KOMURO KENJI , KATO HIROSHI , SEKIGUCHI KOICHIRO
IPC分类号： F24F7/007
摘要： PROBLEM TO BE SOLVED: To eliminate some disadvantages that a large-sized line configuration of the prior art transferring of a large amount of lots hardly accommodates for products showing severe variation, provides a non-efficient operation taking a long stopped time of line accompanied by useless investment or modification, and further to remove a substantial problem that a complete distribution of clean concept may produce a tremendous operating expenditure for cleaning operation or a clean packaging of parts or an opening of the packaged product. SOLUTION: A line is made as a minimum unit, installed in a cell booth. The booth is of a structure facilitating its adding or removal. Each of the cell booths is connected to each other by a clean tunnel structure of panel structure that can be easily increased or decreased, thereby it becomes possible to attain a requisite and minimum clean state and the most-suitable line structure.

5. 发明专利

JPH03171643A JOINTING OF METAL MEMBER, METHOD AND DEVICE FOR MANUFACTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE USING SAME 失效
公开(公告)号：JPH03171643A
公开(公告)日：1991-07-25
申请号：JP30992289
申请日：1989-11-29
申请人： HITACHI LTD
发明人： NAKAO TAKASHI , EMOTO YOSHIAKI , SEKIGUCHI KOICHIRO , IKETANI MASAYUKI , SAWARA KUNIZO , YOSHIDA IKUO , KONO AKIOMI
IPC分类号： H01L21/60 , H01L23/12
摘要： PURPOSE:To reduce heat damage to a semiconductor chip and to realize a reduction in a reflow time and a reduction in the size of a reflow furnace by a method wherein an atomic beam or an ion energy beam is irradiated on the joint surfaces of a pair of metal members housed in a vacuum container and thereafter, the metal members are transferred to a container, in which a high-purity inert gas-containing atmosphere is formed, and the joint surfaces of the metal members are pressure-welded to each other under normal pressures. CONSTITUTION:A pair of source guns 18 for transforming Ar gas introduced in a surface activating chamber 17 into an atom beam are installed in the chamber 17 and a semiconductor chip 5 and a package substrate 3 are irradiated with this atomic beam. Thereby, an activating treatment is performed on the surfaces of CCB bumps 2 and electrodes 4. After that, the chip 5 and the substrate 3 are immediately transferred to a jointing chamber 20 as they are respectively housed in trays 15a and 15b through a second load-lock chamber 19. A high-purity inert gas-containing atmosphere of normal pressures is formed in the chamber 20. A temporary jointing mechanism and a fusion jointing mechanism are provided in the interior of the chamber 20 and the temporary jointing and the final jointing are performed using these mechanisms.

6. 发明专利

JPS6293943A METHOD AND DEVICE FOR END POINT DETECTION 失效
公开(公告)号：JPS6293943A
公开(公告)日：1987-04-30
申请号：JP23323285
申请日：1985-10-21
申请人： HITACHI LTD
发明人： KAMIOKA TETSUYA , OKABE TSUTOMU , MAEJIMA HIROSHI , WAKIYAMA FUMITOSHI , SEKIGUCHI KOICHIRO , HANAJIMA SHUICHI
IPC分类号： H01L21/302 , H01L21/3065
摘要： PURPOSE:To improve the accuracy for detecting an end point of etching by a method wherein, when dry etching is performed on a thin film formed on the surface of a semiconductor wafer to form a prescribed pattern, different wavelengths of emission spectrums emitted from the thin film are combined and the peak position of this differential waveform is regarded as the end point of etching. CONSTITUTION:A parallel plate electrode 7 consisting of a lower electrode 5 whereon a semiconductor wafer 4 is placed and an upper electrode 6 is arranged over a substrate part 1 of a plasma etching device having an exhaust tube 9 and this electrode 7 is covered with a bell-jar 2 made of transparent quartz. Moreover, the electrode 5 is earthed, the electrode 6 is connected to an external high-frequency power source 8 and gas is fed in a treating chamber 3 in the interior of the bell-jar 2 from a reaction gas control mechanism 10 through a supply pipe 11. Thereafter, the gas is activated with plasma 12 generated, lights emitted from a thin film formed on the semiconductor wafer surface are processed in a combination circuit part 17 through BPFs 14a and 14b, photo diodes 13a and 13b, amplifying parts 15a and 15b and A/D converters 16a and 16b outside the bell-jar 2. Then, a differential calculation is executed in a decision part 18 and the power source 8 is stopped using the peak of the waveform.

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