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1. 发明授权

EP2378848B1 Chassis with distributed jet cooling 有权转让
公开(公告)号：EP2378848B1
公开(公告)日：2020-05-27
申请号：EP11162122.3
申请日：2011-04-12
申请人： GENERAL ELECTRIC COMPANY
发明人： Arik, Mehmet , Gerstler, William Dwight , Li, Ri , Nicewarner, Earl Ross , Schroeder, Christina Clyde , Vander Ploeg, Benjamin Jon , Whalen, Bryan Patrick
IPC分类号： H05K7/02 , H05K7/20

2. 发明公开

EP2538440A3 Cooling device for a power module, and a related method thereof 有权
标题翻译：功率模块的冷却装置及其相关方法
公开(公告)号：EP2538440A3
公开(公告)日：2017-12-27
申请号：EP12173294.5
申请日：2012-06-22
申请人： General Electric Company
发明人： Beaupre, Richard Alfred , Smolenski, Joseph Lucian , Gerstler, William Dwight , Shen, Xiaochun
IPC分类号： H01L23/473
摘要： A cooling device for a power module having an electronic module disposed on a base plate via a substrate is disclosed. The cooling device includes a heat sink plate having at least one cooling segment. The cooling segment includes an inlet plenum for entry of a cooling medium, a plurality of inlet manifold channels, a plurality of outlet manifold channels, and an outlet plenum. The plurality of inlet manifold channels are coupled orthogonally to the inlet plenum for receiving the cooling medium from the inlet plenum. The plurality of outlet manifold channels are disposed parallel to the inlet manifold channels. The outlet plenum is coupled orthogonally to the plurality of outlet manifold channels for exhaust of the cooling medium. A plurality of millichannels are disposed in the base plate orthogonally to the inlet and the outlet manifold channels. The plurality ofmilli channels direct the cooling medium from the plurality of inlet manifold channels to the plurality of outlet manifold channels.
摘要翻译：公开了一种用于功率模块的冷却装置，该功率模块具有经由基板布置在基板上的电子模块。该冷却装置包括具有至少一个冷却段的散热板。冷却段包括用于进入冷却介质的入口气室，多个入口歧管通道，多个出口歧管通道和出口气室。多个入口歧管通道垂直于入口增压室联接，用于从入口增压室接收冷却介质。多个出口歧管通道平行于入口歧管通道布置。出口压力通风系统与多个出口歧管通道垂直连接，用于排出冷却介质。多个毫通道与进口歧管通道和出口歧管通道正交地设置在基板中。多个Milli通道将来自多个入口歧管通道的冷却介质引导至多个出口歧管通道。

3. 发明公开

EP2254221A3 Cooling system for rotating machine 有权转让
标题翻译： KühlsystemfürRotationsmaschine
公开(公告)号：EP2254221A3
公开(公告)日：2017-01-25
申请号：EP10156556.2
申请日：2010-03-15
申请人： General Electric Company
发明人： Gerstler, William Dwight , El-Refaie, Ayman Mohamed , Lokhandwalla, Murtuza , Alexander, James Pellegrino , Palafox, Pepe , Shen, Xiaochun , Salasoo, Lembit
IPC分类号： H02K1/32 , H02K9/193 , H02K9/19 , H02K1/27
CPC分类号： H02K1/32 , H02K1/2773 , H02K9/19 , H02K9/193
摘要： An electrical machine comprising a rotor is presented. The electrical machine includes the rotor disposed on a rotatable shaft and defining a plurality of radial protrusions extending from the shaft up to a periphery of the rotor. The radial protrusions having cavities define a fluid path. A stationary shaft is disposed concentrically within the rotatable shaft wherein an annular space is formed between the stationary and rotatable shaft. A plurality of magnetic segments is disposed on the radial protrusions and the fluid path from within the stationary shaft into the annular space and extending through the cavities within the radial protrusions.
摘要翻译：提出了一种包括转子的电机。电机包括设置在可旋转轴上的转子，并且限定从轴向上延伸到转子的周边的多个径向突起。具有空腔的径向突起限定了流体路径。固定轴同心地设置在可旋转轴内，其中在固定轴和可旋转轴之间形成环形空间。多个磁段设置在径向突起和从静止轴内进入环形空间并延伸穿过径向突起内的空腔的流体路径上。

4. 发明公开

EP1967289A3 Rotor shaft assembly for magnetic bearings for use in corrosive environments 审中-公开
标题翻译：用于在腐蚀性环境中使用的磁性轴承的转子轴组合件
公开(公告)号：EP1967289A3
公开(公告)日：2013-07-24
申请号：EP08152387.0
申请日：2008-03-06
申请人： GENERAL ELECTRIC COMPANY
发明人： Merfeld, Glen David , Ali, Mohamed Ahmed , Brisson, Bruce William , Ehteshami, Mohammad , Gadangi, Ravindra , Gerstler, William Dwight , Giorni, Eugenio , Irwin, Patricia Chapman , Thodla, Ramgopal , Van Dam, Jeremy Daniel , Weeber, Konrad Roman
IPC分类号： B05D7/14 , C22C38/40 , C23C30/00 , G01R31/34 , H02K5/02 , H02K5/128 , H02K15/00 , H02K15/12 , F16C39/02 , F16C32/04 , C22C19/03 , C22C19/05 , C22C19/07 , C22C38/42 , C22C38/48 , F16C35/00 , H02K1/02 , H02K1/04 , H02K3/30
CPC分类号： H02K5/128 , C22C19/03 , C22C19/055 , C22C19/07 , C22C38/42 , C22C38/48 , F16C32/0442 , F16C32/0468 , F16C32/047 , F16C35/00 , F16C39/02 , F16C2204/52 , F16C2240/40 , F16C2300/42 , H02K1/02 , H02K1/04 , H02K3/30
摘要： Rotor and stator assemblies that utilize magnetic bearings for supporting the rotor shaft during operation can be suitably used in corrosive environments, such as sour gas. The rotor and stator assemblies include NACE compliant magnetic bearing arrangements for sour gas applications. In one embodiment, a rotor shaft assembly (100) for a magnetic bearing arrangement comprises a rotor shaft (102) formed of a ferromagnetic material comprising a plurality of rotor laminations (104) disposed on the rotor shaft (102); and a barrier layer (106) formed on selected exposed surfaces of the rotor shaft 102, wherein the barrier layer (106) is effective to resist corrosion relative to the surface without the barrier layer (106).

5. 发明公开

EP1786088A2 Synchronous reluctance machine with a novel rotor topology 有权
标题翻译： Synchronreluktanzmaschine mit neuer Rotorstruktur
公开(公告)号：EP1786088A2
公开(公告)日：2007-05-16
申请号：EP06255794.7
申请日：2006-11-13
申请人： General Electric Company
发明人： Shah, Manoj Ramprasad , Vandam, Jeremy Daniel , Gerstler, William Dwight , Qu, Ronghai , Carl, Ralph James
IPC分类号： H02K19/10 , H02K1/24
CPC分类号： H02K1/246 , H02K1/32
摘要： A synchronous reluctance machine (10) that has a stator (11) and a rotor shaft (59) operationally disposed within the confines of the stator (11). Laminations (18 to 29, 39) are axially stacked to form boat shaped segments. A plurality of selected boat shaped segments form a selected number of rotor poles (14, 15, 16, 17) about the rotor shaft and a plurality of support bars (30, 43, 44) disposed intermittently between the boat shaped segments. Each segment of lamination is boat shaped with angular acuity facing towards the stator.
摘要翻译：一种具有定子（11）和可操作地设置在定子（11）的限制内的转子轴（59）的同步磁阻电机（10）。层压（18至29,39）被轴向堆叠以形成船形段。多个选定的船形段形成围绕转子轴的选定数量的转子极（14,15,16,17），以及间隔地设置在船形段之间的多个支撑杆（30,43,44）。层叠的每个片段是具有朝向定子的角度锐度的船形。

6. 发明公开

EP4368395A2 SYSTEMS AND METHODS FOR USING ADDITIVE MANUFACTURING FOR THERMAL MANAGEMENT 审中-实审
公开(公告)号：EP4368395A2
公开(公告)日：2024-05-15
申请号：EP24166693.2
申请日：2015-04-07
申请人： General Electric Company
发明人： Rush, Brian Magann , Gerstler, William Dwight , Lassini, Stefano Angelo Mario , Wetzel, Todd Garrett
IPC分类号： B33Y80/00
CPC分类号： F28D15/0233 , F28D15/046 , G06F1/20 , G06F2200/20120130101 , H05K7/20672 , H05K7/20336 , B33Y80/00 , B33Y10/00 , B22F10/20 , B22F3/1103
摘要： According to one embodiment, a thermal management system for electronic devices (610, 620), including a heat frame (625), a conformal slot portion, chassis frame, and heat fins (670) wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber (600) comprising a component surface (680) and a top surface (675) with a vapor channel formed therebetween with at least one liquid receptacle (690) and having a wick structure (650) on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components (610, 620) coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.

7. 发明公开

EP3702884A1 SYSTEMS AND METHODS FOR USING ADDITIVE MANUFACTURING FOR THERMAL MANAGEMENT 有权
公开(公告)号：EP3702884A1
公开(公告)日：2020-09-02
申请号：EP20163552.1
申请日：2015-04-07
申请人： General Electric Company
发明人： Rush, Brian Magann , Gerstler, William Dwight , Lassini, Stefano Angelo Mario , Wetzel, Todd Garrett
IPC分类号： G06F1/20 , H05K7/20 , F28D15/02 , F28D15/04
摘要： According to one embodiment, a thermal management system for electronic devices (610, 620), including a heat frame (625), a conformal slot portion, chassis frame, and heat fins (670) wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber (600) comprising a component surface (680) and a top surface (675) with a vapor channel formed therebetween with at least one liquid receptacle (690) and having a wick structure (650) on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components (610, 620) coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.

8. 发明授权

EP2538440B1 Cooling device for a power module, and a related method thereof 有权
公开(公告)号：EP2538440B1
公开(公告)日：2020-05-06
申请号：EP12173294.5
申请日：2012-06-22
申请人： General Electric Company
发明人： Beaupre, Richard Alfred , Smolenski, Joseph Lucian , Gerstler, William Dwight , Shen, Xiaochun
IPC分类号： H01L23/473

9. 发明授权

EP1786088B1 Synchronous reluctance machine with a novel rotor topology 有权
标题翻译： Synchronreluktanzmaschine与新的转子结构
公开(公告)号：EP1786088B1
公开(公告)日：2013-11-06
申请号：EP06255794.7
申请日：2006-11-13
申请人： GENERAL ELECTRIC COMPANY
发明人： Shah, Manoj Ramprasad , Vandam, Jeremy Daniel , Gerstler, William Dwight , Qu, Ronghai , Carl, Ralph James
IPC分类号： H02K19/10 , H02K1/24
CPC分类号： H02K1/246 , H02K1/32

10. 发明公开

EP4368395A3 SYSTEMS AND METHODS FOR USING ADDITIVE MANUFACTURING FOR THERMAL MANAGEMENT 审中-实审
公开(公告)号：EP4368395A3
公开(公告)日：2024-08-07
申请号：EP24166693.2
申请日：2015-04-07
申请人： General Electric Company
发明人： Rush, Brian Magann , Gerstler, William Dwight , Lassini, Stefano Angelo Mario , Wetzel, Todd Garrett
IPC分类号： G06F1/20 , H05K7/20 , F28D15/02 , F28D15/04 , B22F3/11 , B22F10/20 , B33Y10/00 , B33Y80/00
CPC分类号： F28D15/0233 , F28D15/046 , G06F1/20 , G06F2200/20120130101 , H05K7/20672 , H05K7/20336 , B33Y80/00 , B33Y10/00 , B22F10/20 , B22F3/1103
摘要： According to one embodiment, a thermal management system for electronic devices (610, 620), including a heat frame (625), a conformal slot portion, chassis frame, and heat fins (670) wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber (600) comprising a component surface (680) and a top surface (675) with a vapor channel formed therebetween with at least one liquid receptacle (690) and having a wick structure (650) on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components (610, 620) coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.

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