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1. 发明申请

US20090114885A1 ELECTRICALLY CONDUCTIVE ADHESIVE 有权
标题翻译：电导电胶
公开(公告)号：US20090114885A1
公开(公告)日：2009-05-07
申请号：US12092453
申请日：2006-10-31
申请人： Atsushi Yamaguchi , Hidenori Miyakawa , Takayuki Higuchi , Koso Matsuno , Hideyuki Tsujimura
发明人： Atsushi Yamaguchi , Hidenori Miyakawa , Takayuki Higuchi , Koso Matsuno , Hideyuki Tsujimura
IPC分类号： H01B1/12
CPC分类号： C09J9/02 , H01B1/22 , H05K3/321 , H05K2201/0218 , H05K2201/0272 , H05K2203/0425
摘要： The present invention provides an electrically conductive adhesive which prevents migration and sulfuration of a metal component in electronic component mounting. The electrically conductive adhesive includes a thermosetting resin and metal filler particles dispersed in the thermosetting resin. It is possible to use, as the metal filler particles, metal filler particles having a composition including an alloy of Ag with at least one metal selected from the group consisting of Sn, Cu, In, Bi and Ni, a mixture of such metal filler particles and Ag filler particles, and metal filler particles including Ag filler particles and a coating layer formed on the surface of the Ag filler particles using a metal such as Sn.
摘要翻译：本发明提供一种导电粘合剂，其防止电子部件安装中的金属成分的迁移和硫化。导电粘合剂包括热固性树脂和分散在热固性树脂中的金属填料颗粒。作为金属填料颗粒，可以使用包含Ag合金和至少一种选自Sn，Cu，In，Bi和Ni的金属的组成的金属填料颗粒，将这种金属填料颗粒和Ag填料颗粒，以及包括Ag填料颗粒的金属填料颗粒和使用Sn等金属在Ag填料颗粒的表面上形成的涂层。

2. 发明授权

US07785500B2 Electrically conductive adhesive 有权
标题翻译：导电胶
公开(公告)号：US07785500B2
公开(公告)日：2010-08-31
申请号：US12092453
申请日：2006-10-31
申请人： Atsushi Yamaguchi , Hidenori Miyakawa , Takayuki Higuchi , Koso Matsuno , Hideyuki Tsujimura
发明人： Atsushi Yamaguchi , Hidenori Miyakawa , Takayuki Higuchi , Koso Matsuno , Hideyuki Tsujimura
IPC分类号： H01B1/22 , C09J9/02
CPC分类号： C09J9/02 , H01B1/22 , H05K3/321 , H05K2201/0218 , H05K2201/0272 , H05K2203/0425
摘要： The present invention provides an electrically conductive adhesive which prevents migration and sulfuration of a metal component in electronic component mounting. The electrically conductive adhesive includes a thermosetting resin and metal filler particles dispersed in the thermosetting resin. It is possible to use, as the metal filler particles, metal filler particles having a composition including an alloy of Ag with at least one metal selected from the group consisting of Sn, Cu, In, Bi and Ni, a mixture of such metal filler particles and Ag filler particles, and metal filler particles including Ag filler particles and a coating layer formed on the surface of the Ag filler particles using a metal such as Sn.
摘要翻译：本发明提供一种导电粘合剂，其防止电子部件安装中的金属成分的迁移和硫化。导电粘合剂包括热固性树脂和分散在热固性树脂中的金属填料颗粒。作为金属填料颗粒，可以使用包含Ag合金和至少一种选自Sn，Cu，In，Bi和Ni的金属的组成的金属填料颗粒，将这种金属填料颗粒和Ag填料颗粒，以及包括Ag填料颗粒的金属填料颗粒和使用Sn等金属在Ag填料颗粒的表面上形成的涂层。

3. 发明授权

US08540903B2 Electrically conductive paste, and electrical and electronic device comprising the same 有权
标题翻译：导电膏，以及包含该导电膏的电气和电子设备
公开(公告)号：US08540903B2
公开(公告)日：2013-09-24
申请号：US12744994
申请日：2008-11-21
申请人： Takayuki Higuchi , Hidenori Miyakawa , Atsushi Yamaguchi , Arata Kishi , Naomichi Ohashi
发明人： Takayuki Higuchi , Hidenori Miyakawa , Atsushi Yamaguchi , Arata Kishi , Naomichi Ohashi
IPC分类号： H01B1/02 , H01B1/22 , H01B1/12 , H05K3/20 , H05K3/30 , H05K1/00 , H05K1/18 , H05K7/00
CPC分类号： H05K3/321 , H01B1/22 , H05K2201/0272 , H05K2203/0425 , Y10T29/49128 , Y10T29/4913
摘要： Disclosed is an electrically conductive paste which enables to reduce the level of void growth in a conducting pathway formed in a joint part produced after curing the electrically conductive paste in the implementation of an electronic component on a circuit board by using the electrically conductive paste, and which contains a reduced amount of a viscosity-adjusting/thixotropy-imparting additive. Two Sn-containing low-melting-point alloy particles having different melting points and different average particle diameters are selected as electrically conductive filler components to be used in an electrically conductive paste, and the two alloy particles are mixed at a predetermined ratio for use.
摘要翻译：公开了一种导电性糊剂，其能够通过使用导电性糊料，在电路板的电子部件的实施中使导电性糊剂固化后的接合部形成的导电路径中的空隙生长水平降低，其含有减少量的粘度调节/触变性添加剂。选择具有不同熔点和不同平均粒径的两种含Sn的低熔点合金颗粒作为用于导电浆料的导电填料组分，并将两种合金颗粒以预定的比例混合使用。

4. 发明授权

US08182923B2 Conductive paste and mounting structure using the same 有权
标题翻译：导电胶和使用其的安装结构
公开(公告)号：US08182923B2
公开(公告)日：2012-05-22
申请号：US12427275
申请日：2009-04-21
申请人： Naomichi Ohashi , Hidenori Miyakawa , Atsushi Yamaguchi , Arata Kishi , Takayuki Higuchi
发明人： Naomichi Ohashi , Hidenori Miyakawa , Atsushi Yamaguchi , Arata Kishi , Takayuki Higuchi
IPC分类号： H01B1/22 , B32B15/08
CPC分类号： H01B1/22 , B23K35/025 , B23K35/262 , B23K2101/36 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , H05K3/3484 , H05K2201/0272 , Y10T428/31681 , H01L2224/05599
摘要： A conductive paste includes a filler component and a flux component; the filler component including a first conductive filler and a second conductive filler having different melting points, and the melting point of the first conductive filler being higher than the melting point of the second conductive filler by 20° C. or more; the flux component including a first flux and a second flux having different melting points, the melting point of the first flux being higher than the melting point of the second flux, and the melting point of the first flux being higher than the melting point of the second conductive filler by 15° C. to 45° C.; and the melting point of the second flux being equal to or less than the melting point of the second conductive filler.
摘要翻译：导电浆料包括填料组分和助熔剂组分; 所述填充剂组分包括具有不同熔点的第一导电填料和第二导电填料，并且所述第一导电填料的熔点高于所述第二导电填料的熔点20℃或更高; 所述通量成分包括具有不同熔点的第一助熔剂和第二助熔剂，所述第一焊剂的熔点高于所述第二焊剂的熔点，所述第一焊剂的熔点高于所述熔点第二导电填料15℃至45℃。并且第二通量的熔点等于或小于第二导电填料的熔点。

5. 发明授权

US08012379B2 Electroconductive bonding material and electric/electronic device using the same 失效
标题翻译：导电接合材料和使用其的电气/电子设备
公开(公告)号：US08012379B2
公开(公告)日：2011-09-06
申请号：US12870275
申请日：2010-08-27
申请人： Hidenori Miyakawa , Shigeaki Sakatani , Kumiko Sugiyama , Takayuki Higuchi , Atsushi Yamaguchi
发明人： Hidenori Miyakawa , Shigeaki Sakatani , Kumiko Sugiyama , Takayuki Higuchi , Atsushi Yamaguchi
IPC分类号： H01B1/02 , B05D7/00
CPC分类号： H05K1/095 , C08G59/66 , C08G59/687 , C08K5/37 , C09J163/00 , H01B1/22 , H05K3/321 , H05K3/4069 , H05K2201/0224 , H05K2203/122
摘要： A conductive bonding material having an improved preservation stability, and hardens when desired, preferably immediately hardens at a low temperature is provided. In one invention, the conductive bonding material comprises a conductive particle ingredient, an epoxy resin ingredient, and a hardening agent ingredient for said epoxy resin and the hardening agent ingredient for said epoxy resin further comprise a reforming agent having a thiol group. In another invention, a conductive bonding material comprising an epoxy resin hardening ingredient, wherein said epoxy resin hardening ingredient contains a sulfur-containing compound having an end group which can coordinate with a surface of the metallic particles, and the sulfur-containing compound comes to perform as a hardening agent for the epoxy resin by dissociating from the surface of the metallic particles. The conductive bonding material may contain fragrance.
摘要翻译：提供具有改善的保存稳定性并且当需要时硬化的导电粘合材料优选在低温下立即硬化。在一个发明中，导电接合材料包括导电颗粒成分，环氧树脂成分和用于所述环氧树脂的硬化剂成分和用于所述环氧树脂的硬化剂成分，还包含具有硫醇基的重整剂。在另一发明中，包含环氧树脂硬化成分的导电性接合材料，其中所述环氧树脂硬化成分含有具有可与金属粒子表面配位的端基的含硫化合物，含硫化合物进入通过从金属颗粒的表面离解，作为环氧树脂的硬化剂。导电接合材料可能含有香料。

6. 发明申请

US20100147567A1 Thermosetting Resin Composition, Method of Manufacturing the Same and Circuit Board 审中-公开
标题翻译：热固性树脂组合物及其制造方法和电路板
公开(公告)号：US20100147567A1
公开(公告)日：2010-06-17
申请号：US12226872
申请日：2007-08-28
申请人： Hirohisa Hino , Taro Fukui , Hidenori Miyakawa , Atsushi Yamaguchi , Takayuki Higuchi
发明人： Hirohisa Hino , Taro Fukui , Hidenori Miyakawa , Atsushi Yamaguchi , Takayuki Higuchi
IPC分类号： H05K1/09 , B23K35/34
CPC分类号： C08K13/02 , C08K5/09 , C22C12/00 , C22C28/00 , H05K3/3442 , H05K3/3484 , H05K2201/10636 , H05K2201/10977 , Y02P70/611 , Y10T428/31511 , C08L63/00
摘要： The object of the invention is to provide a thermosetting resin composition which, in packaging an electronic circuit containing components incapable of withstanding elevated temperatures, employs low-melting solder particles, thereby enabling batch ref lowing and enabling packaging of components with excellent strength and toughness.The invention relates to a thermosetting resin composition which includes a metal filler component, a fluxing component and a thermosetting resin binder. The metal filler component includes at least one of bismuth (Bi) and indium (In), and tin (Sn). The fluxing component, which at least one of a compound of structural formula (1) below and a compound of structural formula (2) below, is used. In the above formulas, R1 to R6 are each a hydrogen or alkyl group, and X is an organic group which has a lone electron pair or double bond π electrons and is capable of coordinating with a metal.
摘要翻译：本发明的目的是提供一种热固性树脂组合物，其在包含不能耐高温的组分的电子电路中使用低熔点焊料颗粒，从而能够批量降低并且能够包装具有优异的强度和韧性的组分。本发明涉及包含金属填料组分，助熔组分和热固性树脂粘合剂的热固性树脂组合物。金属填料组分包括铋（Bi）和铟（In）和锡（Sn）中的至少一种。使用以下结构式（1）的化合物和下述结构式（2）的化合物中的至少一种的助熔组分。在上式中，R 1〜R 6各自为氢或烷基，X为具有单电子对或双键的有机基团。电子并且能够与金属配位。

7. 发明申请

US20100316794A1 ELECTROCONDUCTIVE BONDING MATERIAL AND ELECTRIC/ELECTRONIC DEVICE USING THE SAME 失效
标题翻译：电磁接合材料和使用该电极的电子/电子设备
公开(公告)号：US20100316794A1
公开(公告)日：2010-12-16
申请号：US12870275
申请日：2010-08-27
申请人： Hidenori MIYAKAWA , Shigeaki Sakatani , Kumiko Sugiyama , Takayuki Higuchi , Atsushi Yamaguchi
发明人： Hidenori MIYAKAWA , Shigeaki Sakatani , Kumiko Sugiyama , Takayuki Higuchi , Atsushi Yamaguchi
IPC分类号： H05K3/10
CPC分类号： H05K1/095 , C08G59/66 , C08G59/687 , C08K5/37 , C09J163/00 , H01B1/22 , H05K3/321 , H05K3/4069 , H05K2201/0224 , H05K2203/122
摘要： A conductive bonding material having an improved preservation stability, and hardens when desired, preferably immediately hardens at a low temperature is provided. In one invention, the conductive bonding material comprises a conductive particle ingredient, an epoxy resin ingredient, and a hardening agent ingredient for said epoxy resin and the hardening agent ingredient for said epoxy resin further comprise a reforming agent having a thiol group. In another invention, a conductive bonding material comprising an epoxy resin hardening ingredient, wherein said epoxy resin hardening ingredient contains a sulfur-containing compound having an end group which can coordinate with a surface of the metallic particles, and the sulfur-containing compound comes to perform as a hardening agent for the epoxy resin by dissociating from the surface of the metallic particles. The conductive bonding material may contain fragrance.
摘要翻译：提供具有改善的保存稳定性并且当需要时硬化的导电粘合材料优选在低温下立即硬化。在一个发明中，导电接合材料包括导电颗粒成分，环氧树脂成分和用于所述环氧树脂的硬化剂成分和用于所述环氧树脂的硬化剂成分，还包含具有硫醇基的重整剂。在另一发明中，包含环氧树脂硬化成分的导电性接合材料，其中所述环氧树脂硬化成分含有具有可与金属粒子表面配位的端基的含硫化合物，含硫化合物进入通过从金属颗粒的表面离解，作为环氧树脂的硬化剂。导电接合材料可能含有香料。

8. 发明申请

US20090032293A1 Electroconductive Bonding Material and Electric/Electronic Device Using the Same 审中-公开
标题翻译：导电接合材料及使用其的电气/电子设备
公开(公告)号：US20090032293A1
公开(公告)日：2009-02-05
申请号：US11886722
申请日：2006-03-22
申请人： Hidenori Miyakawa , Shigeaki Sakatani , Kumiko Sugiyama , Takayuki Higuchi , Atsushi Yamaguchi
发明人： Hidenori Miyakawa , Shigeaki Sakatani , Kumiko Sugiyama , Takayuki Higuchi , Atsushi Yamaguchi
IPC分类号： H05K1/09 , H01B1/22 , B05D5/12
CPC分类号： H05K1/095 , C08G59/66 , C08G59/687 , C08K5/37 , C09J163/00 , H01B1/22 , H05K3/321 , H05K3/4069 , H05K2201/0224 , H05K2203/122
摘要： A conductive bonding material having an improved preservation stability, and hardens when desired, preferably immediately hardens at a low temperature is provided. In one invention, the conductive bonding material comprises a conductive particle ingredient, an epoxy resin ingredient, and a hardening agent ingredient for said epoxy resin and the hardening agent ingredient for said epoxy resin further comprise a reforming agent having a thiol group. In another invention, a conductive bonding material comprising an epoxy resin hardening ingredient, wherein said epoxy resin hardening ingredient contains a sulfur-containing compound having an end group which can coordinate with a surface of the metallic particles, and the sulfur-containing compound comes to perform as a hardening agent for the epoxy resin by dissociating from the surface of the metallic particles. The conductive bonding material may contain fragrance.
摘要翻译：提供具有改善的保存稳定性并且当需要时硬化的导电粘合材料优选在低温下立即硬化。在一个发明中，导电接合材料包括导电颗粒成分，环氧树脂成分和用于所述环氧树脂的硬化剂成分和用于所述环氧树脂的硬化剂成分，还包含具有硫醇基的重整剂。在另一发明中，包含环氧树脂硬化成分的导电性接合材料，其中所述环氧树脂硬化成分含有具有可与金属粒子表面配位的端基的含硫化合物，含硫化合物进入通过从金属颗粒的表面离解，作为环氧树脂的硬化剂。导电接合材料可能含有香料。

9. 发明申请

US20110049439A1 ELECTRICALLY CONDUCTIVE PASTE, AND ELECTRICAL AND ELECTRONIC DEVICE COMPRISING THE SAME 有权
标题翻译：电导电胶，以及包括其的电气和电子设备
公开(公告)号：US20110049439A1
公开(公告)日：2011-03-03
申请号：US12744994
申请日：2008-11-21
申请人： Takayuki Higuchi , Hidenori Miyakawa , Atsushi Yamaguchi , Arata Kishi , Naomichi Ohashi
发明人： Takayuki Higuchi , Hidenori Miyakawa , Atsushi Yamaguchi , Arata Kishi , Naomichi Ohashi
IPC分类号： H01B1/22 , H05K3/30
CPC分类号： H05K3/321 , H01B1/22 , H05K2201/0272 , H05K2203/0425 , Y10T29/49128 , Y10T29/4913
摘要： Disclosed is an electrically conductive paste which enables to reduce the level of void growth in a conducting pathway formed in a joint part produced after curing the electrically conductive paste in the implementation of an electronic component on a circuit board by using the electrically conductive paste, and which contains a reduced amount of a viscosity-adjusting/thixotropy-imparting additive. Two Sn-containing low-melting-point alloy particles having different melting points and different average particle diameters are selected as electrically conductive filler components to be used in an electrically conductive paste, and the two alloy particles are mixed at a predetermined ratio for use.
摘要翻译：公开了一种导电性糊剂，其能够通过使用导电性糊料，在电路板的电子部件的实施中使导电性糊剂固化后的接合部中形成的导电路径中的空隙生长水平降低，其含有减少量的粘度调节/触变性添加剂。选择具有不同熔点和不同平均粒径的两种含Sn的低熔点合金颗粒作为用于导电浆料的导电填料组分，并将两种合金颗粒以预定的比例混合使用。

10. 发明授权

US08663383B2 Expansive material and its preparation process 有权
标题翻译：膨胀材料及其制备工艺
公开(公告)号：US08663383B2
公开(公告)日：2014-03-04
申请号：US13261027
申请日：2010-05-20
申请人： Takayuki Higuchi , Taiichiro Mori , Hideaki Ishida , Ryoetsu Yoshino , Minoru Morioka
发明人： Takayuki Higuchi , Taiichiro Mori , Hideaki Ishida , Ryoetsu Yoshino , Minoru Morioka
IPC分类号： C04B2/02
CPC分类号： C04B40/0039 , C04B38/02 , Y02P40/18 , C04B7/02 , C04B22/064 , C04B22/143 , C04B40/0082 , C04B40/0231
摘要： The invention provides an expansive material that allows for large expansion of concrete at a material age of 2 to 7 days after pouring and permits concrete to have higher initial compressive strength and makes sure good storage stability, and a process for preparing that expansive material.The invention provides an expansive material and a process for preparing that expansive material, characterized in that clinker or pulverized clinker containing free lime, a hydraulic compound and calcium sulfate anhydrite is heat treated in a carbon dioxide gas atmosphere to form calcium carbonate in it. Preferably, the expansive material contains a particle in which the free lime, hydraulic compound, calcium sulfate anhydrite and calcium carbonate are all present; the content of calcium carbonate is 0.5 to 10% by mass; and the expansive material has a Blaine's specific surface area of 1,500 to 90,000 cm2/g. The expansive material is blended with cement into a cement composition. The preparation conditions are preferably a carbon dioxide gas flow rate of 0.01 to 0.1 L/min. and a temperature of 200 to 800° C., under which conditions there is calcium carbonate formed.
摘要翻译：本发明提供了一种膨胀材料，其允许混凝土在浇筑后2至7天的时间内大量膨胀，并允许混凝土具有较高的初始抗压强度并确保良好的储存稳定性，以及制备该膨胀材料的方法。本发明提供了一种膨胀材料和一种制备膨胀材料的方法，其特征在于，在二氧化碳气氛中对含有游离石灰的熟料或粉碎熟料，水硬性化合物和硫酸钙无水石膏进行热处理，以形成碳酸钙。优选地，膨胀材料包含其中存在游离石灰，水硬性化合物，硬脂酸钙和碳酸钙的颗粒; 碳酸钙的含量为0.5〜10质量％膨胀材料的Blaine比表面积为1500〜90,000cm2 / g。膨胀材料与水泥混合成水泥组合物。制备条件优选为0.01〜0.1L / min的二氧化碳气体流量。温度为200〜800℃，在此条件下形成碳酸钙。

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