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    • 6. 发明申请
    • Small form factor liquid loop cooling system
    • 小尺寸液环冷却系统
    • US20050259397A1
    • 2005-11-24
    • US10849759
    • 2004-05-21
    • Cullen BashGlenn SimonChristopher MaloneRatnesh Sharma
    • Cullen BashGlenn SimonChristopher MaloneRatnesh Sharma
    • G06F1/20H05K7/20
    • G06F1/20G06F2200/201H05K7/20009H05K7/20727H05K7/20772
    • An enclosure forms a plurality of tiers vertically stacked in a longitudinal dimension. Each tier is a 1U modular computer system having a computer chassis configured for mounting in the multi-tiered support, and computer components that need cooling within the computer chassis. A cold plate is in thermal communication with at least one of the computer components, and convectively removes heat from that component using a liquid coolant. A heat exchanger dissipates heat from the liquid coolant, and provides liquid coolant back to the cold plate. An air mover within the chassis cools the heat exchanger, blows air across other components needing cooling, and removes heated air from the chassis. The air mover may extend substantially across the chassis, or it may blow crosswise from an outlet-ventilating direction.
    • 外壳形成在纵向尺寸上垂直堆叠的多个层。 每个层是1U模块化计算机系统,其具有配置成安装在多层支持中的计算机机箱以及需要在计算机机箱内进行冷却的计算机组件。 冷板与至少一个计算机部件热连通,并且使用液体冷却剂对流地从该部件移除热量。 热交换器从液体冷却剂中散热,并向冷板提供液体冷却剂。 底盘内的空气推动器冷却热交换器,将空气吹过需要冷却的其他部件,并从机箱中除去加热的空气。 空气推动器可以基本上延伸穿过底盘,或者可以从出口通风方向横向吹动。