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1. 发明专利

JP2013230502A Bonding method 有权
标题翻译：结合方法
公开(公告)号：JP2013230502A
公开(公告)日：2013-11-14
申请号：JP2013055681
申请日：2013-03-18
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： TOYOHARA NOZOMI , SAKAMOTO AKIRA , KASAI YOHEI
IPC分类号： B23K35/26 , B23K1/00 , B23K1/20 , B23K35/30 , B23K101/40 , B23K103/18 , C22C5/02 , C22C13/00
摘要： PROBLEM TO BE SOLVED: To achieve a bonding method capable of using an Au-Sn 90% solder of low melting point as a hard solder after bonding, and to achieve a highly reliable laser module in which the position of a laser light source is not deviated nor the solder is destroyed.SOLUTION: In a bonding method for bonding two members A and B with an Au-Sn solder, the concentration of Sn, by wt.%, in the Au-Sn solder S' after bonding is set to 38.0% or more and 82.3% or less.
摘要翻译：要解决的问题：为了实现在接合之后能够使用低熔点的Au-Sn 90％焊料作为硬焊料的接合方法，并且实现激光光源的位置不是的可靠的激光模块在焊接方法中，使用Au-Sn焊料将两个元件A和B接合时，在接合后的Au-Sn焊料S'中的Sn的重量％的浓度设定为 38.0％以上且82.3％以下。

2. 发明专利

JP2013135020A Laser module and manufacturing method of the same 有权
标题翻译：激光模块及其制造方法
公开(公告)号：JP2013135020A
公开(公告)日：2013-07-08
申请号：JP2011282899
申请日：2011-12-26
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： KASAI YOHEI
IPC分类号： H01S5/022
CPC分类号： H01S3/06704 , B23K1/0008 , G02B6/4204 , G02B6/4248 , G02B6/4268 , H01L2224/48091 , H01L2224/48247 , H01S5/005 , H01S5/02248 , H01S5/02252 , H01S5/02284 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a laser module which improves heat radiation performance, and to provide a manufacturing method of the laser module.SOLUTION: A laser module includes: a bottom plate 11 of a box body 10; a frame member 12 of the box body 10 which has a through hole OP allowing an internal space to communicate with an external space of the box body 10 and is fixed to the bottom plate 11; a pipe member 20 having a cavity PH communicating with the through hole OP and joined to an outer wall of the frame member 12; an optical fiber 50 held on the cavity PH of the pipe member 20; and a laser element 30 which is housed in the internal space of the box body 10 and is subject to optical axis alignment with the optical fiber 50. When the bottom plate 11 is placed on a plane surface, a bottom surface of the pipe member 20 is placed on the same surface as a portion of the bottom plate which contacts with the plane surface.
摘要翻译：要解决的问题：提供一种提高散热性能的激光组件，并提供激光模块的制造方法。解决方案：激光模块包括：箱体10的底板11; 盒体10的框架构件12具有通孔OP，允许内部空间与箱体10的外部空间连通并固定到底板11; 管构件20具有与通孔OP连通并连接到框架构件12的外壁的空腔PH; 保持在管构件20的空腔PH上的光纤50; 以及激光元件30，其被容纳在盒体10的内部空间中并与光纤50进行光轴对准。当底板11被放置在平面上时，管构件20的底面被放置在与平面接触的底板的一部分的相同的表面上。

3. 发明专利

JP2012173671A Fiber mount device, optical module using the same, and manufacturing method of optical module 有权
标题翻译：光纤装置，使用其的光学模块和光模块的制造方法
公开(公告)号：JP2012173671A
公开(公告)日：2012-09-10
申请号：JP2011037926
申请日：2011-02-24
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： TOYOHARA NOZOMI , SAKAMOTO AKIRA , KASAI YOHEI
IPC分类号： G02B6/42
CPC分类号： G02B6/3628 , B23K1/0056 , G02B6/4202 , G02B6/424 , G02B6/4257
摘要： PROBLEM TO BE SOLVED: To provide a fiber mount device which can realize an optical module with a reduced variation in a simple configuration; an optical module using the same; and a manufacturing method of the optical module.SOLUTION: A fiber mount device 2 includes a fiber sub-mount body 31 comprising ceramic transmitting a laser beam of prescribed wavelength, a bonding pad 33 provided on the top face of the fiber sub-mount body 31, and a laser absorption layer 32 provided on at least part of undersurface of the fiber sub-mount body 31 and for absorbing the laser beam of prescribed wavelength.
摘要翻译：要解决的问题：提供一种光纤安装装置，其可以实现具有简单配置的变化减小的光学模块; 使用其的光学模块; 以及光模块的制造方法。解决方案：光纤安装装置2包括：光纤子安装体31，其包括传输规定波长的激光束的陶瓷，设置在光纤子安装体31的顶面上的接合焊盘33，以及激光吸收设置在光纤子安装体31的下表面的至少一部分上并用于吸收规定波长的激光束的层32。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2013257362A Laser module 有权
标题翻译：激光模块
公开(公告)号：JP2013257362A
公开(公告)日：2013-12-26
申请号：JP2012131701
申请日：2012-06-11
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： KASAI YOHEI
IPC分类号： G02B6/42 , H01S5/022
摘要： PROBLEM TO BE SOLVED: To provide a high-output optical fiber module which converts leakage light into heat so as to release it outside.SOLUTION: An optical fiber module 1 includes: a package housing 10; a laser device 20 arranged in a package internal space S inside the package housing 10; and an optical fiber 30 propagating a laser beam from the laser device 20 outside. The optical fiber 30 includes a protruding end part which protrudes from an inner wall surface of the package housing 10 toward the package internal space S. A light scattering body 40A extending from the inner wall surface of the package housing 10 toward the package internal space S covers a periphery of the protruding end part of the optical fiber over a length L.
摘要翻译：要解决的问题：提供将泄漏光转换成热量以将其释放到外部的高输出光纤模块。解决方案：光纤模块1包括：封装壳体10; 布置在包装壳体10内部的包装内部空间S中的激光装置20; 以及将激光装置20的激光束外部传播的光纤30。光纤30包括从封装壳体10的内壁面朝向封装内部空间S突出的突出端部。从散布体10的内壁面朝向封装内部空间S延伸的光散射体40A 在长度L上覆盖光纤的突出端部的周边。

5. 发明专利

JP2015022022A フェルール付光ファイバ、光モジュール、及び製造方法审中-公开
标题翻译：光纤与光纤，光学模块和制造方法
公开(公告)号：JP2015022022A
公开(公告)日：2015-02-02
申请号：JP2013147869
申请日：2013-07-16
申请人：株式会社フジクラ , Fujikura Ltd
发明人： KASAI YOHEI
IPC分类号： G02B6/42 , G02B6/36
摘要：【課題】光ファイバの端面において生じる反射とフェルールの端面において生じる反射とを共に抑制する。【解決手段】反射防止膜13に関して、フェルール12の端面12aを覆う部分132の膜構造を、フェルール12に入射する波長λの光に対して低反射条件を満たすように定め、光ファイバ11の端面11aを覆う部分131の膜構造を、光ファイバ11のコア111aに入射する波長λの光に対して低反射条件を満たすように定める。【選択図】図1
摘要翻译：要解决的问题：为了防止在光纤的端面发生的反射和在套圈的端面发生的反射。解决方案：对于防反射膜13，覆盖一部分的部分132的膜结构将套圈12的端面12a设定为满足入射在套圈12上的波长λ的光的低反射条件，覆盖光纤11的端面11a的部分131的膜结构被设定为以满足入射在光纤11的芯111a上的波长λ的光的低反射条件。

6. 发明专利

JP2014126852A Multiplexing device, multiplexing method, and ld module 有权
标题翻译：多路复用器件，多路复用方法和LD模块
公开(公告)号：JP2014126852A
公开(公告)日：2014-07-07
申请号：JP2012286085
申请日：2012-12-27
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： KASAI YOHEI , NAKATANI SUSUMU , SAKAMOTO SHINICHI
IPC分类号： G02B6/42 , G02B6/28 , H01S5/022
CPC分类号： H01S5/4012 , G02B5/10 , G02B6/4214 , G02B6/425 , G02B6/4296 , G02B27/10 , G02B27/106 , G02B27/12 , H01S5/005 , H01S5/0071 , H01S5/02252 , H01S5/02284 , H01S5/4031 , H01S5/4075
摘要： PROBLEM TO BE SOLVED: To provide a multiplexing device allowing reduction in size of an LD module.SOLUTION: The multiplexing device comprises: an output unit that outputs a beam flux including a plurality of laser beams aligned in an F-axis direction; an F-axis condenser lens that converges the beam flux outputted from the output unit in the F-axis direction. The optical axes of the respective laser beams composing the beam flux outputted from the output unit intersect with each other at one point without using the F-axis condenser lens.
摘要翻译：要解决的问题：提供一种允许LD模块尺寸减小的多路复用装置。解决方案：多路复用装置包括：输出单元，其输出包括沿F轴方向排列的多个激光束的光束; F轴聚光透镜，其将从输出单元输出的光束在F轴方向收敛。构成从输出单元输出的光束通量的各激光的光轴在不使用F轴聚光透镜的情况下在一点相交。

7. 发明专利

JP2013004752A Laser module 审中-公开
标题翻译：激光模块
公开(公告)号：JP2013004752A
公开(公告)日：2013-01-07
申请号：JP2011134550
申请日：2011-06-16
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： TOYOHARA NOZOMI , SAKAMOTO AKIRA , KASAI YOHEI
IPC分类号： H01S5/022
CPC分类号： G02B6/4272 , G02B6/4207 , G02B6/4219 , G02B6/4236 , G02B6/4238 , G02B6/4246 , G02B6/4248 , G02B6/4257 , G02B6/426 , G02B6/4265 , G02B6/4267 , H01L2224/48091 , H01L2224/49175 , H01S5/02208 , H01S5/02236 , H01S5/02272 , H01S5/02284 , H01S5/02476 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To realize a highly reliable laser module which does not cause problems such as the deviation of the position of a laser light source and the destruction of solder.SOLUTION: A semiconductor laser module 1 includes: a laser mount 31 on which a semiconductor laser chip 32 is placed; a fiber mount 40 on which an optical fiber 2 is placed; a sub-mount 20 on which both the laser mount 31 and the fiber mount 40 are placed; and a substrate 10 on which the sub-mount 20 is placed. Protruding parts 11a to 11d are formed on an upper surface of the substrate 10, and the sub-mount 20 is joined to the substrate 10 by soft solder 61 spreading between the sub-mount 20 and the substrate 10.
摘要翻译：要解决的问题：为了实现不会引起激光光源的位置的偏离和焊料的破坏等问题的高可靠性的激光模块。解决方案：半导体激光器模块1包括：放置半导体激光器芯片32的激光器安装件31; 放置有光纤2的光纤安装座40; 在其上放置激光器安装件31和光纤安装座40的子安装件20; 以及其上放置有副安装座20的基板10。突出部分11a至11d形成在基板10的上表面上，并且子安装件20通过在辅助安装件20和基板10之间扩展的软焊料61接合到基板10上。 C）2013，JPO＆INPIT

8. 发明专利

JP2013004751A Bonding method and manufacturing method 有权
标题翻译：结合方法和制造方法
公开(公告)号：JP2013004751A
公开(公告)日：2013-01-07
申请号：JP2011134549
申请日：2011-06-16
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： TOYOHARA NOZOMI , SAKAMOTO AKIRA , KASAI YOHEI
IPC分类号： H01L21/52 , B23K35/26 , C22C5/02 , C22C13/00 , H01S5/022
CPC分类号： B23K1/00 , B23K35/26 , B23K35/262 , B23K35/30 , B23K35/3013 , C22C5/02 , C22C13/00 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/03444 , H01L2224/0346 , H01L2224/04026 , H01L2224/05568 , H01L2224/05644 , H01L2224/29111 , H01L2224/32225 , H01L2224/75251 , H01L2224/83101 , H01L2224/83193 , H01L2224/83805 , H01L2224/83825 , H01L2924/00014 , H01L2924/01322 , H01L2924/12042 , H01L2924/351 , H01S5/02208 , H01S5/02272 , H01S5/02284 , H01S5/02476 , H05K3/3463 , H01L2924/01079 , H01L2924/00012 , H01L2224/05552 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a bonding method capable of using an Au-Sn90% solder of low melting point as a hard solder after bonding, in order to achieve a highly reliable laser module in which the position of a laser light source is not deviated nor the solder is destroyed.SOLUTION: In the bonding method for bonding two members A and B with an Au-Sn solder, the wt.% density of Sn in the Au-Sn solder S' after bonding is 38.0-82.3%.
摘要翻译：要解决的问题：为了提供一种能够在接合之后使用低熔点的Au-Sn90％焊料作为硬焊料的接合方法，以便实现高可靠性的激光模块，其中激光的位置源不会偏离，也不会损坏焊料。解决方案：在使用Au-Sn焊料将两个元件A和B接合的接合方法中，接合后的Au-Sn焊料S'中Sn的重量％密度为38.0-82.3％。版权所有（C）2013，JPO＆INPIT

9. 发明专利

JP2012255846A Optical fiber fixing method and manufacturing method of laser module 有权
标题翻译：激光模块的光纤固定方法和制造方法
公开(公告)号：JP2012255846A
公开(公告)日：2012-12-27
申请号：JP2011127681
申请日：2011-06-07
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： KASAI YOHEI
IPC分类号： G02B6/42 , B23K1/00 , B23K1/005 , B23K3/06 , B23K101/36 , H01S5/022
CPC分类号： G02B6/4238 , B23K1/0016 , B23K1/0056 , B23K3/0623 , B23K2201/38 , H01L2224/49175 , H01S5/02208 , H01S5/02284
摘要： PROBLEM TO BE SOLVED: To perform fixation by soldering with high reliability while suppressing cost.SOLUTION: An optical fiber fixing method related to the present invention includes: a holding step S101 of holding an optical fiber 101 along a top surface of an optical fiber mount 102; a mounting step S102 of mounting a solder preform 103 made of flux-less solder on the top surface of the optical fiber mount 102; and a melting step S103 of irradiating a laser beam irradiation region 102b on the optical fiber mount 102 with a laser beam and of melting the solder preform 103 by means of thermal conduction from the laser beam irradiation region 102b. The solder preform 103 is positioned aside the optical fiber 101 and satisfies an expression: H+D
摘要翻译：要解决的问题：在抑制成本的同时以高可靠性进行焊接进行固定。解决方案：本发明的光纤固定方法包括：保持步骤S101，沿着光纤安装座102的上表面保持光纤101; 将由无焊剂焊料制成的焊料预成型件103安装在光纤安装架102的上表面上的安装步骤S102; 以及熔融步骤S103，其用激光束照射在光纤安装件102上的激光束照射区域102b，并且通过来自激光束照射区域102b的热传导来熔化焊料预制件103。焊料预成型件103位于光纤101的一侧，满足以下表达式：H + D

10. 发明专利

JP2012133064A Method of manufacturing optical module 有权
标题翻译：制造光学模块的方法
公开(公告)号：JP2012133064A
公开(公告)日：2012-07-12
申请号：JP2010284077
申请日：2010-12-21
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： KASAI YOHEI
IPC分类号： G02B6/42
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing an optical module, which is capable of properly fixing an optical fiber on a fiber mount and of preventing an optical module from being damaged by heat due to light leakage.SOLUTION: The method of manufacturing an optical module 1 includes: an arranging step P2 of arranging an optical fiber 10 having a metalized layer covered with a metalized layer 15 of which the surface a solder 20 is deposited on at least partially, on a fiber mount 30 where a bonding pad 31 having solder deposited thereon is formed, so that the metalized region protrudes from the bonding pad 31 in a lengthwise direction of the optical fiber 10, and of arranging the solder 20 on the bonding pad 31; a soldering step of fusing the solder 20 to deposit the solder 20 on the fiber mount 30 and the metalized region; and a solder-erosion step of causing the solder 20 to erode a part not covered with the solder 20 of the metalized region.
摘要翻译：要解决的问题：提供一种制造光学模块的方法，该方法能够将光纤适当地固定在光纤安装座上，并防止光学模块由于漏光而被热量损坏。解决方案：制造光学模块1的方法包括：布置步骤P2，其布置具有金属化层的光纤10，金属化层覆盖有金属化层15，金属化层15至少部分地沉积有焊料20的表面，在其上形成有焊料沉积在其上的接合焊盘31的光纤安装件30，使得金属化区域沿着光纤10的长度方向从接合焊盘31突出，并且将焊料20布置在接合焊盘31上; 熔接焊料20以将焊料20沉积在光纤安装座30和金属化区域上的焊接步骤; 以及使焊料20侵蚀未被金属化区域的焊料20覆盖的部分的焊锡侵蚀工序。版权所有（C）2012，JPO＆INPIT

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