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    • 5. 发明申请
    • Manufacturing Method of an Array Substrate
    • 阵列基板的制造方法
    • US20150348999A1
    • 2015-12-03
    • US14519480
    • 2014-10-21
    • BOE TECHNOLOGY GROUP CO., LTD.BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
    • Huibin GUOShoukun WANGXiaowei LIUYuchun FENGZongjie GUO
    • H01L27/12H01L29/45H01L29/49
    • H01L27/1262H01L27/1288H01L29/458H01L29/4908
    • Provided is a manufacturing method of an array substrate with an etching stop layer. The method includes: forming a pattern including a gate, a gate line and a common electrode line on a substrate through a first patterning process; forming a gate insulation layer, an active layer film and an etching stop layer through a second patterning process; wherein, the etching stop layer corresponds to a gap between a source and a drain which are to be formed, and a via hole exposing the common electrode line is formed above the common electrode line; forming at least an active layer, a pattern including source, drain and data line and a protection layer through a third patterning process; wherein, the protection layer exposes a part of the drain; and forming at least a pixel electrode through a fourth patterning process; wherein, the pixel electrode is electrically connected with the drain.
    • 提供了具有蚀刻停止层的阵列基板的制造方法。 该方法包括:通过第一图案化工艺在衬底上形成包括栅极,栅极线和公共电极线的图案; 通过第二图案化工艺形成栅极绝缘层,有源层膜和蚀刻停止层; 其中,所述蚀刻停止层对应于要形成的源极和漏极之间的间隙,并且在所述公共电极线上方形成暴露所述公共电极线的通孔; 通过第三图案化工艺形成至少有源层,包括源极,漏极和数据线的图案和保护层; 其中,所述保护层暴露所述漏极的一部分; 以及通过第四图案化工艺形成至少一个像素电极; 其中,像素电极与漏极电连接。
    • 7. 发明申请
    • Dry Etching Method
    • 干法蚀刻法
    • US20150311039A1
    • 2015-10-29
    • US14447915
    • 2014-07-31
    • BOE TECHNOLOGY GROUP CO., LTD.BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
    • Xiangqian DINGYao LIUXi CHENLiangliang LIJinchao BAIXiaowei LIU
    • H01J37/32
    • H01J37/32082H01J37/3244H01J2237/334H01L21/31116
    • The present invention discloses a dry etching method. The dry etching method comprises: etching a first medium layer; introducing a second reaction gas in a reaction chamber, and exciting the second reaction gas into plasmas with a second radiofrequency power, so that the plasmas formed from the second reaction gas are combined with particulate pollutants in the reaction chamber, and in this case the reaction chamber is vacuumized to perform conversion processing; and etching a second medium layer. The technical solution of the present invention is capable of effectively preventing particulate pollutants from falling onto the glass substrate in the procedure of executing conversion processing, meanwhile, the effect of chamber purifying through vacuumizing is improved, and the amount of the particulate pollutants in the reaction chamber is effectively reduced.
    • 本发明公开了一种干式蚀刻方法。 干蚀刻方法包括:蚀刻第一介质层; 在反应室中引入第二反应气体,并以第二射频功率将第二反应气体激发成等离子体,使得由第二反应气体形成的等离子体与反应室中的颗粒污染物组合,在这种情况下反应 真空室进行转化处理; 并蚀刻第二介质层。 本发明的技术方案在执行转化处理的过程中能够有效地防止颗粒污染物落入玻璃基板上,同时通过真空度提高室内净化的效果,反应中颗粒污染物的量 室被有效地减少。