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1. 发明申请

US20130163922A1 LIGHT-GUIDING COVER STRUCTURE 有权
标题翻译：导光罩结构
公开(公告)号：US20130163922A1
公开(公告)日：2013-06-27
申请号：US13425829
申请日：2012-03-21
申请人： BILY WANG , KUEI-PAO CHEN , HSIN-CHENG CHEN , CHENG-CHIN CHIU
发明人： BILY WANG , KUEI-PAO CHEN , HSIN-CHENG CHEN , CHENG-CHIN CHIU
IPC分类号： G02B6/42
CPC分类号： G02B6/4298 , G01J2001/4252 , G01R31/2635 , G02B6/3616 , G02B6/3644
摘要： A light-guiding cover structure includes a top cover unit and a light-guiding unit. The top cover unit has a plurality of receiving spaces formed therein. The light-guiding unit includes a plurality of light-guiding groups, wherein each light-guiding group includes a plurality of optical fiber cables received in the corresponding receiving space, and each optical fiber cable has two opposite ends exposed from the bottom surface of the top cover unit and respectively facing at least one light-emitting device and at least one light-sensing device that have been disposed under the top cover unit. Therefore, the optical fiber cables received in the corresponding receiving space, thus when the light-guiding cover structure is applied to the LED package chip classification system, the aspect of the LED package chip classification system can be enhanced.
摘要翻译：导光罩结构包括顶盖单元和导光单元。顶盖单元具有形成在其中的多个接收空间。导光单元包括多个导光组，其中每个导光组包括容纳在相应接收空间中的多根光纤电缆，并且每根光纤电缆具有两个相对端从第并且分别面向至少一个发光装置和已经设置在顶盖单元下的至少一个光感测装置。因此，光纤电缆在相应的接收空间中被接收，因此当导光盖结构被应用于LED封装芯片分类系统时，可以提高LED封装芯片分类系统的方面。

2. 发明申请

US20130015372A1 LIGHT-EMITTING ELEMENT DETECTION AND CLASSIFICATION DEVICE 有权
标题翻译：发光元件检测和分类装置
公开(公告)号：US20130015372A1
公开(公告)日：2013-01-17
申请号：US13182425
申请日：2011-07-13
申请人： BILY WANG , KUEI-PAO CHEN , HSIN-CHENG CHEN
发明人： BILY WANG , KUEI-PAO CHEN , HSIN-CHENG CHEN
IPC分类号： G01N21/01
CPC分类号： G01R31/01 , G01R31/2635
摘要： A light-emitting element detection and classification device includes a rotation unit for transporting a plurality of light-emitting elements, a chip detection unit, and a chip classification unit. The rotation unit includes at least one rotary turntable, a plurality of receiving portions formed on the rotary turntable, and a plurality of suction-exhaust dual-purpose openings respectively disposed in the receiving portions, each receiving portion selectively receives at least one of the light-emitting elements. Each light-emitting element is an LED package chip having a positive electrode pad and a negative electrode pad disposed on the bottom side thereof. The chip detection unit includes at least one chip detection module adjacent to the rotation unit for detecting each light-emitting element. The chip classification unit includes at least one chip classification module adjacent to the rotation unit for classifying the LED package chips that have been detected by the at least one chip detection module.
摘要翻译：发光元件检测和分类装置包括用于传送多个发光元件的旋转单元，芯片检测单元和芯片分类单元。旋转单元包括至少一个旋转转盘，形成在旋转转台上的多个接收部分和分别设置在接收部分中的多个吸排二重用开口，每个接收部分选择性地接收至少一个光 - 发行元素。每个发光元件是具有设置在其底侧上的正极焊盘和负极焊盘的LED封装芯片。芯片检测单元包括与用于检测每个发光元件的旋转单元相邻的至少一个芯片检测模块。芯片分类单元包括与旋转单元相邻的至少一个芯片分类模块，用于对由至少一个芯片检测模块检测到的LED封装芯片进行分类。

3. 发明申请

US20120249156A1 MULTI-TRACK DETECTION SYSTEM FOR DETECTING THE APPEARANCE OF ELECTRONIC ELEMENTS 有权
标题翻译：用于检测电子元件外观的多路检测系统
公开(公告)号：US20120249156A1
公开(公告)日：2012-10-04
申请号：US13169086
申请日：2011-06-27
申请人： BILY WANG , KUEI-PAO CHEN , HSIN-CHENG CHEN , REN-CHUN NI
发明人： BILY WANG , KUEI-PAO CHEN , HSIN-CHENG CHEN , REN-CHUN NI
IPC分类号： G01R31/02
CPC分类号： H01L21/67271 , G01R31/2893
摘要： A multi-track detection system for detecting the appearance of electronic elements includes a rotary module, a feeding module, an unvibrated module, a detection module, and a classification module. The rotary module includes a hollow transparent rotary structure having at least two annular guiding areas on the top surface thereof, and the electronic elements are sequentially arranged on the two annular guiding area. The feeding module has two V-shaped feeding grooves for guiding the electronic elements. The unvibrated module includes an unvibrated guiding block having two V-shaped unvibrated guiding grooves respectively communicated with the two V-shaped feeding grooves and respectively corresponding to the two annular guiding areas. The electronic elements on the V-shaped feeding grooves are sequentially transmitted onto the two annular guiding areas through two V-shaped unvibrated guiding grooves, thus each electronic element can be detected by the detection module and classified by the classification module, respectively.
摘要翻译：用于检测电子元件外观的多轨道检测系统包括旋转模块，馈送模块，非校准模块，检测模块和分类模块。旋转模块包括中空透明旋转结构，其在其顶表面上具有至少两个环形引导区域，并且电子元件依次布置在两个环形引导区域上。馈送模块具有用于引导电子元件的两个V形馈电槽。未经校准的模块包括具有分别与两个V形供给槽连通且分别对应于两个环形导向区域的两个V形未经校准的引导槽的未经校准的引导块。 V形供给槽上的电子元件通过两个V形的未经校准的导向槽依次传送到两个环形引导区域，因此每个电子元件可被检测模块分别检测并由分类模块分类。

4. 发明申请

US20120285869A1 LED PACKAGE CHIP CLASSIFICATION SYSTEM 有权
标题翻译： LED包装芯片分类系统
公开(公告)号：US20120285869A1
公开(公告)日：2012-11-15
申请号：US13204616
申请日：2011-08-05
申请人： BILY WANG , KUEI-PAO CHEN , HSIN-CHENG CHEN
发明人： BILY WANG , KUEI-PAO CHEN , HSIN-CHENG CHEN
IPC分类号： B07C5/344
CPC分类号： G01R31/01 , G01R31/2635
摘要： An LED package chip classification system includes a rotation unit for transporting a plurality of LED package chips, a chip test unit, and a chip classification unit. The rotation unit includes a rotary turntable, a plurality of receiving portions formed on the rotary turntable, and a plurality of suction-exhaust dual-purpose openings respectively disposed in the receiving portions. Each LED package chip has a positive electrode pad and a negative electrode pad disposed on the bottom side thereof The chip test unit includes a chip test module adjacent to the rotation unit for testing each LED package chip. The chip classification unit includes a plurality of chip classification modules adjacent to the rotation unit for classifying the LED package chips. Therefore, the LED package chips can be classified by matching the rotation unit, the chip test unit, and the chip classification unit.
摘要翻译： LED封装芯片分类系统包括用于传输多个LED封装芯片的转动单元，芯片测试单元和芯片分类单元。旋转单元包括旋转转盘，形成在旋转转台上的多个接收部分和分别设置在接收部分中的多个抽吸排气双用途开口。每个LED封装芯片具有设置在其底侧的正极焊盘和负极焊盘。芯片测试单元包括与用于测试每个LED封装芯片的旋转单元相邻的芯片测试模块。芯片分类单元包括与用于分类LED封装芯片的旋转单元相邻的多个芯片分类模块。因此，可以通过匹配旋转单元，芯片测试单元和芯片分类单元来分类LED封装芯片。

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