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    • 2. 发明授权
    • Speaker module and electronic apparatus thereof
    • 扬声器模块及其电子设备
    • US08654968B2
    • 2014-02-18
    • US13361961
    • 2012-01-31
    • Ching-Chia MaiKuan-Hsueh TsengCheng-Han LeeChih-Ming Wang
    • Ching-Chia MaiKuan-Hsueh TsengCheng-Han LeeChih-Ming Wang
    • H04M1/00
    • H01Q1/243H01Q1/44H04R1/028H04R2420/07H04R2499/11H04R2499/15
    • A speaker module for installing on an electronic device is disclosed. The speaker module includes a containing casing, a speaker device, an antenna, at least one audio signal transmitting member, and at least one antenna signal transmitting member. The containing casing has at least one hole formed thereon. The speaker device is disposed in the containing casing and outputs sound via the hole. The antenna is formed integrally with the containing casing along the contour of the containing casing. The audio signal transmitting member is electrically connected to the speaker device for electrically connecting to the electronic device, so as to establish audio signal transmission between the speaker device and the electronic device. The antenna signal transmitting member is electrically connected to the antenna for electrically connecting to the electronic device, so as to establish antenna signal transmission between the antenna and the electronic device.
    • 公开了一种用于安装在电子设备上的扬声器模块。 扬声器模块包括容纳壳体,扬声器装置,天线,至少一个音频信号发送构件和至少一个天线信号发送构件。 容纳壳体具有形成在其上的至少一个孔。 扬声器装置设置在容纳壳体中并通过孔输出声音。 天线与容纳壳体沿容纳壳体的轮廓一体形成。 音频信号发送构件电连接到扬声器装置,用于电连接到电子装置,以便在扬声器装置和电子装置之间建立音频信号传输。 天线信号发送部件电连接到天线,用于电连接到电子设备,以便在天线和电子设备之间建立天线信号传输。
    • 3. 发明申请
    • SPEAKER MODULE AND ELECTRONIC APPARATUS THEREOF
    • 扬声器模块及其电子设备
    • US20130070952A1
    • 2013-03-21
    • US13361961
    • 2012-01-31
    • Ching-Chia MaiKuan-Hsueh TsengCheng-Han LeeChih-Ming Wang
    • Ching-Chia MaiKuan-Hsueh TsengCheng-Han LeeChih-Ming Wang
    • H04R1/02
    • H01Q1/243H01Q1/44H04R1/028H04R2420/07H04R2499/11H04R2499/15
    • A speaker module for installing on an electronic device is disclosed. The speaker module includes a containing casing, a speaker device, an antenna, at least one audio signal transmitting member, and at least one antenna signal transmitting member. The containing casing has at least one hole formed thereon. The speaker device is disposed in the containing casing and outputs sound via the hole. The antenna is formed integrally with the containing casing along the contour of the containing casing. The audio signal transmitting member is electrically connected to the speaker device for electrically connecting to the electronic device, so as to establish audio signal transmission between the speaker device and the electronic device. The antenna signal transmitting member is electrically connected to the antenna for electrically connecting to the electronic device, so as to establish antenna signal transmission between the antenna and the electronic device.
    • 公开了一种用于安装在电子设备上的扬声器模块。 扬声器模块包括容纳壳体,扬声器装置,天线,至少一个音频信号发送构件和至少一个天线信号发送构件。 容纳壳体具有形成在其上的至少一个孔。 扬声器装置设置在容纳壳体中并通过孔输出声音。 天线与容纳壳体沿容纳壳体的轮廓一体形成。 音频信号发送构件电连接到扬声器装置,用于电连接到电子装置,以便在扬声器装置和电子装置之间建立音频信号传输。 天线信号发送部件电连接到天线,用于电连接到电子设备,以便在天线和电子设备之间建立天线信号传输。
    • 4. 发明申请
    • Wide-Band Antenna and Manufacturing Method Thereof
    • 宽带天线及其制造方法
    • US20100039329A1
    • 2010-02-18
    • US12469221
    • 2009-05-20
    • Yean-Cheng ChenChih-Ming WangKuan-Hsueh Tseng
    • Yean-Cheng ChenChih-Ming WangKuan-Hsueh Tseng
    • H01Q1/38H01P11/00
    • H01Q1/38H01Q9/42Y10T29/49016
    • A wide-band antenna and a manufacturing method thereof are provided. The wide-band antenna includes a substrate, a first radiator, a second radiator, a grounding portion, and a signal feeding portion. The first radiator is disposed on a first surface of the substrate while the second radiator is disposed on the first surface or a second surface opposite to the first surface. The first radiator and the second radiator are spaced apart by a predetermined distance. The grounding portion is disposed on the substrate to couple with the second radiator. The signal feeding portion has a coupling unit disposed on the second surface and at least partially overlapping the first radiator. The signal feeding portion is coupled with the grounding portion and feeds signals to excite the first radiator to form a first band mode through coupling effect by the coupling unit. The first radiator feeds signals to excite the second radiator to form a second band mode by coupling effect.
    • 提供了一种宽带天线及其制造方法。 宽带天线包括基板,第一散热器,第二散热器,接地部分和信号馈送部分。 第一散热器设置在基板的第一表面上,而第二散热器设置在与第一表面相对的第一表面或第二表面上。 第一散热器和第二散热器间隔开预定距离。 接地部设置在基板上以与第二散热器连接。 信号馈送部分具有设置在第二表面上并且至少部分地与第一辐射体重叠的耦合单元。 信号馈送部分与接地部分耦合并且馈送信号以激励第一辐射器,以通过耦合单元的耦合效应形成第一频带模式。 第一辐射器馈送信号以激励第二辐射器以通过耦合效应形成第二频带模式。
    • 5. 发明授权
    • Wide-band antenna and manufacturing method thereof
    • 宽带天线及其制造方法
    • US07956812B2
    • 2011-06-07
    • US12469221
    • 2009-05-20
    • Yean-Cheng ChenChih-Ming WangKuan-Hsueh Tseng
    • Yean-Cheng ChenChih-Ming WangKuan-Hsueh Tseng
    • H01Q1/38
    • H01Q1/38H01Q9/42Y10T29/49016
    • A wide-band antenna and a manufacturing method thereof are provided. The wide-band antenna includes a substrate, a first radiator, a second radiator, a grounding portion, and a signal feeding portion. The first radiator is disposed on a first surface of the substrate while the second radiator is disposed on the first surface or a second surface opposite to the first surface. The first radiator and the second radiator are spaced apart by a predetermined distance. The grounding portion is disposed on the substrate to couple with the second radiator. The signal feeding portion has a coupling unit disposed on the second surface and at least partially overlapping the first radiator. The signal feeding portion is coupled with the grounding portion and feeds signals to excite the first radiator to form a first band mode through coupling effect by the coupling unit. The first radiator feeds signals to excite the second radiator to form a second band mode by coupling effect.
    • 提供了一种宽带天线及其制造方法。 宽带天线包括基板,第一散热器,第二散热器,接地部分和信号馈送部分。 第一散热器设置在基板的第一表面上,而第二散热器设置在与第一表面相对的第一表面或第二表面上。 第一散热器和第二散热器间隔开预定距离。 接地部设置在基板上以与第二散热器连接。 信号馈送部分具有设置在第二表面上并且至少部分地与第一辐射体重叠的耦合单元。 信号馈送部分与接地部分耦合并且馈送信号以激励第一辐射器,以通过耦合单元的耦合效应形成第一频带模式。 第一辐射器馈送信号以激励第二辐射器以通过耦合效应形成第二频带模式。
    • 6. 发明授权
    • Wide-band planar antenna
    • 宽带平面天线
    • US08134517B2
    • 2012-03-13
    • US12567417
    • 2009-09-25
    • Chih-Ming WangShang-Ching Tseng
    • Chih-Ming WangShang-Ching Tseng
    • H01Q1/48
    • H01Q1/243H01Q5/371H01Q5/378H01Q9/42
    • The invention relates to a wide-band planar antenna. The wide-band planar antenna includes a substrate, a first radiator, a second radiator, a third radiator, a ground, and a signal source. The first radiator, the second radiator, and the third radiator are designed in a manner that the antenna of the invention can be applied to WiMAX communication devices. Besides, the wide-band planar antenna of the invention is more efficient than a general wide-band antenna and saves a significant amount of electrical power, and therefore, the antenna is particularly suitable for portable communicational devices.
    • 本发明涉及一种宽带平面天线。 宽带平面天线包括衬底,第一辐射器,第二辐射器,第三辐射器,接地和信号源。 第一辐射器,第二辐射器和第三辐射器以本发明的天线可以应用于WiMAX通信设备的方式设计。 此外,本发明的宽带平面天线比一般的宽带天线更有效,并且节省了大量的电力,因此,天线特别适合于便携式通信装置。
    • 10. 发明授权
    • Method for forming semiconductor structure and method for forming memory using the same
    • 用于形成半导体结构的方法和使用其形成存储器的方法
    • US08383480B1
    • 2013-02-26
    • US13295191
    • 2011-11-14
    • Chih-Ming WangPing-Chia ShihChi-Cheng HuangHsiang-Chen LeeChih-Hung Lin
    • Chih-Ming WangPing-Chia ShihChi-Cheng HuangHsiang-Chen LeeChih-Hung Lin
    • H01L21/336
    • H01L29/4234H01L21/28282H01L29/66833H01L29/792
    • A method for forming a semiconductor structure includes following steps. A substrate structure is provided. The substrate structure includes a semiconductor substrate, a first oxide-nitride-oxide (ONO) layer, and a second ONO layer. The semiconductor substrate has first and second surfaces opposite to each other. The first ONO layer includes a first oxide layer, a first nitride layer and a second oxide layer formed on the first surface in sequence. The second ONO layer includes a third oxide layer, a second nitride layer and a fourth oxide layer formed on the second surface in sequence. A nitride mask layer is formed on the first ONO layer. The fourth oxide layer is removed. The second nitride layer and the nitride mask layer are removed. The second oxide layer and the third oxide layer are removed. A fifth oxide layer is formed on the first nitride layer.
    • 一种形成半导体结构的方法包括以下步骤。 提供了基板结构。 衬底结构包括半导体衬底,第一氧化物 - 氧化物 - 氧化物(ONO)层和第二ONO层。 半导体衬底具有彼此相对的第一和第二表面。 第一ONO层包括顺序地形成在第一表面上的第一氧化物层,第一氮化物层和第二氧化物层。 第二ONO层包括依次形成在第二表面上的第三氧化物层,第二氮化物层和第四氧化物层。 在第一ONO层上形成氮化物掩模层。 去除第四氧化物层。 去除第二氮化物层和氮化物掩模层。 去除第二氧化物层和第三氧化物层。 在第一氮化物层上形成第五氧化物层。