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JP2012009883A Substrate processing apparatus and device manufacturing method 审中-公开
标题翻译：基板加工设备和设备制造方法
公开(公告)号：JP2012009883A
公开(公告)日：2012-01-12
申请号：JP2011177939
申请日：2011-08-16
申请人： Asml Netherlands Bv , エーエスエムエルネザーランズビー.ブイ.
发明人： VISSER RAIMOND , HENNUS PIETER RENAAT MARIA , FRANCEN JOHANNES HENDRIKS GERTRUDIS , VERHAGEN IRWIN THEODOROS JACOBS
IPC分类号： H01L21/027 , G03F7/20 , H01L21/683
CPC分类号： H01L21/67201 , G03F7/70841
摘要： PROBLEM TO BE SOLVED: To provide an apparatus that can limit temperature effect when a high operation speed is used for a load lock.SOLUTION: A substrate processing apparatus has a vacuum chamber and the load lock for gas removal. The load lock has a support table for supporting a substrate. A cover plate is provided in the load lock and has a lower surface facing an upper surface of the support table. An opening is provided to the lower surface of the cover plate so as to remove gas from above the substrate in a direction substantially perpendicular to the lower surface. As an embodiment, gas removal constitution which has an opening in the upper surface of the support table is provided to initially reduce gas pressure between the upper surface of the support table and the substrate to predetermined pressure lower than simultaneous load lock pressure in the rest of the load lock through the opening. When the load lock pressure in the rest of the load lock is made lower than predetermined, the gas pressure between the upper surface of the support table and the substrate is reduced together with the load lock pressure in the rest of the load lock.
摘要翻译：要解决的问题：提供一种当将高操作速度用于负载锁定时可以限制温度效应的装置。解决方案：基板处理装置具有真空室和用于除气的装载锁。负载锁具有用于支撑基板的支撑台。盖板设置在装载锁中，并且具有面向支撑台的上表面的下表面。在盖板的下表面设置有开口，从而在基板的大致垂直于下表面的方向从基板的上方除去气体。作为一个实施例，提供了在支撑台的上表面具有开口的气体去除构造，以便最初将支撑台的上表面和基板之间的气体压力降低到低于其余部分中的同时的负载锁定压力的预定压力负载通过开口锁定。当负载锁的其余部分的负载锁定压力低于预定值时，支撑台的上表面和基板之间的气体压力与负载锁的其余部分中的负载锁定压力一起减小。版权所有（C）2012，JPO＆INPIT

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