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    • 2. 发明公开
    • NANOWIRE LED STRUCTURE WITH DECREASED LEAKAGE AND METHOD OF MAKING SAME
    • NANODRAHT-LED-STRUKTUR MIT VERMINDERTER LECKAGE UND VERFAHREN ZUR HERSTELLUNG DAVON
    • EP2973756A1
    • 2016-01-20
    • EP14762216.1
    • 2014-03-14
    • GLO ABSvensson, Carl Patrik TheodorRomano, LindaHerner, Scott BradLemay, Cynthia
    • SVENSSON, Carl Patrik TheodorROMANO, LindaHERNER, Scott BradLEMAY, Cynthia
    • H01L33/20
    • H01L33/24B82Y20/00H01L33/007Y10S977/762Y10S977/95
    • A semiconductor device includes a plurality of first conductivity type semiconductor nanowire cores extending from portions of a surface of a support exposed through openings in a mask layer, and a plurality of semiconductor shells extending over the nanowire cores. Each semiconductor shell includes at least one semiconductor interior shell extending around the respective nanowire cores, and a second conductivity type semiconductor outer shell extending around the interior shell. A first electrode layer contacts the second conductivity type semiconductor outer shell and extends into spaces between the semiconductor shells. The semiconductor interior shell includes a semiconductor foot portion which extends under the first electrode and under the respective second conductivity type semiconductor outer shell on the insulating masking layer in the spaces between the semiconductor shells. Semiconductor devices and methods including an insulating layer located between an insulating mask layer and a first electrode in the spaces between semiconductor shells.
    • 半导体器件包括位于支撑体上方的多个第一导电型半导体纳米线芯,以及位于支撑体上方的绝缘掩模层。 纳米线芯包括从通过绝缘掩模层中的开口露出的支撑体的半导体表面的部分外延延伸的半导体纳米线。 该器件还包括在相应的纳米线芯之上和之上延伸的多个第二导电类型半导体外壳,与第二导电类型半导体外壳接触并延伸到半导体外壳之间的空间的第一电极层,以及位于绝缘层之间的绝缘层 掩模层和半导体外壳之间的空间中的第一电极。
    • 3. 发明申请
    • NANOWIRE LED STRUCTURE WITH DECREASED LEAKAGE AND METHOD OF MAKING SAME
    • NANOWIRE LED结构具有减少的泄漏及其制造方法
    • WO2014143991A1
    • 2014-09-18
    • PCT/US2014/028208
    • 2014-03-14
    • GLO ABSVENSSON, Carl Patrik TheodorROMANO, LindaHERNER, Scott BradLEMAY, Cynthia
    • SVENSSON, Carl Patrik TheodorROMANO, LindaHERNER, Scott BradLEMAY, Cynthia
    • H01L33/20
    • H01L33/24B82Y20/00H01L33/007Y10S977/762Y10S977/95
    • A semiconductor device includes a plurality of first conductivity type semiconductor nanowire cores extending from portions of a surface of a support exposed through openings in a mask layer, and a plurality of semiconductor shells extending over the nanowire cores. Each semiconductor shell includes at least one semiconductor interior shell extending around the respective nanowire cores, and a second conductivity type semiconductor outer shell extending around the interior shell. A first electrode layer contacts the second conductivity type semiconductor outer shell and extends into spaces between the semiconductor shells. The semiconductor interior shell includes a semiconductor foot portion which extends under the first electrode and under the respective second conductivity type semiconductor outer shell on the insulating masking layer in the spaces between the semiconductor shells. Semiconductor devices and methods including an insulating layer located between an insulating mask layer and a first electrode in the spaces between semiconductor shells.
    • 半导体器件包括从通过掩模层中的开口暴露的支撑体的表面的部分延伸的多个第一导电型半导体纳米线芯,以及在纳米线芯上延伸的多个半导体外壳。 每个半导体外壳包括围绕相应的纳米线芯延伸的至少一个半导体内壳,以及围绕内壳延伸的第二导电型半导体外壳。 第一电极层接触第二导电类型半导体外壳并延伸到半导体外壳之间的空间。 半导体内壳包括在半导体外壳之间的空间中在绝缘屏蔽层下方延伸在第一电极下方和相应的第二导电类型半导体外壳下方的半导体底座部分。 半导体器件和方法包括位于半导体外壳之间的绝缘掩模层和第一电极之间的绝缘层。