专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08915489B2 Method for producing a flexible circuit configuration 有权
标题翻译：柔性电路结构的制造方法
公开(公告)号：US08915489B2
公开(公告)日：2014-12-23
申请号：US13859171
申请日：2013-04-09
申请人： Cicor Management AG
发明人： Ernst Feurer , Bruno Holli , Alexander Kaiser , Karin Ruess
IPC分类号： H01L21/687 , H05K3/00
CPC分类号： H05K3/00 , H05K3/007 , H05K2201/0154 , H05K2203/0169 , H05K2203/0271 , Y10S269/90 , Y10S269/903
摘要： A method is specified for the production of a flexible circuit configuration, which allows the manufacturing of such flexible circuits on a carrier film cost-effectively and with high precision. For this purpose, the carrier film is fastened at the beginning of the method on a rigid frame, which encloses an inner area, and spans the inner area using an inner surface. After finishing of a layer structure and optionally additional method steps, structures for flexible circuit configurations which are created over the inner surface may be cut out easily by cutting the flexible circuit configurations out of the inner surface as a cutout. Through the fastening of the carrier film on the frame, it is ensured during the various method steps of the production of the flexible circuit configuration that the carrier film, which is flexible per se, always forms a level foundation for the various method measures, in particular the photolithographic structuring of layers of a layer structure.
摘要翻译：规定了用于生产柔性电路配置的方法，其允许以高精度和高精度地在载体膜上制造这种柔性电路。为此目的，载体膜在方法开始时被紧固在刚性框架上，刚性框架包围内部区域，并且使用内表面跨越内部区域。在完成层结构和可选地附加的方法步骤之后，可以通过将柔性电路配置从内表面切割为切口来容易地切割在内表面上形成的用于柔性电路配置的结构。通过将载体膜紧固在框架上，在制造柔性电路结构的各种方法步骤期间确保了柔性本身的载体膜总是形成用于各种方法措施的水平基础特别是层结构的层的光刻结构。

2. 发明申请

US20130263780A1 METHOD FOR PRODUCING A FLEXIBLE CIRCUIT CONFIGURATION 审中-公开
标题翻译：生产柔性电路配置的方法
公开(公告)号：US20130263780A1
公开(公告)日：2013-10-10
申请号：US13859171
申请日：2013-04-09
申请人： Cicor Management AG
发明人： Ernst Feurer , Bruno Holl , Alexander Kaiser , Karin Ruess
IPC分类号： H05K3/00
CPC分类号： H05K3/00 , H05K3/007 , H05K2201/0154 , H05K2203/0169 , H05K2203/0271 , Y10S269/90 , Y10S269/903
摘要： A method is specified for the production of a flexible circuit configuration, which allows the manufacturing of such flexible circuits on a carrier film cost-effectively and with high precision. For this purpose, the carrier film is fastened at the beginning of the method on a rigid frame, which encloses an inner area, and spans the inner area using an inner surface. After finishing of a layer structure and optionally additional method steps, structures for flexible circuit configurations which are created over the inner surface may be cut out easily by cutting the flexible circuit configurations out of the inner surface as a cutout. Through the fastening of the carrier film on the frame, it is ensured during the various method steps of the production of the flexible circuit configuration that the carrier film, which is flexible per se, always forms a level foundation for the various method measures, in particular the photolithographic structuring of layers of a layer structure.
摘要翻译：规定了用于生产柔性电路配置的方法，其允许以高精度和高精度地在载体膜上制造这种柔性电路。为此目的，载体膜在方法开始时被紧固在刚性框架上，刚性框架包围内部区域，并且使用内表面跨越内部区域。在完成层结构和可选地附加的方法步骤之后，可以通过将柔性电路配置从内表面切割为切口来容易地切割在内表面上形成的用于柔性电路配置的结构。通过将载体膜紧固在框架上，在制造柔性电路结构的各种方法步骤期间确保了柔性本身的载体膜总是形成用于各种方法措施的水平基础特别是层结构的层的光刻结构。

3. 发明申请

US20150289373A1 METHOD FOR PRODUCING A FLEXIBLE CIRCUIT CONFIGURATION, FLEXIBLE CIRCUIT CONFIGURATION, AND ELECTRICAL CIRCUIT CONFIGURATION HAVING SUCH A FLEXIBLE CIRCUIT CONFIGURATION 审中-公开
标题翻译：用于制造柔性电路配置，灵活电路配置的方法和具有这种灵活电路配置的电气电路配置
公开(公告)号：US20150289373A1
公开(公告)日：2015-10-08
申请号：US14687644
申请日：2015-04-15
申请人： Cicor Management AG
发明人： Ernst Feurer , Bruno Holli , Alexander Kaiser , Karin Ruess
IPC分类号： H05K1/11
CPC分类号： H05K1/115 , H05K1/0393 , H05K3/0035 , H05K3/0052 , H05K3/0097 , H05K3/421 , Y10T29/49124 , Y10T29/49128 , Y10T29/49165
摘要： For the production of a flexible circuit configuration, which contains a layer sequence and a film connected thereto, for the creation of through contacts through the film up to terminal surfaces of the layer sequence, it is proposed that the film be connected unstructured to the layer sequence provided in a defined position on the substrate and then, while the composite of layer sequence and film remains on the substrate, perforations be created through the film up to terminal surfaces of a conductive layer of the layer sequence and contact metal be deposited in structured form on the film and in the perforations as through contacts.
摘要翻译：为了生产包含层序列和连接到其上的膜的柔性电路配置，为了通过膜到达层序列的端子表面产生通过触点的通孔，建议将膜非结构化地连接到层序列提供在衬底上的限定位置，然后当层序列和膜的复合物保留在衬底上时，通过膜形成通孔，直到层序列的导电层的端子表面，并将接触金属沉积在结构化在电影和穿孔中形成通过接触。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式