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    • 2. 发明授权
    • Fluid cooled electronic assembly
    • 流体冷却电子组件
    • US07551439B2
    • 2009-06-23
    • US11396322
    • 2006-03-28
    • Darrel E. PeughBruce A. MyersGary E. Oberlin
    • Darrel E. PeughBruce A. MyersGary E. Oberlin
    • H05K7/20
    • H01L23/053H01L23/473H01L2924/0002H01L2924/09701H01L2924/13055H01L2924/00
    • An electronic assembly is provided having a thermal cooling fluid, such as a liquid, for cooling an electronic device within a sealed compartment. The assembly includes a housing generally defining a sealed fluid compartment, an electronic device disposed within the housing and a cooling liquid for cooling the electronic device. The assembly includes inlet and outlet ports in fluid communication with the sealed fluid compartment for allowing the cooling liquid to pass through the compartment to cool the electronic device. Fluid flow channels are formed in thermal communication with the electronic device within the housing. The fluid channels include channels that allow liquid to flow in thermal communication with the electronic device to cool the device.
    • 提供电子组件,其具有用于冷却密封隔室内的电子设备的热冷却流体,例如液体。 组件包括大致限定密封的流体隔室的壳体,设置在壳体内的电子设备和用于冷却电子设备的冷却液体。 组件包括与密封流体隔室流体连通的入口和出口端口,用于允许冷却液体通过隔室以冷却电子设备。 流体流动通道形成为与壳体内的电子装置热连通。 流体通道包括允许液体与电子设备热连通流动的通道以冷却设备。